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MAX4890EETJ+T

Analog Devices

MAX4890EETJ+T by Analog Devices

Analog Devices' MAX4890EETJ+T is a 32-terminal network interface chip carrier with a very thin profile. Operating b/w -40 to 85 °C, it's ideal for LAN switching circuits in industrial settings. With a nominal voltage of 3.3V and BICMOS technology, it offers reliable performance in compact square packaging.

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5

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1k+

MAX4890EETJ+T by Analog Devices
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Analog Devices Inc

USA . 2,500 parts In-Stock

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Chip Stock

USA . 15,483 parts In-Stock

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Vyrian

USA . 7,943 parts In-Stock

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Digiode

USA . 1,841 parts In-Stock

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Anansix

USA . 1,289 parts In-Stock

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AZTECH Wire

Italy . 338 parts In-Stock

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$6.762

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MARBEL Systems

Belgium . 4,284 parts In-Stock

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$13.112

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Texas Native Microelectronics

USA . 441 parts In-Stock

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$15.071

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$14.468

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$14.016

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$13.262

441

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Kenton Components

USA . 3,867 parts In-Stock

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$18.085

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$15.915

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Qasali Group International

UK . 4,513 parts In-Stock

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$40.692

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Semicontronic

India . 224 parts In-Stock

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$127.000

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$123.190

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One Stop Electronics

USA . 2,797 parts In-Stock

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Kepictronics

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Microchip USA

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Glotronic Ltd.

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Corphita

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Authorized Procurement Solutions

USA . 151 parts In-Stock

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Overview

Upgrade your network interfaces with the MAX4890EETJ+T by Analog Devices. Known for their top-quality products, Analog Devices delivers reliable solutions for a wide range of applications. This square-shaped chip carrier offers a very thin profile and matte tin terminal finish, ensuring durability and longevity in industrial settings. With a nominal supply voltage of 3.3V and quad terminal position, this LAN switching circuit is perfect for high-performance telecom systems. Trust Analog Devices to provide the cutting-edge technology you need for seamless network connectivity.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on printed circuit boards, making this product suitable for high volume production.

Package Shape: SQUARE

The square package shape helps in optimizing board space and allows for efficient placement on the PCB.

No. of Terminals: 32

Having 32 terminals provides sufficient connectivity options for networking applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions without compromising performance.

Telecom IC Type: LAN SWITCHING CIRCUIT

This product is specifically designed for LAN switching applications, ensuring reliable and efficient network performance.

Technical Specifications

Network Interfaces MAX4890EETJ+T attributes and parameters. Explore more Network Interfaces devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX4890EETJ+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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