Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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LC4512V-5FTN256C by Lattice Semiconductor is a 512 macrocell EE PLD with 212 inputs and 208 I/O lines. It has a propagation delay of 5 ns, max clock frequency of 156 MHz, and operates at temperatures from 0 to 90°C. Ideal for applications requiring programmable logic devices in a grid array package style for low-profile designs.
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Low propagation delay ensures fast data processing and response times, making this PLD suitable for applications requiring high-speed performance.
Having a high number of macro cells allows for complex logic functions to be implemented, making this PLD versatile for a wide range of applications.
With a large number of inputs, this PLD can handle multiple input signals efficiently, enabling it to support complex logic operations and data processing.
The high maximum operating temperature of 90°C ensures that this PLD can operate reliably in various environmental conditions, providing flexibility in deployment.
The high maximum clock frequency of 156 MHz enables rapid data processing and execution of logic operations, making this PLD suitable for applications requiring high-speed performance.
Having a large number of outputs allows for the PLD to drive multiple external components and devices, making it suitable for applications requiring extensive output capabilities.
Programmable Logic Devices (PLD) LC4512V-5FTN256C attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Lattice Semiconductor
Programmable IC Type:
In-System Programmable:
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Output Function:
No. of Inputs:
No. of Macro Cells:
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No. of Dedicated Inputs:
No. of I/O Lines:
Maximum Clock Frequency:
Propagation Delay:
Architecture:
Sub-Category:
Nominal Supply Voltage:
Minimum Supply Voltage:
Maximum Supply Voltage:
Power Supplies (V):
Maximum Operating Temperature:
Minimum Operating Temperature:
Peak Reflow Temperature:
Moisture Sensitivity Level (MSL):
Maximum Time At Peak Reflow Temperature:
Package Body Material:
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Width:
Length:
Maximum Seated Height:
Terminal Position:
Terminal Form:
No. of Terminals:
Terminal Pitch:
Terminal Finish:
JESD-30 Code:
JESD-609 Code:
JTAG Boundary Scan Test:
Qualified:
LC4512V-5FTN256C Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Top Mark Format Change 20/Dec/2023
PCN Packaging - All Dev Pkg Mark Chg 12/Nov/2018
Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
BAV99
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
Hitano Enterprise
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
BSS138
Vishay Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Package Shape: RECTANGULAR; Transistor Application: SWITCHING;
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
1N4148
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
SS14
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
FDC5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.6 W; Transistor Application: SWITCHING; Maximum Drain Current (ID): 3 A;
1N4148WS
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
261
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
2N2222A
General Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Qualification: Not Qualified; Additional Features: LOW THRESHOLD; Minimum DS Breakdown Voltage: 60 V;
ATF16V8BQL-15PU
Atmel
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
M4A5-96/48-7VNC
Lattice Semiconductor
M4A5-96/48-7VNC by Lattice Semiconductor is a PLD with 96 macro cells, 48 I/O lines, and 7.5 ns propagation delay. It uses CMOS technology and is in-system programmable, making it ideal for applications requiring high clock frequencies up to 76.9 MHz. The device comes in a square plastic/epoxy package with gull wing terminals and operates within a temperature range of 0 to 70°C.
ATF1504ASVL-20JI44
Atmel ATF1504ASVL-20JI44 is a 64 macrocell EE PLD with 20ns propagation delay, operating at max 3.6V. Ideal for industrial applications, it offers in-system programmability, JTAG boundary scan test, and 32 I/O lines for versatile functionality.
XCR3256XL-10TQG144I
Xilinx
Xilinx XCR3256XL-10TQG144I is a 256 macrocell EE PLD with 120 I/O lines, operating at max 105 MHz. It has a propagation delay of 10 ns and supports in-system programmability. Ideal for industrial applications requiring high-speed processing within the temperature range of -40 to 85°C.
ATF16V8B-10JU
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE;
XC9572XL-7VQ44I
Xilinx XC9572XL-7VQ44I is a 72 macrocell FLASH PLD with 34 I/O lines. It operates at a max clock frequency of 125 MHz, with propagation delay of 7.5 ns. Ideal for industrial applications requiring in-system programmable logic devices.
PAL16R4AMFKB
Texas Instruments
PAL16R4AMFKB by Texas Instruments is a TTL-based PLD with 30 ns propagation delay, 64 product terms, and 25 MHz clock frequency. Ideal for military applications due to its MIL-graded temperature range, it features 8 dedicated inputs and 4 I/O lines in a square chip carrier package.
EPF6024AQC240-2N
Intel
Intel's EPF6024AQC240-2N is a PLD with 1960 logic cells, 199 inputs/outputs, and 153 MHz clock frequency. It operates at 3.3V, CMOS technology, suitable for applications requiring high-speed processing in compact designs like consumer electronics or industrial control systems.
