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ADSP-21368KBPZ-2A

Analog Devices

ADSP-21368KBPZ-2A by Analog Devices

Analog Devices' ADSP-21368KBPZ-2A is a 32-bit DSP with 24-bit address bus, operating at 55.56 MHz. Ideal for digital signal processing applications, it features a max supply voltage of 1.26 V and package style in grid array format.

Median Price

$47.020

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Rochester

USA . 723 parts In-Stock

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$47.020

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$42.070

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$39.590

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Digiode

USA . 411 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

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Inventory MP

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Bristol Electronics

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Native Components

USA . 860 parts In-Stock

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$0.854

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Northwest PG Solutions

USA . 1,666 parts In-Stock

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$0.940

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Parana Technologies

USA . 1,313 parts In-Stock

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$22.007

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$20.466

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IDEA Electronic Components Group

UK . 843 parts In-Stock

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$23.663

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$22.480

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Corohmni

South Africa . 2,899 parts In-Stock

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DigiPath Technology Company

USA . 702 parts In-Stock

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$35.438

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Semicontronic

India . 353 parts In-Stock

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Corphita

USA . 299 parts In-Stock

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Vigor

Singapore . 723 parts In-Stock

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Component Stockers USA

USA . 784 parts In-Stock

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$50.640

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Microchip USA

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Futuretech Components

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Kepictronics

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Perfect Parts

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Overview

Unlock the power of cutting-edge technology with the ADSP-21368KBPZ-2A from Analog Devices. As a leading manufacturer of Digital Signal Processors (DSPs), Analog Devices delivers unparalleled quality and reliability in every product. Ideal for a wide range of applications, this DSP offers customers value, benefits, and advantages that set it apart from the competition. Experience seamless performance, enhanced functionality, and innovative solutions with the ADSP-21368KBPZ-2A, the ultimate choice for all your signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the DSP, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26 V ensures safe operation and prevents damage to the DSP from voltage spikes.

Address Bus Width: 24

A wider address bus width allows for increased memory addressing capability, enabling the DSP to handle complex algorithms and large data sets more efficiently.

Package Shape: SQUARE

The square package shape facilitates uniform heat dissipation and easy mounting on circuit boards, improving overall system performance and reliability.

Bit Size: 32

A 32-bit architecture allows for high-speed processing and precision in calculations, making the DSP suitable for demanding signal processing tasks.

Power Supplies (V): 1.2,3.3

Multiple power supply options ensure compatibility with various systems and voltage requirements, enhancing the versatility of the DSP.

No. of Terminals: 256

The high number of terminals enables connectivity to a wide range of external components and peripherals, expanding the functionality and capabilities of the DSP.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array and low profile package style offer efficient thermal management and space-saving design, ideal for compact electronic devices.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14 V ensures stable operation and power efficiency within specified voltage limits.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the DSP can reliably function in a wide range of environmental conditions without overheating or performance degradation.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows for reliable performance even in cold environments, making the DSP suitable for various applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable connections and signal integrity.

Terminal Position: BOTTOM

The bottom terminal position allows for a secure and stable connection to the circuit board, preventing signal interference and maintaining consistent performance.

Maximum Seated Height: 1.7 mm

The low maximum seated height enables the DSP to be used in slim and compact devices, without compromising on functionality or performance.

RAM Words: 65536

With a large RAM capacity of 65536 words, the DSP can efficiently store and process data, enabling high-speed multitasking and complex signal processing operations.

Width: 27 mm

The compact width of 27 mm allows for easy integration into space-constrained electronic systems, making the DSP suitable for small form factor applications.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the DSP during production and maintenance, ensuring reliable and accurate performance.

External Data Bus Width: 32

A 32-bit external data bus width enables fast data transfer rates and efficient communication with external devices, improving overall system performance.

Maximum Clock Frequency: 55.56 MHz

A high maximum clock frequency of 55.56 MHz allows for rapid data processing and real-time signal processing capabilities, making the DSP suitable for high-performance applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures reliable solder joints and robust assembly, increasing the durability and longevity of the DSP.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture provides efficient data transfer and processing pathways within the DSP, enhancing performance and reducing latency.

Length: 27 mm

The compact length of 27 mm allows for easy integration into space-constrained electronic systems, making the DSP ideal for compact and portable devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation within standard temperature ranges, making the DSP suitable for commercial and industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type of digital signal processor and others indicates versatile functionality and compatibility with various digital processing tasks, enhancing the DSP's suitability for diverse applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making the DSP energy-efficient and suitable for battery-powered or portable devices.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections to the circuit board, ensuring stable signal transmission and reducing the risk of connectivity issues.

Nominal Supply Voltage: 1.2 V

A nominal supply voltage of 1.2 V ensures stable and efficient power distribution to the DSP, optimizing performance and reliability.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for precise and secure soldering to the circuit board, ensuring reliable connections and signal integrity.

Format: FLOATING POINT

The floating-point format enables high precision and accuracy in mathematical calculations, making the DSP suitable for complex scientific and engineering applications.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures to prevent damage and ensure long-term reliability.

Barrel Shifter: YES

The presence of a barrel shifter allows for efficient and rapid shifting of data within the DSP, enhancing performance in data manipulation and signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-21368KBPZ-2A attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

55.56 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.7 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

ADSP-21368KBPZ-2A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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