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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type In-System Programmable Organization No. of Outputs Output Function No. of Inputs No. of Macro Cells No. of Product Terms No. of Dedicated Inputs No. of Logic Cells No. of I/O Lines Maximum Clock Frequency Propagation Delay Technology Architecture Sub-Category Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies (V) Maximum Operating Temperature Minimum Operating Temperature Temprature Grade Peak Reflow Temperature Moisture Sensitivity Level (MSL) Maximum Time At Peak Reflow Temperature Package Body Material Package Style (Meter) Package Code Package Shape Package Equivalence Code Width Length Maximum Seated Height Packing Method Terminal Position Terminal Form No. of Terminals Terminal Pitch Terminal Finish JESD-30 Code JESD-609 Code JTAG Boundary Scan Test Qualified Screening Level
EPXA1F484C1 by Altera

EPXA1F484C1

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

0 Dedicated Inputs, 186 I/O

Macrocell

0

186

1.8

1.71 V

1.89 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

23 mm

23 mm

2.1 mm

Bottom

Ball

484

1 mm

Tin Lead

S-PBGA-B484

e0

No

EPXA1F484C2 by Altera

EPXA1F484C2

Altera

EPXA1F484C2 by Altera is a 484-terminal PLD with 186 I/O lines. It operates b/w 0-85°C, with a supply voltage range of 1.71-1.89V. Ideal for applications requiring loadable PLDs and macrocell outputs in a square grid array package.

Loadable PLD

0 Dedicated Inputs, 186 I/O

Macrocell

0

186

1.8

1.71 V

1.89 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

23 mm

23 mm

2.1 mm

Bottom

Ball

484

1 mm

Tin Lead

S-PBGA-B484

e0

No

EPXA1F484C3 by Altera

EPXA1F484C3

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

0 Dedicated Inputs, 186 I/O

Macrocell

0

186

1.8

1.71 V

1.89 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

23 mm

23 mm

2.1 mm

Bottom

Ball

484

1 mm

Tin Lead

S-PBGA-B484

e0

No

EPXA1F672C1 by Altera

EPXA1F672C1

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

0 Dedicated Inputs, 246 I/O

Macrocell

0

246

1.8

1.71 V

1.89 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

27 mm

27 mm

2.1 mm

Bottom

Ball

672

1 mm

Tin Lead

S-PBGA-B672

e0

No

EPXA1F672C2 by Altera

EPXA1F672C2

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

0 Dedicated Inputs, 246 I/O

Macrocell

0

246

1.8

1.71 V

1.89 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

27 mm

27 mm

2.1 mm

Bottom

Ball

672

1 mm

Tin Lead

S-PBGA-B672

e0

No

EPXA1F672C3 by Altera

EPXA1F672C3

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

0 Dedicated Inputs, 246 I/O

Macrocell

0

246

1.8

1.71 V

1.89 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

27 mm

27 mm

2.1 mm

Bottom

Ball

672

1 mm

Tin Lead

S-PBGA-B672

e0

No

EPXA4F1020C1 by Altera

EPXA4F1020C1

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1020; Package Code: HBGA; Package Shape: SQUARE;

Loadable PLD

0 Dedicated Inputs, 488 I/O

Macrocell

0

488

1.8

1.71 V

1.89 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array, Heat Sink/Slug

HBGA

Square

33 mm

33 mm

3.5 mm

Bottom

Ball

1020

1 mm

Tin Lead

S-PBGA-B1020

e0

No

EPXA4F1020C2 by Altera

EPXA4F1020C2

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1020; Package Code: HBGA; Package Shape: SQUARE;

Loadable PLD

0 Dedicated Inputs, 488 I/O

Macrocell

0

488

1.8

1.71 V

1.89 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array, Heat Sink/Slug

HBGA

Square

33 mm

33 mm

3.5 mm

Bottom

Ball

1020

1 mm

Tin Lead

S-PBGA-B1020

e0

No

EPXA4F1020C3 by Altera

EPXA4F1020C3

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1020; Package Code: HBGA; Package Shape: SQUARE;

