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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type In-System Programmable Organization No. of Outputs Output Function No. of Inputs No. of Macro Cells No. of Product Terms No. of Dedicated Inputs No. of Logic Cells No. of I/O Lines Maximum Clock Frequency Propagation Delay Technology Architecture Sub-Category Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies (V) Maximum Operating Temperature Minimum Operating Temperature Temprature Grade Peak Reflow Temperature Moisture Sensitivity Level (MSL) Maximum Time At Peak Reflow Temperature Package Body Material Package Style (Meter) Package Code Package Shape Package Equivalence Code Width Length Maximum Seated Height Packing Method Terminal Position Terminal Form No. of Terminals Terminal Pitch Terminal Finish JESD-30 Code JESD-609 Code JTAG Boundary Scan Test Qualified Screening Level
XCR3128XL-7CSG144C by Xilinx

XCR3128XL-7CSG144C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XCR3384XL-10FTG256I by Xilinx

XCR3384XL-10FTG256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

384

0

212

102 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3384XL-12FTG256C by Xilinx

XCR3384XL-12FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

384

0

212

83 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3384XL-7FTG256C by Xilinx

XCR3384XL-7FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

384

0

212

135 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3512XL-10FTG256I by Xilinx

XCR3512XL-10FTG256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

97 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3512XL-12FTG256C by Xilinx

XCR3512XL-12FTG256C

Xilinx

Xilinx XCR3512XL-12FTG256C is a 512 macrocell EE PLD with 212 I/O lines, operating at max 77 MHz. It features in-system programmability and JTAG boundary scan test for versatile applications in commercial-grade electronics. The device has a low profile grid array package with 256 terminals, suitable for high-speed digital designs requiring fast propagation delay of 12 ns.

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

77 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3512XL-7FTG256C by Xilinx

XCR3512XL-7FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

135 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3512XL-12FTG256I by Xilinx

XCR3512XL-12FTG256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 212 I/O

Macrocell

512

0

212

77 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3256XL-10FTG256C by Xilinx

XCR3256XL-10FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

105 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3256XL-10FTG256I by Xilinx

XCR3256XL-10FTG256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

105 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3256XL-12FTG256C by Xilinx

XCR3256XL-12FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

88 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3256XL-12FTG256I by Xilinx

XCR3256XL-12FTG256I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

88 MHz

12 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3256XL-7FTG256C by Xilinx

XCR3256XL-7FTG256C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

154 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XCR3512XL-10FGG324I by Xilinx

XCR3512XL-10FGG324I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 260 I/O

Macrocell

512

0

260

97 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,20X20,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No

LC4032ZE-5MN64C by Lattice Semiconductor

LC4032ZE-5MN64C

Lattice Semiconductor

LC4032ZE-5MN64C by Lattice Semiconductor is a 32 macrocell EE PLD with 5.8 ns propagation delay and 149 MHz max clock frequency. Ideal for applications requiring in-system programmability, it features 32 I/O lines, 0.5 mm terminal pitch, and thin profile grid array package style.

EE PLD

Yes

4 Dedicated Inputs, 32 I/O

Macrocell

32

4

32

149 MHz

5.8 ns

CMOS

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.8 V

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA64,8X8,20

5 mm

5 mm

1.1 mm

Bottom

Ball

64

.5 mm

Tin Silver Copper

S-PBGA-B64

e1

Yes

No

LC4128ZE-7MN144C by Lattice Semiconductor

LC4128ZE-7MN144C

Lattice Semiconductor

LC4128ZE-7MN144C by Lattice Semiconductor is a 128 macrocell EE PLD with 96 I/O lines, 7.5 ns propagation delay, and 111 MHz max clock frequency. Ideal for applications requiring in-system programmability and high-speed data processing in compact electronic designs.

EE PLD

Yes

4 Dedicated Inputs, 96 I/O

Macrocell

128

4

96

111 MHz

7.5 ns

CMOS

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.8 V

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,12X12,20

7 mm

7 mm

1.1 mm

Bottom

Ball

144

.5 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

LC4128ZE-7MN144I by Lattice Semiconductor

LC4128ZE-7MN144I

Lattice Semiconductor

LC4128ZE-7MN144I by Lattice Semiconductor is a 128 macrocell EE PLD with 7.5 ns propagation delay, suitable for applications requiring in-system programmability and a max clock frequency of 111 MHz. With 96 I/O lines and JTAG boundary scan test capability, it offers versatile functionality in a compact grid array package.

EE PLD

Yes

4 Dedicated Inputs, 96 I/O

Macrocell

128

4

96

111 MHz

7.5 ns

CMOS

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.8 V

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,12X12,20

7 mm

7 mm

1.1 mm

Bottom

Ball

144

.5 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

LC4256ZE-5MN144C by Lattice Semiconductor

LC4256ZE-5MN144C

Lattice Semiconductor

LC4256ZE-5MN144C by Lattice Semiconductor is a 256 macrocell EE PLD with 108 I/O lines, 5.8 ns propagation delay, and 149 MHz max clock frequency. Ideal for applications requiring in-system programmability and utilizing surface mount technology for compact designs.