LC4064V-75TN100C
LC4064V-75TN100C by Lattice Semiconductor is a 3.3V EE PLD with 64 I/O lines, 7.5ns propagation delay, and 111MHz max clock frequency. Ideal for applications requiring in-system programmability, such as digital signal processing and control systems due to its low profile flatpack package style.
EPM1270F256A5N
The Intel EPM1270F256A5N is a FLASH PLD with 980 macro cells, 212 inputs/outputs, and 10 ns propagation delay. It is a CMOS technology-based programmable logic device suitable for automotive applications due to its JTAG boundary scan test capability and wide operating temperature range (-40°C to 125°C).
EPF10K50VRI240-4N
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;
LC4256V-75TN100E
LC4256V-75TN100E by Lattice Semiconductor is a 256 macrocell EE PLD with 7.5 ns propagation delay, 74 inputs, and 64 I/O lines. It operates at a max clock frequency of 111 MHz and is in-system programmable for applications requiring high-speed processing and flexibility in automotive environments.
5M240ZT144C5N
The Intel 5M240ZT144C5N is a FLASH PLD with 192 macro cells, 114 inputs/outputs, and a max clock frequency of 118.3 MHz. Ideal for applications requiring fast propagation delay of 17.7 ns, such as high-speed digital circuit designs or signal processing systems. Its CMOS technology and in-system programmability make it versatile for various electronic projects.
EPM570ZM256C6N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR;
ATF1504BE-7AU100
Microchip Technology
Microchip Technology's ATF1504BE-7AU100 is a 100-terminal PLD with 7.5ns propagation delay, suitable for industrial applications. Featuring CMOS technology and a max supply voltage of 1.9V, it offers 64 I/O lines and operates b/w -40 to 85°C. Ideal for designs requiring fast response times in compact form factors.
5M240ZM100C5N
Intel's 5M240ZM100C5N is a PLD with 192 macro cells, 79 I/O lines, and 118.3 MHz clock frequency. It uses CMOS technology, has in-system programmability, and supports JTAG boundary scan testing. Ideal for applications requiring fast processing speeds and high input/output capabilities.
EPM240ZM100C6N
Intel's EPM240ZM100C6N is a 192 macrocell FLASH PLD with 80 inputs/outputs, 7.9 ns propagation delay, and operates at temperatures up to 85°C. Ideal for applications requiring in-system programmability, it features a grid array package with 0.5 mm terminal pitch and JTAG boundary scan test capability.
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;
EPF10K50RC240-3N
EPF10K50RC240-3N by Intel is a PLD with 2880 logic cells, 0.6 ns propagation delay, and 66.67 MHz max clock frequency. Ideal for applications requiring high-speed data processing and complex logic operations in commercial-grade environments.
XC2C384-10TQ144I
XC2C384-10TQ144I by Xilinx is a 384 macrocell FLASH PLD with 118 I/O lines, operating at 83 MHz. It features a propagation delay of 10 ns and can be used in industrial applications requiring programmable logic devices with in-system programmability.
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LC4512V-75FTN256C
LC4512V-75FTN256C by Lattice Semiconductor is a 512 macrocell EE PLD with 212 inputs and 208 I/O lines. It has a max clock frequency of 111 MHz and can operate at temperatures up to 90°C. This programmable logic device is suitable for applications requiring high-speed data processing and control.
LC4512V-75TN176C
EE PLD; Form Of Terminal: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
LC4512V-10TN176I
EE PLD; Form Of Terminal: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; No. of Inputs: 132;
LC4512V-75FT256C
EE PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;
LC4512V-10FTN256I
EE PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Output Function: MACROCELL;
LC4512V-35FT256C
EE PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Qualification: Not Qualified;
LC4512V-5FT256C
EE PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Maximum Supply Voltage: 3.6 V;
LC4512V-5FT256I
EE PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; No. of Macro Cells: 512;
LC4512V-5FTN256I
EE PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel;
LC4512V-75FT256I
EE PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Propagation Delay: 7.5 ns;
LC4512V-75FTN256I
EE PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; In-System Programmable: YES;
LC4512V-35F256C
EE PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 90 Cel;
LC4512V-5F256C
EE PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Lead (Sn63Pb37);
LC4512V-5F256I
EE PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Macro Cells: 512;
LC4512V-75F256I
EE PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Output Function: MACROCELL;
LC4512V-35FN256C
EE PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;
LC4512V-5FN256C
EE PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
LC4512V-5FN256I
EE PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Architecture: PAD-TYPE;
LC4512V-75FN256C
EE PLD; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 3.3;
LC4512V-75FN256I
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