Loadable PLD

0 Dedicated Inputs, 488 I/O

Macrocell

0

488

1.8

1.71 V

1.89 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array, Heat Sink/Slug

HBGA

Square

33 mm

33 mm

3.5 mm

Bottom

Ball

1020

1 mm

Tin Lead

S-PBGA-B1020

e0

No

XC95288XL-7BG256I by Xilinx

XC95288XL-7BG256I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,20X20,50

27 mm

27 mm

2.55 mm

Bottom

Ball

256

1.27 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC95288XL-7CS280I by Xilinx

XC95288XL-7CS280I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 280; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA280,19X19,32

16 mm

16 mm

1.2 mm

Bottom

Ball

280

.8 mm

Tin Lead

S-PBGA-B280

e0

Yes

No

XC95288XL-7FG256I by Xilinx

XC95288XL-7FG256I

Xilinx

The Xilinx XC95288XL-7FG256I is a FLASH PLD with 288 macro cells, 192 inputs/outputs, and 125 MHz clock frequency. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing. Features include a propagation delay of 7.5 ns, operating temperature range of -40 to 85°C, and a compact square package design.

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

192

Macrocell

192

288

0

192

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC9572XL-5CS48C by Xilinx

XC9572XL-5CS48C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 38 I/O

38

Macrocell

38

72

0

38

178.6 MHz

5 ns

CMOS

Programmable Logic Devices

72 Macrocells

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Lead

S-PBGA-B48

e0

Yes

No

XC9572XL-7CS48I by Xilinx

XC9572XL-7CS48I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 48; Package Code: FBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 38 I/O

38

Macrocell

38

72

0

38

125 MHz

7.5 ns

CMOS

Programmable Logic Devices

72 Macrocells

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Fine Pitch

FBGA

Square

BGA48,7X7,32

7 mm

7 mm

1.8 mm

Bottom

Ball

48

.8 mm

Tin Lead

S-PBGA-B48

e0

Yes

No

XC95288XV-6FG256C by Xilinx

XC95288XV-6FG256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 192 I/O

Macrocell

288

0

192

208 MHz

6 ns

CMOS

Programmable Logic Devices

2.5

2.37 V

2.62 V

1.8/3.3,2.5 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2 mm

Bottom

Ball

256

1 mm

Tin/Lead (Sn63Pb37)

S-PBGA-B256

e0

Yes

No

XC95144XL-10CS144C by Xilinx

XC95144XL-10CS144C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Lead

S-PBGA-B144

e0

Yes

No

XC95144XL-10CS144I by Xilinx

XC95144XL-10CS144I

Xilinx

The Xilinx XC95144XL-10CS144I is a 3.3V FLASH PLD with 117 I/O lines, 144 macro cells, and a max clock frequency of 138.88 MHz. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing in a compact grid array package.

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

10 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Lead

S-PBGA-B144

e0

Yes

No

XC95144XL-5CS144C by Xilinx

XC95144XL-5CS144C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Lead

S-PBGA-B144

e0

Yes

No

XC95144XL-7CS144I by Xilinx

XC95144XL-7CS144I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 117 I/O

117

Macrocell

117

144

0

117

138.88 MHz

7.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

2.5/3.3,3.3 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA144,13X13,32

12 mm

12 mm

1.2 mm

Bottom

Ball

144

.8 mm

Tin Lead

S-PBGA-B144

e0

Yes

No

XC2C128-7CP132C by Xilinx

XC2C128-7CP132C

Xilinx

Xilinx XC2C128-7CP132C is a 128 macrocell FLASH PLD with 100 I/O lines, 119 MHz clock frequency, and 7.5 ns propagation delay. Ideal for applications requiring in-system programmability, such as digital signal processing and telecommunications systems.

