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MAX3956ETJ+

Analog Devices

MAX3956ETJ+ by Analog Devices

MAX3956ETJ+ by Analog Devices is a 32-terminal ATM/SONET/SDH circuit with BICMOS technology. It operates b/w -40 to 95 °C, suitable for industrial telecom applications. This chip carrier has a square shape, matte tin finish, and nominal voltage of 3.3 V for serial to parallel conversion.

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MAX3956ETJ+ by Analog Devices
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Vyrian

USA . 3,805 parts In-Stock

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Digiode

USA . 1,626 parts In-Stock

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Anansix

USA . 1,137 parts In-Stock

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AZTECH Wire

Italy . 403 parts In-Stock

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$6.147

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403

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MARBEL Systems

Belgium . 415 parts In-Stock

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$10.634

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$10.634

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Texas Native Microelectronics

USA . 272 parts In-Stock

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$12.223

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$11.734

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$11.367

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$10.756

272

$12.223

$11.734

$11.367

$10.756

Kenton Components

USA . 3,219 parts In-Stock

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$14.668

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$12.907

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$14.668

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Qasali Group International

UK . 2,957 parts In-Stock

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$33.002

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$30.692

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$29.042

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Component Stockers USA

USA . 800 parts In-Stock

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$99.990

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Semicontronic

India . 158 parts In-Stock

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$779.000

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$759.525

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$755.630

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One Stop Electronics

USA . 2,012 parts In-Stock

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$827.000

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A-Z Elektronik GmbH

Germany . 6,590 parts In-Stock

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Microchip USA

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Corphita

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Overview

Experience the unmatched quality and reliability of Analog Devices with the MAX3956ETJ+. This cutting-edge ATM/SONET/SDH circuit is designed to meet the demands of modern telecommunications applications, offering seamless integration and exceptional performance. With a compact square package shape, 32 terminals, and a wide temperature range, this industrial-grade converter provides unparalleled value and efficiency. Trust Analog Devices for superior technology that delivers results.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design makes installation easier and reduces the overall size of the product.

Package Shape: SQUARE

Square package shape allows for efficient use of space on a circuit board.

No. of Terminals: 32

Having 32 terminals allows for versatile connectivity options in a variety of applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers efficient heat dissipation and a compact design, ideal for space-constrained environments.

Maximum Operating Temperature: 95 °C

With a high maximum operating temperature, this product can withstand demanding operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance in a wide range of environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of connections and ease of assembly.

Maximum Seated Height: 0.8 mm

Low maximum seated height makes this product suitable for compact designs and space-saving applications.

Width: 5 mm

Narrow width enables high-density packaging on a circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature minimizes thermal stress on components during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reliability during assembly.

Length: 5 mm

Compact length contributes to the overall small footprint of the product.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Technology: BICMOS

BICMOS technology offers a combination of high speed and low power consumption, making this product energy-efficient.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with regulations for hazardous substances.

Telecom IC Type: ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER

This telecom IC type provides versatile functionality for handling ATM, SONET, and SDH circuits efficiently.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3 V is commonly used in many electronic devices, offering compatibility and ease of integration.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density mounting and precise connections on a circuit board.

Technical Specifications

ATM/SONET/SDH Circuits MAX3956ETJ+ attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX3956ETJ+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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