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MAX5980AGTJ+

Analog Devices

MAX5980AGTJ+ by Analog Devices

MAX5980AGTJ+ by Analog Devices is a BICMOS telecom IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 105°C, suitable for industrial use. With a nominal voltage of 54V, it is ideal for telecom circuit applications requiring very thin profile components.

Median Price

$9.613

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

MAX5980AGTJ+ by Analog Devices
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 217 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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$9.613

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100

$9.613

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Vyrian

USA . 7,959 parts In-Stock

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Anansix

USA . 2,386 parts In-Stock

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Digiode

USA . 897 parts In-Stock

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Corohmni

South Africa . 66 parts In-Stock

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$9.100

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$9.805

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$9.805

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$9.805

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$9.805

$9.805

$9.805

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MARBEL Systems

Belgium . 677 parts In-Stock

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$13.720

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Texas Native Microelectronics

USA . 100 parts In-Stock

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$15.770

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$14.666

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$13.878

100

$15.770

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$14.666

$13.878

Aztec Data Supply Inc.

USA . 4,452 parts In-Stock

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$15.987

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Kenton Components

USA . 480 parts In-Stock

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$18.924

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$16.653

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$18.924

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$16.653

AZTECH Wire

Italy . 552 parts In-Stock

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$18.960

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Qasali Group International

UK . 1,109 parts In-Stock

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$42.579

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Ampacity Inc.

Singapore . 36 parts In-Stock

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$485.000

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Semicontronic

India . 217 parts In-Stock

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$810.000

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$789.750

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$785.700

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217

$810.000

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Argo Parts USA

USA . 3,804 parts In-Stock

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Microchip USA

USA . 2,175 parts In-Stock

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Corphita

USA . 1,480 parts In-Stock

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Overview

Experience the cutting-edge technology of the MAX5980AGTJ+ by Analog Devices, a top-tier manufacturer known for its high-quality products. This telecom interface IC offers unparalleled reliability and performance in a compact package, making it ideal for a wide range of applications. From telecommunications to industrial automation, this versatile chip carrier with a very thin profile ensures seamless operation even in challenging environments. Trust Analog Devices to deliver innovative solutions that exceed expectations and drive success for your projects. Elevate your designs with the MAX5980AGTJ+ and unlock a world of possibilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Package Shape: SQUARE

Square package shape is often preferred for its compact size and efficient use of PCB space.

No. of Terminals: 32

Having 32 terminals provides flexibility for connecting a variety of components and peripherals.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliability even in harsh operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in a wide range of environments.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and annealing improves durability.

Terminal Position: QUAD

Quad terminal position offers a stable and secure connection for reliable performance.

Maximum Seated Height: 0.8 mm

Low seated height allows for a more compact and streamlined design.

Width: 5 mm

Narrow width enables the product to fit in tight spaces or densely populated PCBs.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reliability during assembly.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in industrial environments with varying temperature conditions.

Technology: BICMOS

BiCMOS technology offers a combination of bipolar and CMOS characteristics, providing high performance and low power consumption.

Nominal Supply Voltage: 54 V

Nominal supply voltage of 54V is suitable for telecom applications, providing the necessary power for proper functionality.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and facilitates miniaturization of the overall product design.

Technical Specifications

Other Function Telecom Interface ICs MAX5980AGTJ+ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

54 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX5980AGTJ+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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