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AD6652BBC

Analog Devices

AD6652BBC by Analog Devices

AD6652BBC by Analog Devices is a 256-terminal IC with CMOS technology. It operates b/w -40 °C to 70°C, suitable for telecom circuits. The package is a square grid array measuring 17mm x 17mm, with surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,409 parts In-Stock

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Digiode

USA . 949 parts In-Stock

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949

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Distributors (Availability)

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AZTECH Wire

Italy . 665 parts In-Stock

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$5.718

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665

$5.718

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Parana Technologies

USA . 4,174 parts In-Stock

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$10.525

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$9.788

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4,174

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$9.788

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IDEA Electronic Components Group

UK . 663 parts In-Stock

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$11.317

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$10.751

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$10.751

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663

$11.317

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$10.751

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Native Components

USA . 763 parts In-Stock

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$16.337

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763

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DigiPath Technology Company

USA . 2,370 parts In-Stock

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$17.655

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$16.948

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$16.948

2,370

$17.655

$16.948

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$16.948

Northwest PG Solutions

USA . 1,641 parts In-Stock

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$17.971

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$16.174

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Component Stockers USA

USA . 740 parts In-Stock

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$99.990

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740

$99.990

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Semicontronic

India . 212 parts In-Stock

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$139.000

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$135.525

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$134.830

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212

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One Stop Electronics

USA . 1,404 parts In-Stock

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$614.000

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Glotronic Ltd.

UK . 3,300 parts In-Stock

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Corphita

USA . 96 parts In-Stock

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Overview

Unlock the power of seamless communication with the AD6652BBC by Analog Devices. As a leader in cutting-edge technology, Analog Devices guarantees top-notch quality and reliability. This telecom interface IC is versatile in its applications, providing unmatched performance and efficiency. Experience the value of streamlined operations and enhanced connectivity with this innovative product. Upgrade your systems today and witness the difference that Analog Devices can make for your business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, ideal for portable telecom devices.

Surface Mount: YES

Surface mount technology enables easy and efficient PCB assembly, saving time and costs.

No. of Terminals: 256

Having 256 terminals allows for a high level of connectivity and functionality in the telecom interface.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand a wide range of environmental conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high performance, making it an efficient choice for telecom applications.

Nominal Supply Voltage: 2.5 V

Operating at a nominal supply voltage of 2.5V, this product is energy-efficient and suitable for telecom devices with low power requirements.

Technical Specifications

Other Function Telecom Interface ICs AD6652BBC attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

240

Qualification:

Not Qualified

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

17 mm

Trade Compliance

AD6652BBC Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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