Flash PLD

Yes

0 Dedicated Inputs, 100 I/O

100

Macrocell

100

128

0

100

119 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.1 mm

Bottom

Ball

132

.5 mm

Tin Lead

S-PBGA-B132

e0

Yes

No

XC2C128-7CP132I by Xilinx

XC2C128-7CP132I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 100 I/O

100

Macrocell

100

128

0

100

119 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.1 mm

Bottom

Ball

132

.5 mm

Tin Lead

S-PBGA-B132

e0

Yes

No

XC2C512-10FG324C by Xilinx

XC2C512-10FG324C

Xilinx

Xilinx XC2C512-10FG324C is a 512 macrocell FLASH PLD with 270 I/O lines, operating at max 91 MHz clock frequency. It has a propagation delay of 10 ns and can handle supply voltages from 1.7V to 1.9V. Ideal for applications requiring high-speed programmable logic in commercial-grade environments.

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

XC2C512-10FG324I by Xilinx

XC2C512-10FG324I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

XC2C512-10FT256C by Xilinx

XC2C512-10FT256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

512

0

212

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C512-10FT256I by Xilinx

XC2C512-10FT256I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

512

0

212

91 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C512-7FG324C by Xilinx

XC2C512-7FG324C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 270 I/O

270

Macrocell

270

512

0

270

119 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

XC2C512-7FT256C by Xilinx

XC2C512-7FT256C

Xilinx

XC2C512-7FT256C by Xilinx is a 512 macrocell FLASH PLD with 212 I/O lines, 7.5 ns propagation delay, and 119 MHz max clock frequency. Ideal for applications requiring in-system programmability, such as digital signal processing and telecommunications systems.

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

512

0

212

119 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C256-7CP132C by Xilinx

XC2C256-7CP132C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 106 I/O

106

Macrocell

106

256

0

106

108 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.1 mm

Bottom

Ball

132

.5 mm

Tin Lead

S-PBGA-B132

e0

Yes

No

XC2C256-7CP132I by Xilinx

XC2C256-7CP132I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 106 I/O

106

Macrocell

106

256

0

106

108 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

240 °C (464 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.1 mm

Bottom

Ball

132

.5 mm

Tin Lead

S-PBGA-B132

e0

Yes

No

XC2C256-7FT256C by Xilinx

XC2C256-7FT256C

Xilinx

XC2C256-7FT256C by Xilinx is a 256 macrocell FLASH PLD with 184 I/O lines, operating at max 108 MHz. It features a propagation delay of 7.5 ns and supports JTAG boundary scan testing. Ideal for applications requiring high-speed programmable logic devices in commercial temperature environments.

Flash PLD

Yes

0 Dedicated Inputs, 184 I/O

184

Macrocell

184

256

0

184

108 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C256-7FT256I by Xilinx

XC2C256-7FT256I

Xilinx

XC2C256-7FT256I by Xilinx is a 256 Macrocell FLASH PLD with 184 I/O lines, operating at max 108 MHz clock frequency. It uses CMOS technology, has propagation delay of 7.5 ns, and supports JTAG boundary scan test. Ideal for industrial applications requiring programmable logic devices with low profile grid array package style.

Flash PLD

Yes

0 Dedicated Inputs, 184 I/O

184

Macrocell

184

256

0

184

108 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C384-10FG324I by Xilinx

XC2C384-10FG324I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 240 I/O

240

Macrocell

240

384

0

240

83 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Lead

S-PBGA-B324

e0

Yes

No

XC2C384-10FT256C by Xilinx

XC2C384-10FT256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

384

0

212

83 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C384-10FT256I by Xilinx

XC2C384-10FT256I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

384

0

212

83 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

XC2C384-7FT256C by Xilinx

XC2C384-7FT256C

Xilinx

XC2C384-7FT256C by Xilinx is a 384 macrocell FLASH PLD with 212 I/O lines, operating at 112 MHz. It features a propagation delay of 7.5 ns and can be used in applications requiring programmable logic devices with low profile grid array packaging for high-speed digital designs.