EE PLD

Yes

4 Dedicated Inputs, 108 I/O

Macrocell

256

4

108

149 MHz

5.8 ns

CMOS

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.8 V

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,12X12,20

7 mm

7 mm

1.1 mm

Bottom

Ball

144

.5 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

LC4256ZE-7MN144C by Lattice Semiconductor

LC4256ZE-7MN144C

Lattice Semiconductor

LC4256ZE-7MN144C by Lattice Semiconductor is a 256 macrocell EE PLD with 7.5 ns propagation delay and 111 MHz max clock frequency. Ideal for applications requiring in-system programmability, it features a grid array package with thin profile and fine pitch terminals, suitable for high-speed digital designs.

EE PLD

Yes

4 Dedicated Inputs, 108 I/O

Macrocell

256

4

108

111 MHz

7.5 ns

CMOS

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.8 V

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,12X12,20

7 mm

7 mm

1.1 mm

Bottom

Ball

144

.5 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

LC4256ZE-7MN144I by Lattice Semiconductor

LC4256ZE-7MN144I

Lattice Semiconductor

LC4256ZE-7MN144I by Lattice Semiconductor is a 256 macrocell EE PLD with 7.5 ns propagation delay and 111 MHz max clock frequency. Ideal for applications requiring in-system programmability, it features 108 I/O lines, 0.5 mm terminal pitch, and thin profile grid array package style.

EE PLD

Yes

4 Dedicated Inputs, 108 I/O

Macrocell

256

4

108

111 MHz

7.5 ns

CMOS

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.8 V

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,12X12,20

7 mm

7 mm

1.1 mm

Bottom

Ball

144

.5 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XC2C32A-4CP56C by Xilinx

XC2C32A-4CP56C

Xilinx

The Xilinx XC2C32A-4CP56C is a 32 macrocell FLASH PLD with 33 I/O lines, operating at up to 450 MHz. It features a propagation delay of 4 ns and can be in-system programmable. This low-profile, fine-pitch device is ideal for applications requiring fast clock frequencies and high I/O count in commercial temperature environments.

Flash PLD

Yes

33 I/O

Macrocell

32

33

450 MHz

4 ns

CMOS

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Lead

S-PBGA-B56

e0

Yes

No

XC2C32A-4CPG56C by Xilinx

XC2C32A-4CPG56C

Xilinx

The Xilinx XC2C32A-4CPG56C is a 32 macrocell FLASH PLD with 4ns propagation delay, operating at up to 450MHz. It features in-system programmability and JTAG boundary scan testing, suitable for applications requiring fast processing speeds and flexible logic configurations. The device comes in a low profile grid array package with 33 I/O lines and operates within a temperature range of 0-70°C.

Flash PLD

Yes

33 I/O

Macrocell

32

33

450 MHz

4 ns

CMOS

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Silver Copper

S-PBGA-B56

e1

Yes

No

XC2C32A-6CP56C by Xilinx

XC2C32A-6CP56C

Xilinx

XC2C32A-6CP56C by Xilinx is a programmable logic device (PLD) with 32 macro cells. It uses CMOS technology and has a max clock frequency of 300 MHz. This PLD is commonly used for in-system programming and outputting macrocell functions.

Flash PLD

Yes

33 I/O

Macrocell

32

33

300 MHz

6 ns

CMOS

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Lead

S-PBGA-B56

e0

Yes

No

XC2C32A-6CPG56C by Xilinx

XC2C32A-6CPG56C

Xilinx

The Xilinx XC2C32A-6CPG56C is a 32 macrocell FLASH PLD with 6 ns propagation delay, suitable for applications requiring in-system programmability and JTAG boundary scan test. It operates at a max clock frequency of 300 MHz, has 33 I/O lines, and supports a commercial temperature range of 0 to 70°C.

Flash PLD

Yes

33 I/O

Macrocell

32

33

300 MHz

6 ns

CMOS

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Silver Copper

S-PBGA-B56

e1

Yes

No

XC2C32A-6CPG56I by Xilinx

XC2C32A-6CPG56I

Xilinx

XC2C32A-6CPG56I by Xilinx is a 32 macrocell FLASH PLD with 6 ns propagation delay, operating at up to 300 MHz. Ideal for industrial applications, it features in-system programmability, 33 I/O lines, and JTAG boundary scan testing capabilities.

Flash PLD

Yes

33 I/O

Macrocell

32

33

300 MHz

6 ns

CMOS

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Silver Copper

S-PBGA-B56

e1

Yes

No

XC2C64A-5CP56C by Xilinx

XC2C64A-5CP56C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 56; Package Code: LFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 45 I/O

Macrocell

64

0

45

333 MHz

5 ns

CMOS

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Lead

S-PBGA-B56

e0

Yes

No

XC2C64A-5CPG56C by Xilinx

XC2C64A-5CPG56C

Xilinx

XC2C64A-5CPG56C by Xilinx is a 64 macrocell FLASH PLD with 45 I/O lines, operating at 333 MHz. It has a propagation delay of 5 ns and can handle up to 1.9 V supply voltage. Ideal for applications requiring fast processing speeds and high I/O capabilities in commercial-grade environments.

