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AD6624ABC

Analog Devices

AD6624ABC by Analog Devices

AD6624ABC by Analog Devices is a Telecom Interface IC with 196 terminals, operating at -40 to 85°C. It features a package style of Grid Array and Low Profile, with power supplies of 2.5V and 3.3V. Ideal for telecom circuits, this CMOS technology IC has a terminal pitch of 1mm and is suitable for industrial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,101 parts In-Stock

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Digiode

USA . 655 parts In-Stock

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655

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Distributors (Availability)

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Native Components

USA . 208 parts In-Stock

1+ parts

$0.076

100+ parts

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$0.073

208

$0.076

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$0.073

Northwest PG Solutions

USA . 1,841 parts In-Stock

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$0.083

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$0.073

1,841

$0.083

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$0.073

AZTECH Wire

Italy . 874 parts In-Stock

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$7.787

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874

$7.787

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Parana Technologies

USA . 352 parts In-Stock

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$14.437

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$13.427

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352

$14.437

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$13.427

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IDEA Electronic Components Group

UK . 1,028 parts In-Stock

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$15.524

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$14.748

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$14.748

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1,028

$15.524

$14.748

$14.748

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DigiPath Technology Company

USA . 684 parts In-Stock

1+ parts

$24.217

100+ parts

$23.249

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$23.249

684

$24.217

$23.249

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$23.249

Semicontronic

India . 1,009 parts In-Stock

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$55.000

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$53.625

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$53.350

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$55.000

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One Stop Electronics

USA . 663 parts In-Stock

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$873.000

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663

$873.000

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Corphita

USA . 329 parts In-Stock

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Overview

Discover the cutting-edge AD6624ABC by Analog Devices, a top-tier manufacturer known for its superior quality products. This innovative telecom interface IC offers unmatched performance and reliability in a variety of applications. With a focus on customer satisfaction, this product delivers exceptional value with its advanced features and benefits. Experience seamless communication and efficiency with the AD6624ABC, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material offers durability and cost-effectiveness, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Square shape provides a compact form factor, optimizing space utilization in electronic devices.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages provides flexibility in system design and compatibility with different power sources.

No. of Terminals: 196

Large number of terminals allows for connectivity with various external components, expanding the functionality of the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array design with low profile construction enhances thermal performance and overall reliability of the product.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range enables the product to function effectively in both hot and cold environments.

Terminal Finish: TIN LEAD

Tin lead finish provides excellent solderability and electrical conductivity, ensuring secure connections in the assembly process.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, facilitating easier integration into electronic systems.

Maximum Seated Height: 1.5 mm

Low maximum seated height helps reduce overall profile of the product, making it suitable for compact device designs.

Width: 15 mm

Moderate width dimension offers a balanced size for the product, enabling easy handling and placement on PCBs.

Length: 15 mm

Square shape with equal length and width dimensions ensures uniformity in form factor, enhancing overall aesthetics and functionality.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating indicates reliability and robustness, suitable for use in harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing performance efficiency and signal integrity.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and allows for easy rework or replacement if needed.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance and compatibility in telecommunications systems.

Nominal Supply Voltage: 2.5 V

Nominal supply voltage of 2.5V meets standard operating requirements for telecom applications, ensuring consistent and reliable performance.

Terminal Pitch: 1 mm

Fine terminal pitch of 1mm enables high-density packaging and precise electrical connections, improving overall performance and reliability.

Technical Specifications

Other Function Telecom Interface ICs AD6624ABC attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e0

Length:

15 mm

No. of Functions:

1

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

15 mm

Trade Compliance

AD6624ABC Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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