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MAX19707ETM+

Analog Devices

MAX19707ETM+ by Analog Devices

MAX19707ETM+ by Analog Devices is a telecom interface IC with 48 terminals, operating at -40 to 85°C. It has power supplies of 1.8/3.3,3V and a nominal voltage of 3V. This square-shaped chip carrier is ideal for industrial telecom circuits due to its low supply current of 0.035mA and terminal pitch of 0.5mm.

Median Price

$21.352

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

MAX19707ETM+ by Analog Devices
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 325 parts In-Stock

1+ parts

$26.700

100+ parts

-

1k+ parts

$16.970

10k+ parts

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325

$26.700

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$16.970

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Verical

USA . 301 parts In-Stock

1+ parts

-

100+ parts

$16.005

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301

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$16.005

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Distributors (In-Stock)

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Digiode

USA . 3,017 parts In-Stock

1+ parts

$20.416

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3,017

$20.416

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Vyrian

USA . 7,393 parts In-Stock

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7,393

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Anansix

USA . 2,413 parts In-Stock

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2,413

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Chip Stock

USA . 179 parts In-Stock

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179

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Prism Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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MARBEL Systems

Belgium . 4,112 parts In-Stock

1+ parts

$15.538

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4,112

$15.538

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Texas Native Microelectronics

USA . 15,545 parts In-Stock

1+ parts

$17.860

100+ parts

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1k+ parts

$16.610

10k+ parts

$15.717

15,545

$17.860

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$16.610

$15.717

Corphita

USA . 2,689 parts In-Stock

1+ parts

$19.341

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2,689

$19.341

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Component Stockers USA

USA . 1,694 parts In-Stock

1+ parts

$20.670

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1,694

$20.670

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Kenton Components

USA . 12,553 parts In-Stock

1+ parts

$21.432

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$18.860

12,553

$21.432

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$18.860

Semicontronic

India . 110 parts In-Stock

1+ parts

$22.190

100+ parts

$21.635

1k+ parts

$21.524

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110

$22.190

$21.635

$21.524

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Microchip USA

USA . 1,930 parts In-Stock

1+ parts

$47.890

100+ parts

$47.050

1k+ parts

$46.640

10k+ parts

$46.220

1,930

$47.890

$47.050

$46.640

$46.220

Qasali Group International

UK . 4,321 parts In-Stock

1+ parts

$48.222

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4,321

$48.222

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Perfect Parts

USA . 1,919 parts In-Stock

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1,919

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Overview

Unlock seamless connectivity and superior performance with the MAX19707ETM+ by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers cutting-edge telecom interface ICs that guarantee reliability and efficiency. This versatile product is designed for a wide range of applications, ensuring compatibility and ease of use. Experience the value and benefits that this innovative solution brings to your projects, from its compact design to its optimal power supplies. Elevate your telecommunications systems with the MAX19707ETM+ and stay ahead of the game.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for high-volume production.

Package Shape: SQUARE

The square package shape helps optimize space utilization on the PCB, making it ideal for compact designs.

Power Supplies (V): 1.8/3.3,3

Support for multiple power supply voltages provides flexibility in system integration and compatibility with various power sources.

No. of Terminals: 48

A high number of terminals allows for versatile connectivity options and supports complex telecom interface configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The multiple package styles offer options for thermal management and space constraints in different applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions in industrial settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance in cold environments, enhancing the product's versatility.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides excellent solderability and long-term reliability, contributing to the product's durability.

Terminal Position: QUAD

Quad terminal configuration offers efficient routing and signal integrity, improving the overall performance of the telecom interface.

Maximum Seated Height: 0.8 mm

The low maximum seated height allows for compact and slim designs, enabling space-saving integration in tight layouts.

Width: 7 mm

The 7 mm width provides a balance between space efficiency and ease of handling during assembly and installation.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature helps prevent component damage and ensures reliable solder connections during the assembly process.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability meets the industry standard for lead-free soldering processes, ensuring compatibility with modern assembly techniques.

Length: 7 mm

The 7 mm length complements the width dimension, maintaining a compact form factor suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures stable operation in harsh environments with wide temperature variations, making the product reliable for industrial applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces the risk of harmful substances, aligning with modern industry standards.

Maximum Supply Current: 0.035 mA

Low maximum supply current consumption promotes energy efficiency and prolongs battery life in portable or low-power telecom devices.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, ensuring optimal performance and compatibility with telecom systems for seamless integration.

Nominal Supply Voltage: 3 V

3V nominal supply voltage is a common standard in telecom applications, providing voltage stability and compatibility with various devices.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and enables intricate circuit designs, suitable for advanced telecom interface requirements.

Technical Specifications

Other Function Telecom Interface ICs MAX19707ETM+ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3,3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Modems

Maximum Supply Current:

.035 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

MAX19707ETM+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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