Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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XCR3384XL-12FT256I
Xilinx
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
EE PLD
Yes
0 Dedicated Inputs, 212 I/O
Macrocell
384
0
212
83 MHz
12 ns
CMOS
Programmable Logic Devices
3.3
2.7 V
3.6 V
3/3.3 V
85 °C (185 °F)
-40 °C (-40 °F)
Industrial
225 °C (437 °F)
3
30 s
Plastic/Epoxy
Grid Array, Low Profile
LBGA
Square
BGA256,16X16,40
17 mm
1.55 mm
Bottom
Ball
256
1 mm
Tin Lead
S-PBGA-B256
e0
No
XCR3384XL-7FT256C
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
135 MHz
7.5 ns
3 V
3.3 V
70 °C (158 °F)
0 °C (32 °F)
Commercial
EP20K400BC652-2XV
Altera
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 652; Package Code: BGA; Package Shape: SQUARE;
Loadable PLD
4 Dedicated Inputs, 502 I/O
4
502
3.1 ns
2.5
2.375 V
2.625 V
Other
220 °C (428 °F)
Grid Array
BGA
45 mm
3.5 mm
652
1.27 mm
Tin Silver Copper
S-PBGA-B652
e1
CY39100V256B-83BBC
Cypress Semiconductor
CY39100V256B-83BBC by Cypress Semiconductor is a 1536 macrocell LOADABLE PLD with 15ns propagation delay. It operates at 2.5V, has 180 I/O lines, and supports JTAG boundary scan testing. Ideal for applications requiring fast processing speeds and extensive input/output capabilities in commercial-grade environments.
0 Dedicated Inputs, 180 I/O
1536
180
15 ns
Also operates at 3.3 V nominal supply
2.3 V
1.5/3.3,2.5/3.3 V
1.6 mm
CY39100V388B-125MGC
CY39100V388B-125MGC by Cypress: 10ns Propagation Delay, 1536 Macro Cells, CMOS tech. Ideal for PLD applications with 294 I/O lines, JTAG Boundary Scan Test, and In-System Programmable feature.
0 Dedicated Inputs, 294 I/O
294
10 ns
BGA388,26X26,50
35 mm
2.46 mm
388
S-PBGA-B388
XCR3512XL-10FG324C
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
0 Dedicated Inputs, 260 I/O
512
260
97 MHz
BGA324,20X20,40
23 mm
2.5 mm
324
S-PBGA-B324
XCR3512XL-10FG324I
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
XCR3512XL-10FT256C
XCR3512XL-10FT256I
XCR3512XL-7FT256C
Xilinx XCR3512XL-7FT256C is a 512 macrocell EE PLD with 212 I/O lines, operating at max 135 MHz. It features in-system programmability and JTAG boundary scan testing, suitable for applications requiring fast propagation delay of 7.5 ns and low profile grid array packaging.
EPM7064BUC49-7
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 49; Package Code: LFBGA; Package Shape: SQUARE;
0 Dedicated Inputs, 41 I/O
64
41
303 MHz
3.5 ns
1.8/3.3,2.5 V
Grid Array, Low Profile, Fine Pitch
LFBGA
BGA49,7X7,32
7 mm
49
.8 mm
S-PBGA-B49
XA95144XL-15CSG144I
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: BGA; Package Shape: SQUARE;
Flash PLD
0 Dedicated Inputs, 117 I/O
117
15.5 ns
260 °C (500 °F)
12 mm
1.2 mm
144
S-PBGA-B144
XC2C512-7FT256I
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
119 MHz
PLA-TYPE
1.8
1.7 V
1.9 V
1.5/3.3,1.8 V
XC2C512-7FTG256I
XC2C512-7FTG256I by Xilinx is a 512 macrocell FLASH PLD with 212 I/O lines, operating at 119 MHz. It has a propagation delay of 7.5 ns and can handle a max supply voltage of 1.9 V. Ideal for industrial applications requiring high-speed programmable logic devices in compact form factors.
LC4256V-3FTN256BC
Lattice Semiconductor
LC4256V-3FTN256BC by Lattice Semiconductor is a 256 macrocell EE PLD with 164 inputs and 160 I/O lines. Featuring a propagation delay of 3 ns, it operates at a max clock frequency of 212 MHz. Ideal for applications requiring in-system programmability and JTAG boundary scan testing in a compact grid array package.
