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BCM5389KFBG

Broadcom

BCM5389KFBG by Broadcom

BCM5389KFBG by Broadcom is a CMOS technology Telecom IC with 256 terminals in a grid array package. It operates at 1.2V and is designed for telecom circuit applications, featuring a square plastic/epoxy body suitable for surface mount assembly.

Median Price

$34.923

Lifecycle Status

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Avnet

USA . 73 parts In-Stock

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$36.806

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$34.416

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$32.716

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Rochester

USA . 65,907 parts In-Stock

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$33.040

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Digiode

USA . 634 parts In-Stock

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Vyrian

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Component Sense

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Bristol Electronics

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Lantek

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Prism Electronics

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ComSIT Distribution GmbH

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ComSIT USA

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Nova Conductors

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J & M Industries LLC

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$17.151

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$15.607

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$14.064

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Decca Corp

Germany . 72,406 parts In-Stock

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$31.290

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$30.664

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$30.358

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Semicontronic

India . 35,863 parts In-Stock

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$30.508

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Corphita

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Corohmni

South Africa . 245 parts In-Stock

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Vigor

Singapore . 4,369 parts In-Stock

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Microchip USA

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Authorized Procurement Solutions

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Supply Digital

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Glotronic Ltd.

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Alle Elektronik GmbH

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Argo Parts USA

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Continental Prestige Electronics

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Futuretech Components

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RC Electronics

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GreenTree Electronics

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Overview

Unlock seamless connectivity and enhance your telecom systems with the BCM5389KFBG by Broadcom. Known for their top-tier quality and innovation, Broadcom delivers cutting-edge solutions that exceed industry standards. This versatile telecom interface IC offers unmatched reliability and performance in a compact square package, making it ideal for a wide range of applications. Trust Broadcom to provide the value, benefits, and advantages you need to stay ahead in today's fast-paced telecommunications market. Upgrade to the BCM5389KFBG and experience connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the product easy to handle and resistant to damage during handling and operation.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a circuit board, reducing production time and costs.

Package Shape: SQUARE

Square package shape provides a compact design, saving space on the circuit board and allowing for efficient use of available space.

No. of Terminals: 256

Having a high number of terminals allows for versatile connectivity options, enabling the product to interface with a wide range of other components and devices.

Package Style (Meter): GRID ARRAY

Grid array package style offers high density integration of components, leading to improved performance and efficiency of the product.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connection to the circuit board, ensuring reliable performance and stability during operation.

Technology: CMOS

CMOS technology is known for low power consumption and high noise immunity, resulting in energy-efficient operation and reliable signal processing.

Terminal Form: BALL

Ball terminal form enables reliable connections and easy soldering onto the circuit board, ensuring a secure and stable electrical connection.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this product is optimized for efficient data transmission and communication in telecommunications networks.

Nominal Supply Voltage: 1.2 V

Operating at a low nominal supply voltage of 1.2V, this product is energy-efficient and helps to reduce power consumption in telecom systems.

Technical Specifications

Other Function Telecom Interface ICs BCM5389KFBG attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Broadcom

Specs

JESD-30 Code:

S-PBGA-B256

No. of Functions:

1

No. of Terminals:

256

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

BCM5389KFBG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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