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

384

0

212

112 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

225 °C (437 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Lead

S-PBGA-B256

e0

Yes

No

LC5256MV-75FN256C by Lattice Semiconductor

LC5256MV-75FN256C

Lattice Semiconductor

LC5256MV-75FN256C by Lattice Semiconductor is a 256 macrocell EE PLD with 9.5 ns propagation delay, in-system programmable, and 141 I/O lines. It uses CMOS technology, has a max supply voltage of 3.6 V, and is suitable for applications requiring programmable logic devices in a square grid array package.

EE PLD

Yes

0 Dedicated Inputs, 141 I/O

Macrocell

256

0

141

9.5 ns

CMOS

Programmable Logic Devices

3.3

3 V

3.6 V

3.3 V

250 °C (482 °F)

3

40 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA256,16X16,40

17 mm

17 mm

2.1 mm

Bottom

Ball

256

1 mm

Tin/Silver/Copper

S-PBGA-B256

e1

Yes

No

EP20K200FC484-1XV by Altera

EP20K200FC484-1XV

Altera

LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

Loadable PLD

4 Dedicated Inputs, 382 I/O

Macrocell

4

382

2.5 ns

2.5

2.375 V

2.625 V

85 °C (185 °F)

0 °C (32 °F)

Other

220 °C (428 °F)

3

Plastic/Epoxy

Grid Array

BGA

Square

23 mm

23 mm

2.1 mm

Bottom

Ball

484

1 mm

Tin Silver Copper

S-PBGA-B484

e1

No

LC4032ZC-35MN56C by Lattice Semiconductor

LC4032ZC-35MN56C

Lattice Semiconductor

LC4032ZC-35MN56C by Lattice Semiconductor is a 32 macrocell EE PLD with 36 inputs and 32 outputs. Featuring a propagation delay of 3.5 ns, it operates at a max clock frequency of 212 MHz. Ideal for applications requiring in-system programmability and JTAG boundary scan testing in a compact grid array package.

EE PLD

Yes

4 Dedicated Inputs, 32 I/O

32

Macrocell

36

32

83

4

32

212 MHz

3.5 ns

PAD-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.8 V

90 °C (194 °F)

0 °C (32 °F)

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA56,10X10,20

6 mm

6 mm

1.35 mm

Bottom

Ball

56

.5 mm

Tin/Silver/Copper

S-PBGA-B56

e1

Yes

No

LC4128ZC-75MN132C by Lattice Semiconductor

LC4128ZC-75MN132C

Lattice Semiconductor

LC4128ZC-75MN132C by Lattice Semiconductor is a 128 macrocell EE PLD with 100 inputs and 96 I/O lines. Featuring a propagation delay of 7.5 ns, it operates at a max clock frequency of 111 MHz. Ideal for applications requiring in-system programmability and JTAG boundary scan testing in a compact grid array package.

EE PLD

Yes

4 Dedicated Inputs, 96 I/O

96

Macrocell

100

128

83

4

96

111 MHz

7.5 ns

PAD-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.8 V

90 °C (194 °F)

0 °C (32 °F)

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.35 mm

Bottom

Ball

132

.5 mm

Tin Silver Copper

S-PBGA-B132

e1

Yes

No

LC4128ZC-75MN132I by Lattice Semiconductor

LC4128ZC-75MN132I

Lattice Semiconductor

LC4128ZC-75MN132I by Lattice Semiconductor is a 128 macrocell EE PLD with 7.5 ns propagation delay, 100 inputs, and 96 I/O lines. Ideal for applications requiring in-system programmability, it features a max clock frequency of 111 MHz and operates b/w -40 to 105°C temperatures.

EE PLD

Yes

4 Dedicated Inputs, 96 I/O

96

Macrocell

100

128

83

4

96

111 MHz

7.5 ns

PAD-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.8 V

105 °C (221 °F)

-40 °C (-40 °F)

260 °C (500 °F)

3

40 s

Plastic/Epoxy

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.35 mm

Bottom

Ball

132

.5 mm

Tin Silver Copper

S-PBGA-B132

e1

Yes

No

XC2C128-6CPG132C by Xilinx

XC2C128-6CPG132C

Xilinx

XC2C128-6CPG132C by Xilinx is a programmable logic device with 128 macro cells and 100 inputs/outputs. It has a max clock frequency of 152 MHz and can be used for applications requiring in-system programmability and high-speed data processing.