Flash PLD

Yes

0 Dedicated Inputs, 45 I/O

Macrocell

64

0

45

333 MHz

5 ns

CMOS

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Silver Copper

S-PBGA-B56

e1

Yes

No

XC2C64A-7CP56C by Xilinx

XC2C64A-7CP56C

Xilinx

XC2C64A-7CP56C by Xilinx is a 64 macrocell FLASH PLD with 45 I/O lines, operating at up to 200 MHz. It features a propagation delay of 7.5 ns and can be in-system programmable. Ideal for applications requiring low-profile, fine-pitch grid array packages with bottom-positioned terminals.

Flash PLD

Yes

0 Dedicated Inputs, 45 I/O

Macrocell

64

0

45

200 MHz

7.5 ns

CMOS

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Lead

S-PBGA-B56

e0

Yes

No

XC2C64A-7CP56I by Xilinx

XC2C64A-7CP56I

Xilinx

XC2C64A-7CP56I by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, operating at up to 200 MHz. Ideal for industrial applications, it features in-system programmability, 45 I/O lines, and JTAG boundary scan testing capabilities.

Flash PLD

Yes

0 Dedicated Inputs, 45 I/O

Macrocell

64

0

45

200 MHz

7.5 ns

CMOS

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Lead

S-PBGA-B56

e0

Yes

No

XC2C64A-7CPG56I by Xilinx

XC2C64A-7CPG56I

Xilinx

XC2C64A-7CPG56I by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, operating at 200 MHz clock frequency. Ideal for industrial applications, it features in-system programmability and JTAG boundary scan test capability, with a package style of grid array and low profile design.

Flash PLD

Yes

0 Dedicated Inputs, 45 I/O

Macrocell

64

0

45

200 MHz

7.5 ns

CMOS

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Silver Copper

S-PBGA-B56

e1

Yes

No

EPM3128AFC256-10 by Altera

EPM3128AFC256-10

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 98 I/O

Macrocell

128

0

98

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

3.5 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

EPM3128AFC256-5 by Altera

EPM3128AFC256-5

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 98 I/O

Macrocell

128

0

98

5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

3.5 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

EPM3128AFC256-7 by Altera

EPM3128AFC256-7

Altera

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 98 I/O

Macrocell

128

0

98

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

3.5 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

EP20K200CF484C-7N by Altera

EP20K200CF484C-7N

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

4 Dedicated Inputs, 376 I/O

Macrocell

4

376

1.48 ns

2.5

2.375 V

2.625 V

85 °C (185 °F)

0 °C (32 °F)

Other

245 °C (473 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

23 mm

23 mm

2.1 mm

Bottom

Ball

484

1 mm

Tin Silver Copper

S-PBGA-B484

e1

No

EP20K600CB672C8 by Altera

EP20K600CB672C8

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

4 Dedicated Inputs, 508 I/O

Macrocell

4

508

1.78 ns

1.8

1.71 V

1.89 V

85 °C (185 °F)

0 °C (32 °F)

Other

Plastic/Epoxy

Grid Array

BGA

Square

27 mm

27 mm

3.5 mm

Bottom

Ball

672

1 mm

S-PBGA-B672

No

M4A3-384/192-10FANC by Lattice Semiconductor

M4A3-384/192-10FANC

Lattice Semiconductor

M4A3-384/192-10FANC by Lattice Semiconductor is a 384 macrocell EE PLD with 192 I/O lines. It operates at a max clock frequency of 62.5 MHz and has a propagation delay of 10 ns, making it suitable for applications requiring fast processing speeds in programmable logic devices. The device is surface mountable and features a grid array package style, ideal for commercial temperature graded projects needing versatile PLDs with in-system programmability.

EE PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

384

0

192

62.5 MHz

10 ns

CMOS

PAL-TYPE

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

250 °C (482 °F)

3

40 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2.1 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XA2C128-7CPG132I by Xilinx

XA2C128-7CPG132I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 100 I/O

Macrocell

128

0

100

112 MHz

7.5 ns

CMOS

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.1 mm

Bottom

Ball

132

.5 mm

Tin Silver Copper

S-PBGA-B132

e1

Yes

No

AEC-Q100

XA2C128-8CPG132Q by Xilinx

XA2C128-8CPG132Q

Xilinx

FLASH PLD; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 100 I/O

Macrocell

128

0

100

112 MHz

7.5 ns

CMOS

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

125 °C (257 °F)

-40 °C (-40 °F)

Automotive

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.1 mm

Bottom

Ball

132

.5 mm

Tin Silver Copper

S-PBGA-B132

e1

Yes

No

AEC-Q100