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ADSP-BF606KBCZ-4

Analog Devices

ADSP-BF606KBCZ-4 by Analog Devices

Analog Devices' ADSP-BF606KBCZ-4 microprocessor features 32-bit architecture, integrated cache, and operates at a max clock frequency of 60 MHz. Ideal for applications requiring low power consumption and fixed-point processing in commercial-grade environments.

Median Price

$38.875

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 1,462 parts In-Stock

1+ parts

$37.310

100+ parts

-

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$22.140

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1,462

$37.310

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$22.140

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DigiKey

USA . 25 parts In-Stock

1+ parts

$40.440

100+ parts

$30.857

1k+ parts

$28.628

10k+ parts

-

25

$40.440

$30.857

$28.628

-

Mouser Electronics

USA . 23 parts In-Stock

1+ parts

$40.440

100+ parts

$29.530

1k+ parts

$28.620

10k+ parts

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23

$40.440

$29.530

$28.620

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Verical

USA . 1,452 parts In-Stock

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-

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$25.071

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$25.071

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Distributors (In-Stock)

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Digiode

USA . 65 parts In-Stock

1+ parts

$27.198

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65

$27.198

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Vyrian

USA . 3,661 parts In-Stock

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3,661

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VNN

France . 1,039 parts In-Stock

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1,039

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Nova Conductors

Japan . 1,000 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 95 parts In-Stock

1+ parts

$24.610

100+ parts

$23.995

1k+ parts

$23.872

10k+ parts

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95

$24.610

$23.995

$23.872

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Ampacity Inc.

Singapore . 53 parts In-Stock

1+ parts

$24.610

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53

$24.610

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Corphita

USA . 932 parts In-Stock

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$25.767

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932

$25.767

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Vigor

Singapore . 8,066 parts In-Stock

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$28.030

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8,066

$28.030

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Parana Technologies

USA . 1,098 parts In-Stock

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$67.191

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$62.487

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1,098

$67.191

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$62.487

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IDEA Electronic Components Group

UK . 204 parts In-Stock

1+ parts

$72.248

100+ parts

$68.636

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204

$72.248

$68.636

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DigiPath Technology Company

USA . 336 parts In-Stock

1+ parts

$112.707

100+ parts

$108.199

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$108.199

336

$112.707

$108.199

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$108.199

Netroflash

USA . 100 parts In-Stock

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100

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

USA . 100 parts In-Stock

1+ parts

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100+ parts

$44.064

1k+ parts

$40.803

10k+ parts

$40.803

100

-

$44.064

$40.803

$40.803

Overview

Experience the cutting-edge technology and exceptional quality of Analog Devices with the ADSP-BF606KBCZ-4 microprocessor. This powerful device offers a wide range of applications in various industries, providing customers with reliability and efficiency like never before. With integrated cache, low power mode, and a maximum clock frequency of 60 MHz, this microprocessor delivers high performance while maintaining a compact design. Trust Analog Devices to elevate your projects to the next level with the ADSP-BF606KBCZ-4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and helps in reducing the overall weight of the product.

Integrated Cache: YES

Integrated cache helps in speeding up data access and improving overall performance of the microprocessor.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for reliable performance and prevents issues related to voltage fluctuations.

Package Shape: SQUARE

Square package shape helps in efficient placement on circuit boards and saves space.

Bit Size: 32

32-bit architecture allows for efficient processing of data and running of applications.

Power Supplies (V): 1.8/3.3

Support for different power supply voltages offers flexibility in various applications.

No. of Terminals: 349

Higher number of terminals allow for more connectivity options and functionalities.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style ensures efficient heat dissipation and ease of soldering during assembly.

Minimum Supply Voltage: 1.19 V

Lower minimum supply voltage helps in reducing power consumption and heat generation.

Maximum Operating Temperature: 70 °C

Higher maximum operating temperature ensures stable performance even in demanding environments.

Minimum Operating Temperature: 0 °C

Lower minimum operating temperature allows for usage in a wide range of temperature conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position ensures easy installation and connection in various systems.

Maximum Seated Height: 1.5 mm

Low seated height allows for compact design and efficient placement in space-constrained systems.

Width: 19 mm

Optimal width dimension ensures compatibility with standard board layouts and reduces integration complexities.

Boundary Scan: YES

Boundary scan feature allows for testing and debugging of the microprocessor during manufacturing and maintenance.

Maximum Clock Frequency: 60 MHz

High maximum clock frequency enables fast processing speeds and quick response times.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures proper soldering and assembly of the microprocessor without overheating.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260C ensures secure and reliable solder joints during the manufacturing process.

Length: 19 mm

Optimal length dimension for easy integration and compatibility with standard board layouts.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions.

Peripheral IC Type: MICROPROCESSOR

Being a microprocessor, this product offers advanced processing capabilities for various applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form ensures secure and reliable connections during installation and usage.

Nominal Supply Voltage: 1.25 V

Stable nominal supply voltage ensures consistent and reliable performance of the microprocessor.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for compact design and efficient use of space on circuit boards.

Format: FIXED POINT

Fixed point format allows for precise mathematical computations and accurate results in processing.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate sensitivity to moisture during storage and handling.

Speed: 400 rpm

High speed of 400 rpm enables quick data processing and efficient performance in various applications.

Low Power Mode: YES

Support for low power mode helps in reducing energy consumption and extending battery life in portable devices.

Technical Specifications

Microprocessors ADSP-BF606KBCZ-4 attributes and parameters. Explore more Microprocessors devices from Analog Devices

Specs

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B349

JESD-609 Code:

e1

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

349

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA349,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Speed:

400 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.19 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

ADSP-BF606KBCZ-4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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