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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type In-System Programmable Organization No. of Outputs Output Function No. of Inputs No. of Macro Cells No. of Product Terms No. of Dedicated Inputs No. of Logic Cells No. of I/O Lines Maximum Clock Frequency Propagation Delay Technology Architecture Sub-Category Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies (V) Maximum Operating Temperature Minimum Operating Temperature Temprature Grade Peak Reflow Temperature Moisture Sensitivity Level (MSL) Maximum Time At Peak Reflow Temperature Package Body Material Package Style (Meter) Package Code Package Shape Package Equivalence Code Width Length Maximum Seated Height Packing Method Terminal Position Terminal Form No. of Terminals Terminal Pitch Terminal Finish JESD-30 Code JESD-609 Code JTAG Boundary Scan Test Qualified Screening Level
XC2C512-10FGG324C by Xilinx

XC2C512-10FGG324C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No

XC2C512-10FGG324I by Xilinx

XC2C512-10FGG324I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No

XC2C512-10FTG256C by Xilinx

XC2C512-10FTG256C

Xilinx

The Xilinx XC2C512-10FTG256C is a 512 macrocell FLASH PLD with 212 I/O lines, operating at up to 91 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for applications requiring fast processing speeds and high I/O capabilities in commercial-grade environments.

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

512

0

212

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC2C512-10FTG256I by Xilinx

XC2C512-10FTG256I

Xilinx

Xilinx XC2C512-10FTG256I is a 512 macrocell FLASH PLD with 212 I/O lines, operating at max 91 MHz. It features a propagation delay of 10 ns and supports JTAG boundary scan testing. Ideal for industrial applications requiring fast processing speeds and extensive I/O capabilities in a compact grid array package.

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

512

0

212

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC2C512-7FGG324C by Xilinx

XC2C512-7FGG324C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

119 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No

XC95144XL-10CSG144C by Xilinx

XC95144XL-10CSG144C

Xilinx

XC95144XL-10CSG144C by Xilinx is a programmable logic device (PLD) with 144 macro cells and 117 inputs/outputs. It operates on a max supply voltage of 3.6V and has a propagation delay of 10ns. This PLD is commonly used for in-system programming and outputting macrocell functions at a max clock frequency of 138.88MHz.

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XC95144XL-10CSG144I by Xilinx

XC95144XL-10CSG144I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XC95144XL-5CSG144C by Xilinx

XC95144XL-5CSG144C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XC95144XL-7CSG144C by Xilinx

XC95144XL-7CSG144C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XC95144XL-7CSG144I by Xilinx

XC95144XL-7CSG144I

Xilinx

The Xilinx XC95144XL-7CSG144I is a FLASH PLD with 117 I/O lines, 144 macro cells, and a max clock frequency of 138.88 MHz. It is used for programmable logic applications requiring in-system programmability and JTAG boundary scan testing in industrial environments.

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XC95288XL-10BGG256C by Xilinx

XC95288XL-10BGG256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,20X20,50

27 mm

27 mm

2.55 mm

Bottom

Ball

256

1.27 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-10BGG256I by Xilinx

XC95288XL-10BGG256I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,20X20,50

27 mm

27 mm

2.55 mm

Bottom

Ball

256

1.27 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-10CSG280C by Xilinx

XC95288XL-10CSG280C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Silver Copper

S-PBGA-B280

e1

Yes

No

XC95288XL-10CSG280I by Xilinx

XC95288XL-10CSG280I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Silver Copper

S-PBGA-B280

e1

Yes

No

XC95288XL-10FGG256C by Xilinx

XC95288XL-10FGG256C

Xilinx

The Xilinx XC95288XL-10FGG256C is a 288 macrocell FLASH PLD with 192 inputs/outputs, operating at up to 100 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for applications requiring high-speed processing and flexibility in programmable logic design.

