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ADSP-21065LKCA-264

Analog Devices

ADSP-21065LKCA-264 by Analog Devices

Analog Devices' ADSP-21065LKCA-264 is a 32-bit DSP with 24-bit address bus, operating at 33.33 MHz. Ideal for digital signal processing applications, it features a max supply voltage of 3.6V and peripheral IC type as DIGITAL SIGNAL PROCESSOR, OTHER.

Median Price

$95.055

Lifecycle Status

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Master Electronics

USA . 11 parts In-Stock

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$125.390

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Rochester

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Digiode

USA . 503 parts In-Stock

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Rapid Electronics

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Cyclops Electronics Ltd

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Bristol Electronics

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Flex Direct, LLC

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Northwest PG Solutions

USA . 954 parts In-Stock

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AZTECH Wire

Italy . 774 parts In-Stock

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Corohmni

South Africa . 285 parts In-Stock

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Advanced Electronics

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Semicontronic

India . 6 parts In-Stock

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Corphita

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Vigor

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Component Stockers USA

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Parana Technologies

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IDEA Electronic Components Group

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DigiPath Technology Company

USA . 1,888 parts In-Stock

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Native Components

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Microchip USA

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Overview

Unlock the power of digital signal processing with the Analog Devices ADSP-21065LKCA-264. Manufactured by industry leader Analog Devices, this DSP offers unparalleled quality and reliability. Ideal for a variety of applications, this product provides customers with exceptional value and benefits. Experience seamless performance and advanced capabilities with the ADSP-21065LKCA-264, setting new standards in digital signal processing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

This higher voltage allows for increased performance and versatility in different applications.

Address Bus Width: 24

A wider address bus allows for larger memory access and more efficient data handling.

Package Shape: SQUARE

The square shape of the package makes it easier to handle and integrate into electronic systems.

Bit Size: 32

A 32-bit architecture offers enhanced processing power and performance for complex digital signal processing tasks.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with standard voltage levels in electronic systems.

No. of Terminals: 196

With 196 terminals, the DSP offers ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and efficient layout for the terminals, maximizing space and connectivity.

Minimum Supply Voltage: 3.13 V

The minimum supply voltage of 3.13V ensures stable operation even under varying voltage conditions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the DSP can withstand high heat conditions without compromising performance.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows the DSP to function in cold environments without any issues.

Terminal Finish: Tin/Lead/Silver (Sn/Pb/Ag)

The terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy soldering and integration into PCBs, streamlining the assembly process.

Maximum Seated Height: 1.9 mm

The low profile of 1.9mm ensures a compact form factor and efficient use of space in electronic designs.

RAM Words: 17408

With 17408 RAM words, the DSP has ample memory capacity for storing and processing data efficiently.

Width: 15 mm

The 15mm width of the DSP makes it suitable for compact and space-constrained electronic applications.

Boundary Scan: YES

Boundary scan capability allows for easy debugging and testing during production and maintenance phases.

External Data Bus Width: 32

A 32-bit external data bus ensures fast and efficient data transfer between the DSP and external devices.

Maximum Clock Frequency: 33.33 MHz

The high clock frequency of 33.33MHz enables rapid data processing and real-time signal handling.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and component bonding during assembly.

Peak Reflow Temperature °C: 240

The peak reflow temperature of 240 °C allows for secure and reliable soldering of the DSP on PCBs.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and processing efficiency within the DSP for optimal performance.

Length: 15 mm

The 15mm length of the DSP contributes to its compact design and suitability for small electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

This specific type of peripheral IC enables the DSP to handle a variety of digital signal processing tasks effectively.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections for interfacing the DSP with other components and peripherals.

Maximum Supply Current: 510 mA

The maximum supply current of 510mA ensures stable and consistent power delivery to the DSP for reliable operation.

Nominal Supply Voltage: 3.3 V

The nominal 3.3V supply voltage meets standard power requirements and ensures compatibility with most electronic systems.

Terminal Pitch: 1 mm

The 1mm terminal pitch facilitates easy soldering and PCB integration, enhancing the overall assembly process.

Format: FLOATING POINT

Floating-point format allows for precise and accurate mathematical calculations, making the DSP suitable for complex computations.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the DSP can withstand moderate exposure to moisture during storage and handling.

Barrel Shifter: YES

The barrel shifter feature enhances the DSP's ability to perform complex data manipulation tasks efficiently and effectively.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-21065LKCA-264 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

33.33 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e0

Length:

15 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA196,14X14,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

240

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

17408

Maximum Seated Height:

1.9 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

510 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead/Silver (Sn/Pb/Ag)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

ADSP-21065LKCA-264 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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