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HMC547LC3TR

Analog Devices

HMC547LC3TR by Analog Devices

Analog Devices' HMC547LC3TR is a SPDT RF switch with 16 terminals, offering 30 dB isolation and 3 dB insertion loss at up to 28 GHz. Its GaAs technology ensures a compression point of 16 dBm, making it ideal for high-frequency applications in the -40°C to +85°C temperature range. The ceramic package and surface mount feature enhance durability and ease of installation.

Median Price

$126.220

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 5,600 parts In-Stock

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$144.250

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$108.190

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$72.130

10k+ parts

$61.820

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$144.250

$108.190

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$61.820

Verical

USA . 5,600 parts In-Stock

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-

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$108.190

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$72.130

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$61.820

5,600

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$108.190

$72.130

$61.820

Distributors (In-Stock)

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Vyrian

USA . 74 parts In-Stock

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$108.190

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Digiode

USA . 466 parts In-Stock

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$155.638

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Nova Conductors

Japan . 500 parts In-Stock

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Chip Stock

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SPM Sales

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Parana Technologies

USA . 3,478 parts In-Stock

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$1.494

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$1.389

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IDEA Electronic Components Group

UK . 1,158 parts In-Stock

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$1.606

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$1.526

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DigiPath Technology Company

USA . 370 parts In-Stock

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$2.505

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$2.405

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$2.505

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Semicontronic

India . 8,005 parts In-Stock

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$61.080

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$59.553

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$59.248

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Corphita

USA . 390 parts In-Stock

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$147.447

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Perfect Parts

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Aranea Global

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Overview

Experience seamless connectivity and unparalleled performance with the HMC547LC3TR by Analog Devices. Crafted with precision and expertise, this RF/Microwave Switch offers a wide range of applications in the telecommunications industry. With its high-quality ceramic packaging and advanced GaAs technology, this SPDT switch guarantees minimal insertion loss and maximum isolation. Whether you're in need of fast switching speeds or reliable signal integrity, this product delivers it all. Trust Analog Devices to provide you with the cutting-edge solutions you need for your next project. Elevate your RF system with the HMC547LC3TR today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal stability and reliability, making the switch suitable for a wide range of operating temperatures.

Compression Point (1 dB): 16 dBm

High compression point allows for handling of high power levels without distortion, ensuring reliable performance in demanding RF/microwave systems.

No. of Terminals: 16

Having 16 terminals provides flexibility in routing signals and allows for complex RF/microwave system designs.

Maximum Operating Temperature: 85 °C

Being able to operate at up to 85°C ensures reliability in high temperature environments.

Minimum Operating Temperature: -40 °C

Ability to operate at temperatures as low as -40°C makes this switch suitable for outdoor and harsh environmental conditions.

Maximum Insertion Loss: 3 dB

Low insertion loss ensures minimal signal degradation when the switch is in the signal path, maintaining overall system performance.

Nominal On Time: 0.006 us

Fast switching time of 0.006 microseconds ensures quick response in changing signal paths, making this switch ideal for high-speed applications.

Technology: GAAS

Gallium arsenide (GaAs) technology offers low noise and high linearity, providing excellent RF performance in various applications.

RF or Microwave Device Type: SPDT

Single-Pole Double-Throw configuration allows for switching between two signal paths, providing flexibility in signal routing and enabling diverse system configurations.

Minimum Isolation: 30 dB

High isolation of 30 dB between the input and output ports ensures minimal signal leakage and prevents interference, maintaining signal integrity in the system.

Mounting Feature: SURFACE MOUNT

Surface mount capability simplifies installation and allows for compact and efficient integration into RF/microwave systems.

Maximum Operating Frequency: 28000 MHz

Support for high operating frequencies up to 28 GHz makes this switch suitable for applications requiring broadband RF/microwave signal handling.

Port Termination: ABSORPTIVE

Absorptive port termination helps in reducing signal reflections and ensuring proper impedance matching, improving overall system performance.

Technical Specifications

RF/Microwave Switches HMC547LC3TR attributes and parameters. Explore more RF/Microwave Switches devices from Analog Devices

Specs

Compression Point (1 dB):

16 dBm

Maximum Insertion Loss:

3 dB

Minimum Isolation:

30 dB

Mounting Feature:

No. of Functions:

1

No. of Terminals:

16

Nominal On Time:

.006 us

Maximum Operating Frequency:

28000 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC16,.12SQ,20

Port Termination:

ABSORPTIVE

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Switches

Technology:

Trade Compliance

HMC547LC3TR RF & Microwave trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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