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-10FGG256I by Xilinx

XC95288XL-10FGG256I

Xilinx

The Xilinx XC95288XL-10FGG256I is a FLASH PLD with 288 macro cells, 192 inputs/outputs, and 100 MHz clock frequency. It is ideal for industrial applications requiring in-system programmability, JTAG boundary scan testing, and a wide operating temperature range from -40 to 85°C.

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

100 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-6BGG256C by Xilinx

XC95288XL-6BGG256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

208.3 MHz

6 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,20X20,50

27 mm

27 mm

2.55 mm

Bottom

Ball

256

1.27 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-6FGG256C by Xilinx

XC95288XL-6FGG256C

Xilinx

The Xilinx XC95288XL-6FGG256C is a FLASH PLD with 288 macro cells, 192 inputs/outputs, and a max clock frequency of 208.3 MHz. It is ideal for applications requiring fast propagation delay of 6 ns, such as high-speed digital signal processing and communication systems. The device features in-system programmability and JTAG boundary scan test capabilities for efficient development and testing processes.

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

208.3 MHz

6 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-7BGG256C by Xilinx

XC95288XL-7BGG256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,20X20,50

27 mm

27 mm

2.55 mm

Bottom

Ball

256

1.27 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-7BGG256I by Xilinx

XC95288XL-7BGG256I

Xilinx

XC95288XL-7BGG256I by Xilinx is a 288 macrocell FLASH PLD with 192 inputs/outputs, operating at 125 MHz. It features a propagation delay of 7.5 ns and can be in-system programmable. Ideal for industrial applications requiring high-speed processing and versatile I/O capabilities.

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,20X20,50

27 mm

27 mm

2.55 mm

Bottom

Ball

256

1.27 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-7CSG280C by Xilinx

XC95288XL-7CSG280C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Silver Copper

S-PBGA-B280

e1

Yes

No

XC95288XL-7CSG280I by Xilinx

XC95288XL-7CSG280I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Silver Copper

S-PBGA-B280

e1

Yes

No

XC95288XL-7FGG256C by Xilinx

XC95288XL-7FGG256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC95288XL-7FGG256I by Xilinx

XC95288XL-7FGG256I

Xilinx

The Xilinx XC95288XL-7FGG256I is a FLASH PLD with 288 macro cells, 192 inputs/outputs, and a max clock frequency of 125 MHz. It is ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing. The device operates at temperatures ranging from -40 to 85°C, making it suitable for various industrial environments.

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC9536XL-10CSG48I by Xilinx

XC9536XL-10CSG48I

Xilinx

Xilinx XC9536XL-10CSG48I is a 36 macrocell FLASH PLD with 10ns propagation delay and 138.88MHz clock frequency. Ideal for industrial applications, it offers in-system programmability, JTAG boundary scan test, and operates b/w -40 to 85°C.

Flash PLD

Yes

0 Dedicated Inputs, 36 I/O

36

Macrocell

36

36

0

36

138.88 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XC9536XL-5CSG48C by Xilinx

XC9536XL-5CSG48C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 36 I/O

36

Macrocell

36

36

0

36

138.88 MHz

5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XC9536XL-7CSG48I by Xilinx

XC9536XL-7CSG48I

Xilinx

The Xilinx XC9536XL-7CSG48I is a 36 macrocell FLASH PLD with 7.5 ns propagation delay and 138.88 MHz max clock frequency. Ideal for industrial applications, it features in-system programmability, JTAG boundary scan test, and operates at temperatures ranging from -40 to 85°C.

Flash PLD

Yes

0 Dedicated Inputs, 36 I/O

36

Macrocell

36

36

0

36

138.88 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XC9572XL-10CSG48I by Xilinx

XC9572XL-10CSG48I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 38 I/O

38

Macrocell

38

72

0

38

100 MHz

10 ns

CMOS

Programmable Logic Devices

72 Macrocells

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XC9572XL-5CSG48C by Xilinx

XC9572XL-5CSG48C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 38 I/O

38

Macrocell

38

72

0

38

178.6 MHz

5 ns

CMOS

Programmable Logic Devices

72 Macrocells

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XC9572XL-7CSG48C by Xilinx

XC9572XL-7CSG48C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 38 I/O

38

Macrocell

38

72

0

38

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

72 Macrocells

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XC9572XL-7CSG48I by Xilinx

XC9572XL-7CSG48I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 38 I/O

38

Macrocell

38

72

0

38

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

72 Macrocells

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XCR3064XL-10CPG56C by Xilinx

