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HCTL-2020#PLC

Broadcom

HCTL-2020#PLC by Broadcom

HCTL-2020#PLC by Broadcom is a CMOS interface IC with 20 terminals in a square chip carrier package. It is designed for industrial applications, featuring a terminal pitch of 1.27mm and J bend terminal form. With surface mount capability and compact dimensions of 9.04mm x 9.04mm x 4.57mm, it offers versatile connectivity solutions in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 1,179 parts In-Stock

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Digiode

USA . 383 parts In-Stock

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Nova Conductors

Japan . 53 parts In-Stock

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QIE Inc.

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Decca Corp

Germany . 1,219 parts In-Stock

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$5.000

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$4.900

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$4.851

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AZTECH Wire

Italy . 715 parts In-Stock

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$14.158

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Continental Prestige Electronics

USA . 4,363 parts In-Stock

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Argo Parts USA

USA . 3,924 parts In-Stock

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Supply Digital

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Bastille Electronics

Australia . 200 parts In-Stock

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Corphita

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Overview

Experience seamless connectivity and enhanced performance with the HCTL-2020#PLC by Broadcom. Manufactured to the highest standards, this interface IC offers unparalleled quality and reliability. Ideal for a variety of applications, this versatile chip carrier package provides customers with innovative solutions for their electronic needs. Trust in Broadcom's expertise and invest in the HCTL-2020#PLC for superior value and unmatched benefits. Elevate your projects with this cutting-edge technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology saves space on the PCB and allows for automated assembly, enhancing efficiency.

Package Shape: SQUARE

Square package shape provides a compact form factor, aiding in space-saving designs.

No. of Terminals: 20

With 20 terminals, this IC offers multiple connection points for versatile applications.

Package Style: CHIP CARRIER

Chip carrier package style offers good thermal performance and protection for the integrated circuits within.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures good solderability and conductivity for reliable connections.

Maximum Seated Height: 4.57 mm

Low seated height enables the IC to be used in slim devices without taking up too much space.

Width: 9.04 mm

Compact width allows for high density PCB layouts and integration into tight spaces.

Length: 9.04 mm

Short length contributes to overall space efficiency in the design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments with varying temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient performance.

Terminal Form: J BEND

J bend terminal form provides secure and stable mounting on the PCB.

Terminal Pitch: 1.27 mm

With a small terminal pitch, this IC allows for high-density mounting and compact PCB design.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit, this IC facilitates communication between different components, making it a versatile and essential part of electronic systems.

Technical Specifications

Other Function Interface ICs HCTL-2020#PLC attributes and parameters. Explore more Other Function Interface ICs devices from Broadcom

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

9.04 mm

No. of Functions:

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

9.04 mm

Trade Compliance

HCTL-2020#PLC Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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