4 Dedicated Inputs, 160 I/O
160
164
83
212 MHz
3 ns
PAD-TYPE
90 °C (194 °F)
40 s
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
LC4256V-5FTN256AC
LC4256V-5FTN256AC by Lattice Semiconductor is a 3.3V EE PLD with 256 macro cells, 132 inputs, and 128 I/O lines. With a propagation delay of 5ns and max clock frequency of 156MHz, it's ideal for applications requiring fast processing speeds like high-speed data processing and telecommunications systems. The device is surface mountable and features in-system programmability for easy integration into various electronic designs.
4 Dedicated Inputs, 128 I/O
128
132
156 MHz
5 ns
LC4256V-75FTN256AC
LC4256V-75FTN256AC by Lattice Semiconductor is a 3.3V EE PLD with 7.5ns propagation delay, 256 macro cells, and 128 I/O lines. Ideal for applications requiring in-system programmability, it features a max clock frequency of 111MHz and operates b/w 0-90°C.
111 MHz
LC4512V-5FTN256C
LC4512V-5FTN256C by Lattice Semiconductor is a 512 macrocell EE PLD with 212 inputs and 208 I/O lines. It has a propagation delay of 5 ns, max clock frequency of 156 MHz, and operates at temperatures from 0 to 90°C. Ideal for applications requiring programmable logic devices in a grid array package style for low-profile designs.
4 Dedicated Inputs, 208 I/O
208
LC4512V-75FT256C
LC4512V-75FT256C by Lattice Semiconductor is a 3.3V EE PLD with 512 macro cells, 212 inputs, and 7.5ns propagation delay. Ideal for applications requiring high-speed processing and programmable logic functions in a compact GRID ARRAY package with low profile design.
LC4512V-75FTN256C
LC4512V-75FTN256C by Lattice Semiconductor is a 512 macrocell EE PLD with 212 inputs and 208 I/O lines. It has a max clock frequency of 111 MHz and can operate at temperatures up to 90°C. This programmable logic device is suitable for applications requiring high-speed data processing and control.
XCR3256XL-10FT256I
0 Dedicated Inputs, 164 I/O
105 MHz
XCR3256XL-12FT256C
88 MHz
XCR3256XL-12FT256I
XCR3256XL-7FT256C
154 MHz
XCR3384XL-10FG324I
0 Dedicated Inputs, 220 I/O
220
102 MHz
Tin/Lead (Sn63Pb37)
XC9536XL-7CS48I
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;
0 Dedicated Inputs, 36 I/O
36
138.88 MHz
2.5/3.3,3.3 V
240 °C (464 °F)
Grid Array, Fine Pitch
FBGA
BGA48,7X7,32
1.8 mm
48
S-PBGA-B48
EP20K600CF33C7
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1020; Package Code: BGA; Package Shape: SQUARE;
4 Dedicated Inputs, 588 I/O
588
1.48 ns
1.71 V
1.89 V
33 mm
1020
S-PBGA-B1020
EP20K600CF33C8
1.78 ns
EP2A15B724C7
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 724; Package Code: BGA; Package Shape: SQUARE;
492 I/O
480
16640
492
1.69 ns
Field Programmable Gate Arrays
1.5
1.425 V
1.575 V
1.5,1.5/3.3 V
BGA724,27X27,50
724
S-PBGA-B724
EP2A15B724C8
1.94 ns
EP2A15B724C9
2.23 ns
EP2A25B724C8
536 I/O
524
24320
536
EP2A40B724C7
38400
1.55 ns
EP2A40B724C8
EP2A40B724C9
2.05 ns
EP2A70B724C7
67200
2.17 ns
EP2A70B724C8
2.49 ns
EP2A70B724C9
2.87 ns
EP2A70F1508C7
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1508; Package Code: BGA; Package Shape: SQUARE;
1060 I/O
1048
1060
BGA1508,39X39,40
40 mm
1508
S-PBGA-B1508
EP2A70F1508C8
EP2A70F1508C9
XCR3512XL-12FG324I
77 MHz
XCR3512XL-12FT256I
XC2C256-6FT256C
FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
0 Dedicated Inputs, 184 I/O
184
139 MHz
6 ns
Real Digital Design Technology
EP2A40B724I8
LOADABLE PLD; Form Of Terminal: BALL; No. of Terminals: 724; Package Code: HBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 220;
1.7 ns
Grid Array, Heat Sink/Slug
HBGA
EPXA10F1020C1
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1020; Package Code: HBGA; Package Shape: SQUARE;
0 Dedicated Inputs, 711 I/O
711
EPXA10F1020C2
EPXA10F1020C3
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