Flash PLD

Yes

0 Dedicated Inputs, 100 I/O

100

Macrocell

100

128

0

100

152 MHz

6 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.1 mm

Bottom

Ball

132

.5 mm

Tin Silver Copper

S-PBGA-B132

e1

Yes

No

XC2C256-6CPG132C by Xilinx

XC2C256-6CPG132C

Xilinx

The Xilinx XC2C256-6CPG132C is a 256 macrocell FLASH PLD with 106 I/O lines, operating at a max frequency of 139 MHz. It features a propagation delay of 6 ns and can be used in applications requiring programmable logic devices with fast response times and high input/output capabilities.

Flash PLD

Yes

0 Dedicated Inputs, 106 I/O

106

Macrocell

106

256

0

106

139 MHz

6 ns

CMOS

PLA-TYPE

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

BGA132,14X14,20

8 mm

8 mm

1.1 mm

Bottom

Ball

132

.5 mm

Tin Silver Copper

S-PBGA-B132

e1

Yes

No

XC2C256-6FTG256C by Xilinx

XC2C256-6FTG256C

Xilinx

Xilinx XC2C256-6FTG256C is a 256 macrocell FLASH PLD with 184 I/O lines, operating at max 139 MHz clock frequency. It uses CMOS technology with 6 ns propagation delay and supports JTAG boundary scan test. Ideal for applications requiring in-system programmability and low-profile grid array package style.

Flash PLD

Yes

0 Dedicated Inputs, 184 I/O

184

Macrocell

184

256

0

184

139 MHz

6 ns

CMOS

PLA-TYPE

Programmable Logic Devices

Real Digital Design Technology

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC2C384-10FGG324C by Xilinx

XC2C384-10FGG324C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 240 I/O

240

Macrocell

240

384

0

240

83 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No

XC2C384-10FGG324I by Xilinx

XC2C384-10FGG324I

Xilinx

FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 240 I/O

240

Macrocell

240

384

0

240

83 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

250 °C (482 °F)

3

30 s

Plastic/Epoxy

Grid Array

BGA

Square

BGA324,22X22,40

23 mm

23 mm

2.5 mm

Bottom

Ball

324

1 mm

Tin Silver Copper

S-PBGA-B324

e1

Yes

No

XC2C384-10FTG256C by Xilinx

XC2C384-10FTG256C

Xilinx

Xilinx XC2C384-10FTG256C is a 384 macrocell FLASH PLD with 212 I/O lines. It operates at max clock freq of 83 MHz, with propagation delay of 10 ns. Ideal for applications requiring in-system programmability and JTAG boundary scan test capabilities.

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

384

0

212

83 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC2C384-10FTG256I by Xilinx

XC2C384-10FTG256I

Xilinx

Xilinx XC2C384-10FTG256I is a 384 macrocell FLASH PLD with 212 I/O lines. It operates at max clock freq of 83MHz, has propagation delay of 10ns, and supports JTAG boundary scan test. Ideal for industrial applications requiring in-system programmable logic devices with low profile grid array package style.

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

384

0

212

83 MHz

10 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Industrial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No

XC2C384-7FTG256C by Xilinx

XC2C384-7FTG256C

Xilinx

FLASH PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

Flash PLD

Yes

0 Dedicated Inputs, 212 I/O

212

Macrocell

212

384

0

212

112 MHz

7.5 ns

CMOS

PLA-TYPE

Programmable Logic Devices

1.8

1.7 V

1.9 V

1.5/3.3,1.8 V

70 °C (158 °F)

0 °C (32 °F)

Commercial

260 °C (500 °F)

3

30 s

Plastic/Epoxy

Grid Array, Low Profile

LBGA

Square

BGA256,16X16,40

17 mm

17 mm

1.55 mm

Bottom

Ball

256

1 mm

Tin Silver Copper

S-PBGA-B256

e1

Yes

No