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MAX1385AETM+

Analog Devices

MAX1385AETM+ by Analog Devices

Analog Devices' MAX1385AETM+ is a telecom IC with 48 terminals, operating at -40 to 85 °C. It has a supply voltage of 5V and low current draw of 0.0043mA. This square-shaped chip carrier is ideal for telecom circuit applications in industrial settings.

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3

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1k+

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Vyrian

USA . 8,241 parts In-Stock

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Anansix

USA . 2,754 parts In-Stock

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Digiode

USA . 1,665 parts In-Stock

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MARBEL Systems

Belgium . 7,153 parts In-Stock

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$13.790

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Texas Native Microelectronics

USA . 120 parts In-Stock

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$15.850

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$14.740

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$13.948

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$15.850

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$13.948

Kenton Components

USA . 5,261 parts In-Stock

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$19.020

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$16.738

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AZTECH Wire

Italy . 800 parts In-Stock

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$19.202

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Qasali Group International

UK . 8,802 parts In-Stock

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$42.795

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One Stop Electronics

USA . 1,156 parts In-Stock

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$362.000

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Semicontronic

India . 635 parts In-Stock

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$721.000

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$702.975

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$699.370

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Corphita

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Overview

Enhance your telecommunications projects with the MAX1385AETM+ by Analog Devices. Known for their superior quality and reliability, Analog Devices offers top-of-the-line telecom interface ICs that are essential for seamless communication systems. The MAX1385AETM+ is a versatile product with countless applications, providing customers with unmatched value and performance. Say goodbye to technical glitches and hello to smooth operations with this cutting-edge telecom circuit from Analog Devices. Elevate your projects to the next level with the MAX1385AETM+ today!

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and secure mounting of the IC onto a circuit board, saving space and enabling automated assembly processes.

Package Shape: SQUARE

The square package shape provides stability and makes it easier to align the IC during assembly, reducing the chance of errors.

Power Supplies (V): 3/5,5

The ability to use multiple power supply voltages makes this IC versatile and compatible with different systems and applications.

No. of Terminals: 48

Having a higher number of terminals allows for more connectivity options and functionality in the circuit design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles offer flexibility in choosing the best form factor for the specific application requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in a wide range of temperature conditions, increasing the product's usability.

Terminal Position: QUAD

The quad terminal position simplifies the connection of multiple components, improving the overall efficiency of the circuit design.

Maximum Seated Height: 0.8 mm

The low maximum seated height helps in reducing the overall profile of the circuit board, especially in compact devices.

Width: 7 mm

The compact width of the IC makes it suitable for applications where space is limited, without compromising on performance.

Length: 7 mm

The small length of the IC contributes to its overall compact size, which is advantageous in space-constrained designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the IC can operate reliably in demanding industrial environments, making it a robust choice for various applications.

Terminal Form: NO LEAD

The absence of leads simplifies the mounting process and reduces the risk of mechanical failures, enhancing the overall durability of the IC.

Maximum Supply Current: 0.0043 mA

The low maximum supply current results in minimal power consumption, making the IC energy-efficient and suitable for battery-operated devices.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom applications, this IC offers optimized performance and reliability in telecommunications systems.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a standard voltage level, ensuring compatibility with most electronic devices and power sources.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting of components on a circuit board, enabling more functionality in a limited space.

Technical Specifications

Other Function Telecom Interface ICs MAX1385AETM+ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5,5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0043 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

MAX1385AETM+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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