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MAX4892EETX+T

Analog Devices

MAX4892EETX+T by Analog Devices

Analog Devices' MAX4892EETX+T is a BICMOS LAN switching circuit with 36 terminals in a square chip carrier package. It operates b/w -40 °C to 85°C, with a peak reflow temperature of 260°C for up to 30 seconds. Ideal for industrial applications requiring a nominal voltage of 3.3V and very thin profile design.

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Vyrian

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MARBEL Systems

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Texas Native Microelectronics

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$15.268

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$14.657

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$14.199

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Kenton Components

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Semicontronic

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QUARKTWIN TECHNOLOGY LTD

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Overview

Elevate your network interfaces with the MAX4892EETX+T by Analog Devices, a top-of-the-line solution that guarantees unparalleled quality and reliability. With a focus on cutting-edge technology and innovative design, Analog Devices has established itself as a leader in the industry, delivering high-performance products that exceed expectations. The MAX4892EETX+T is ideal for a wide range of applications, offering customers a seamless experience with its superior features and advanced capabilities. Upgrade your network interfaces today and experience the value and benefits that only Analog Devices can provide.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape provides a compact design that can fit well in tight spaces on the circuit board.

No. of Terminals: 36

With 36 terminals, this network interface can support complex connectivity requirements and allow for versatile configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination offers efficient heat dissipation, compact size, and low profile for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this network interface can withstand harsh environmental conditions and ensure reliable performance.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature makes this product suitable for use in extreme temperature environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and reliability for long-term connectivity.

Terminal Position: QUAD

Quad terminal position offers enhanced stability and robustness for secure connections in high-performance applications.

Maximum Seated Height: 0.8 mm

The low maximum seated height allows for a slim and compact design, ideal for applications with tight space constraints.

Width: 6 mm

At a width of 6mm, this network interface is compact and space-saving, suitable for densely populated PCB designs.

Maximum Time At Peak Reflow Temperature (s): 30

Quick reflow time of 30 seconds minimizes the risk of thermal damage during assembly, ensuring a reliable connection.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this product can withstand high-temperature soldering processes for secure attachment to the PCB.

Length: 6 mm

The length of 6mm allows for a compact and space-efficient design, suitable for applications with limited board real estate.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions, making it suitable for industrial applications.

Technology: BICMOS

BICMOS technology offers a blend of high-performance bipolar and low-power CMOS technologies, providing efficient operation and versatile functionality.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and offers enhanced reliability in long-term usage.

Telecom IC Type: LAN SWITCHING CIRCUIT

LAN switching circuit design ensures efficient data routing and management, making it suitable for networking applications.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, this network interface is compatible with common power sources and offers stability in operation.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density connections and fine-pitch designs, suitable for compact PCB layouts.

Technical Specifications

Network Interfaces MAX4892EETX+T attributes and parameters. Explore more Network Interfaces devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

MAX4892EETX+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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