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ADSP-BF542MBBCZ-5M

Analog Devices

ADSP-BF542MBBCZ-5M by Analog Devices

ADSP-BF542MBBCZ-5M by Analog Devices is a 32-bit DSP with 22-bit address bus width, operating at up to 50 MHz. It features low power mode and barrel shifter, making it ideal for industrial applications requiring high-speed digital signal processing in a compact package.

Median Price

$34.941

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 403 parts In-Stock

1+ parts

$32.500

100+ parts

-

1k+ parts

$30.870

10k+ parts

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403

$32.500

-

$30.870

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Verical

USA . 416 parts In-Stock

1+ parts

-

100+ parts

$34.941

1k+ parts

-

10k+ parts

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416

-

$34.941

-

-

Rochester

USA . 29 parts In-Stock

1+ parts

-

100+ parts

$38.580

1k+ parts

$34.520

10k+ parts

$32.490

29

-

$38.580

$34.520

$32.490

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 328 parts In-Stock

1+ parts

$37.278

100+ parts

-

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328

$37.278

-

-

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Vyrian

USA . 5,098 parts In-Stock

1+ parts

-

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5,098

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 566 parts In-Stock

1+ parts

$20.610

100+ parts

-

1k+ parts

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566

$20.610

-

-

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Parana Technologies

USA . 187 parts In-Stock

1+ parts

$20.732

100+ parts

-

1k+ parts

$19.281

10k+ parts

-

187

$20.732

-

$19.281

-

IDEA Electronic Components Group

UK . 2,119 parts In-Stock

1+ parts

$22.293

100+ parts

-

1k+ parts

$21.178

10k+ parts

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2,119

$22.293

-

$21.178

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Semicontronic

India . 45 parts In-Stock

1+ parts

$24.010

100+ parts

$23.410

1k+ parts

$23.290

10k+ parts

-

45

$24.010

$23.410

$23.290

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Vigor

Singapore . 1,489 parts In-Stock

1+ parts

$25.330

100+ parts

-

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1,489

$25.330

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Advanced Electronics

New Zealand . 83 parts In-Stock

1+ parts

$29.701

100+ parts

$27.028

1k+ parts

$24.355

10k+ parts

-

83

$29.701

$27.028

$24.355

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DigiPath Technology Company

USA . 1,453 parts In-Stock

1+ parts

$34.777

100+ parts

$33.386

1k+ parts

-

10k+ parts

$33.386

1,453

$34.777

$33.386

-

$33.386

Corphita

USA . 206 parts In-Stock

1+ parts

$35.316

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206

$35.316

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Corohmni

South Africa . 48 parts In-Stock

1+ parts

$40.130

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48

$40.130

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Northwest PG Solutions

USA . 1,407 parts In-Stock

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1,407

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Perfect Parts

USA . 31 parts In-Stock

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31

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Native Components

USA . 13 parts In-Stock

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Overview

Enhance your digital signal processing capabilities with the ADSP-BF542MBBCZ-5M by Analog Devices. Manufactured with precision and expertise, this DSP delivers top-notch performance for a wide range of applications. From audio and video processing to telecommunications and industrial control systems, this versatile product ensures optimal functionality and efficiency. With its advanced features and reliable design, customers can trust in the quality and value that Analog Devices consistently provides. Upgrade your technology solutions today with the ADSP-BF542MBBCZ-5M and experience unparalleled performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and lightweight, making the product easier to handle and ship.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 1.43 V

This ensures compatibility with a wide range of power sources, offering flexibility in system design.

Address Bus Width: 22

A wider address bus allows for increased memory addressability, enabling the processor to handle more complex tasks and data.

Bit Size: 32

A 32-bit processor can perform operations on larger chunks of data at once, leading to faster processing speeds and improved performance.

Power Supplies (V): 1.2,2.5/3.3

Support for multiple voltage levels ensures compatibility with various power sources, allowing for versatile applications.

No. of Terminals: 400

A higher number of terminals allows for more connectivity options and peripherals to be integrated, enhancing the overall functionality of the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact footprint with high-density interconnects, enabling efficient PCB layout and reducing signal interference.

Minimum Supply Voltage: 1.188 V

A low minimum supply voltage helps in reducing power consumption and heat generation, leading to energy-efficient operation.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliability and performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the product to operate in extreme cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and corrosion resistance, ensuring long-term reliability of the product.

Terminal Position: BOTTOM

Bottom terminal position allows for easier inspection and maintenance of the product, simplifying troubleshooting and repairs.

Maximum Seated Height: 1.7 mm

A low seated height helps in achieving a slim and compact form factor, making the product suitable for space-constrained applications.

Width: 17 mm

Compact width dimension allows for easy integration into tight spaces, contributing to overall system miniaturization.

Boundary Scan: YES

Boundary scan capability helps in debugging and testing of the product during manufacturing, ensuring quality and reliability.

External Data Bus Width: 16

A wider external data bus enables faster data transfer rates, enhancing the performance and efficiency of the product.

Maximum Clock Frequency: 50 MHz

High clock frequency allows for faster processing of instructions, resulting in improved overall system speed and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures proper solder reflow during manufacturing, leading to reliable solder joints and long-term product durability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables robust solder joints, ensuring the product can withstand thermal stress and environmental factors.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for efficient data transfer between different components within the processor, maximizing performance and throughput.

Length: 17 mm

Compact length dimension contributes to a smaller overall footprint, ideal for space-constrained applications where size matters.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in rugged environments with fluctuating temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of various peripheral IC types expands the functionality and versatility of the product, catering to a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: BALL

Ball terminal form provides good solder joint reliability and electrical connectivity, enhancing the overall quality and longevity of the product.

Nominal Supply Voltage: 1.25 V

Stable nominal supply voltage ensures consistent and reliable operation of the product, reducing the risk of performance fluctuations.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for more terminals to be packed into a smaller footprint, maximizing connectivity options and increasing versatility.

Format: FIXED POINT

Fixed-point format offers efficient computation and control capabilities, making the product suitable for real-time signal processing applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product has moderate sensitivity to moisture, requiring proper handling and storage to prevent damage.

Speed: 533 rpm

High speed capability allows for quick data processing and response times, making the product suitable for high-performance applications.

Low Power Mode: YES

Low power mode helps in minimizing energy consumption during idle or low-load operation, improving overall energy efficiency of the product.

Barrel Shifter: YES

The inclusion of a barrel shifter enhances the processor's ability to efficiently perform bitwise operations and data manipulation tasks.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-BF542MBBCZ-5M attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

22

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Speed:

533 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.188 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

ADSP-BF542MBBCZ-5M Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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