XCR3064XL-10CPG56C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 56; Package Code: LFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 48 I/O

Macrocell

64

0

48

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Silver Copper

S-PBGA-B56

e1

Yes

No

XCR3064XL-10CPG56I by Xilinx

XCR3064XL-10CPG56I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 56; Package Code: LFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 48 I/O

Macrocell

64

0

48

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Silver Copper

S-PBGA-B56

e1

Yes

No

XCR3064XL-7CPG56I by Xilinx

XCR3064XL-7CPG56I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 56; Package Code: LFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 48 I/O

Macrocell

64

0

48

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Silver Copper

S-PBGA-B56

e1

Yes

No

XCR3064XL-6CPG56C by Xilinx

XCR3064XL-6CPG56C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 56; Package Code: LFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 48 I/O

Macrocell

64

0

48

192 MHz

6 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin Silver Copper

S-PBGA-B56

e1

Yes

No

XCR3064XL-10CSG48I by Xilinx

XCR3064XL-10CSG48I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 40 I/O

Macrocell

64

0

40

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XCR3064XL-7CSG48C by Xilinx

XCR3064XL-7CSG48C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 40 I/O

Macrocell

64

0

40

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XCR3064XL-7CSG48I by Xilinx

XCR3064XL-7CSG48I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 40 I/O

Macrocell

64

0

40

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XC95144XV-7CSG144C by Xilinx

XC95144XV-7CSG144C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

Macrocell

144

0

117

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XCR3256XL-10CSG280I by Xilinx

XCR3256XL-10CSG280I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 164 I/O

Macrocell

256

0

164

105 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Silver Copper

S-PBGA-B280

e1

Yes

No

XCR3032XL-10CSG48C by Xilinx

XCR3032XL-10CSG48C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 36 I/O

Macrocell

32

0

36

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,6X8,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XCR3032XL-10CSG48I by Xilinx

XCR3032XL-10CSG48I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 36 I/O

Macrocell

32

0

36

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,6X8,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XCR3032XL-5CSG48C by Xilinx

XCR3032XL-5CSG48C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 36 I/O

Macrocell

32

0

36

213 MHz

5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,6X8,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XCR3032XL-7CSG48I by Xilinx

XCR3032XL-7CSG48I

Xilinx

Xilinx XCR3032XL-7CSG48I is a 32 macrocell EE PLD with 7.5ns propagation delay, operating at max clock frequency of 119MHz. Ideal for industrial applications, it features in-system programmability and JTAG boundary scan test capability.

EE PLD

Yes

0 Dedicated Inputs, 36 I/O

Macrocell

32

0

36

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,6X8,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Silver Copper

S-PBGA-B48

e1

Yes

No

XCR3128XL-10CSG144C by Xilinx

XCR3128XL-10CSG144C

Xilinx

Xilinx XCR3128XL-10CSG144C is a 128 macrocell EE PLD with 10ns propagation delay, operating at 3.3V. Ideal for applications requiring in-system programmability and clock frequencies up to 95MHz. Features include JTAG boundary scan test, 108 I/O lines, and commercial-grade temperature rating.

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XCR3128XL-10CSG144I by Xilinx

XCR3128XL-10CSG144I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

95 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XCR3128XL-7CSG144I by Xilinx

XCR3128XL-7CSG144I

Xilinx

EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

119 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

2.7 V

3.6 V

3/3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No

XCR3128XL-6CSG144C by Xilinx

XCR3128XL-6CSG144C

Xilinx

EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

EE PLD

Yes

0 Dedicated Inputs, 108 I/O

Macrocell

128

0

108

175 MHz

6 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Silver Copper

S-PBGA-B144

e1

Yes

No