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BCM5320MIPBG

Broadcom

BCM5320MIPBG by Broadcom

TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: RECTANGULAR; Technology: CMOS;

Median Price

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Lifecycle Status

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4

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Flip Electronics (Authorized)

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Digiode

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Vyrian

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Andel Nordic

Denmark . 627 parts In-Stock

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$5.486

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$5.267

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Decca Corp

Germany . 770 parts In-Stock

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$22.000

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$21.560

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AZTECH Wire

Italy . 8,572 parts In-Stock

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$38.910

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$37.370

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$36.620

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$35.890

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Vigor

Singapore . 6,342 parts In-Stock

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Northwest PG Solutions

USA . 3,103 parts In-Stock

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Semicontronic

India . 155 parts In-Stock

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$395.000

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$385.125

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Microchip USA

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Supply Digital

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Native Components

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Corphita

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Technical Specifications

Other Function Telecom Interface ICs BCM5320MIPBG attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Broadcom

Specs

JESD-30 Code:

R-PBGA-B400

No. of Functions:

1

No. of Terminals:

400

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

BCM5320MIPBG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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