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AD6684BCPZ-500

Analog Devices

AD6684BCPZ-500 by Analog Devices

AD6684BCPZ-500 by Analog Devices is a 72-terminal telecom IC with matte tin finish. It features a 0.975V nominal voltage, quad terminal position, and 0.5mm pitch. This square-shaped chip carrier is ideal for telecom circuit applications due to its compact size (10x10mm) and low profile (1mm).

Median Price

$779.610

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 3,834 parts In-Stock

1+ parts

$774.740

100+ parts

-

1k+ parts

$661.550

10k+ parts

-

3,834

$774.740

-

$661.550

-

Verical

USA . 3,843 parts In-Stock

1+ parts

$779.610

100+ parts

-

1k+ parts

-

10k+ parts

-

3,843

$779.610

-

-

-

DigiKey

USA . 1 parts In-Stock

1+ parts

$1,091.260

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$1,091.260

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 399 parts In-Stock

1+ parts

$727.168

100+ parts

-

1k+ parts

-

10k+ parts

-

399

$727.168

-

-

-

Vyrian

USA . 6,776 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,776

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 142 parts In-Stock

1+ parts

$0.800

100+ parts

-

1k+ parts

-

10k+ parts

-

142

$0.800

-

-

-

Northwest PG Solutions

USA . 876 parts In-Stock

1+ parts

$0.880

100+ parts

-

1k+ parts

-

10k+ parts

-

876

$0.880

-

-

-

Parana Technologies

USA . 137 parts In-Stock

1+ parts

$13.590

100+ parts

-

1k+ parts

$12.639

10k+ parts

-

137

$13.590

-

$12.639

-

IDEA Electronic Components Group

UK . 1,554 parts In-Stock

1+ parts

$14.613

100+ parts

$13.882

1k+ parts

$13.882

10k+ parts

-

1,554

$14.613

$13.882

$13.882

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DigiPath Technology Company

USA . 2,211 parts In-Stock

1+ parts

$22.796

100+ parts

$21.884

1k+ parts

-

10k+ parts

$21.884

2,211

$22.796

$21.884

-

$21.884

Semicontronic

India . 1,430 parts In-Stock

1+ parts

$649.910

100+ parts

$633.662

1k+ parts

$630.413

10k+ parts

-

1,430

$649.910

$633.662

$630.413

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Ampacity Inc.

Singapore . 1,793 parts In-Stock

1+ parts

$652.740

100+ parts

-

1k+ parts

-

10k+ parts

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1,793

$652.740

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-

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Corphita

USA . 679 parts In-Stock

1+ parts

$688.896

100+ parts

-

1k+ parts

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10k+ parts

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679

$688.896

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Lixinc

USA . 19,361 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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19,361

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A-Z Elektronik GmbH

Germany . 488 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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488

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Overview

Elevate your telecom interface experience with the AD6684BCPZ-500 by Analog Devices. Known for their top-notch quality and reliability, Analog Devices delivers once again with this advanced telecom IC. Perfect for a variety of applications, this product offers unmatched value and benefits to customers. Say goodbye to compromise and hello to seamless performance with the AD6684BCPZ-500. Trust in Analog Devices to provide you with the cutting-edge technology you need to stay ahead in today's fast-paced world.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for large-scale manufacturing.

Package Shape: SQUARE

The square package shape helps optimize space on the PCB layout, allowing for compact and efficient design.

No. of Terminals: 72

With a higher number of terminals, this product provides versatility in connectivity options and can support advanced telecom interface functions.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design enhances thermal management and offers a compact form factor for tight spaces.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections for long-term performance.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a slim profile, ideal for applications where space is limited or height constraints exist.

Width: 10 mm

The 10mm width contributes to the compact design of the product, making it easier to integrate into various telecom interface systems.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds at peak temperature ensures efficient soldering and prevents damage to sensitive components during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can withstand high-temperature soldering processes, ensuring reliable solder joints.

Length: 10 mm

The 10mm length complements the compact width of the product, offering a balanced form factor for space-conscious applications.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and compliant with RoHS regulations, making this product a sustainable choice for telecom applications.

Telecom IC Type: TELECOM CIRCUIT

As a dedicated telecom circuit interface IC, this product is specifically designed for telecommunications applications, ensuring optimal performance in such systems.

Nominal Supply Voltage: 0.975 V

The low nominal supply voltage of 0.975V enhances energy efficiency and reduces power consumption in telecom interface operations.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for dense terminal spacing, enabling high-density connectivity and supporting complex telecom interface requirements.

Moisture Sensitivity Level (MSL): 3

With an MSL level of 3, this product has moderate sensitivity to moisture, requiring standard precautions during storage and handling to maintain product integrity.

Technical Specifications

Other Function Telecom Interface ICs AD6684BCPZ-500 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

72

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

.975 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

AD6684BCPZ-500 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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