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XC2C512-7FT256C

Xilinx

XC2C512-7FT256C by Xilinx

XC2C512-7FT256C by Xilinx is a 512 macrocell FLASH PLD with 212 I/O lines, 7.5 ns propagation delay, and 119 MHz max clock frequency. Ideal for applications requiring in-system programmability, such as digital signal processing and telecommunications systems.

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Overview

Unlock the power of innovation with Xilinx's XC2C512-7FT256C Programmable Logic Device. Perfect for a wide range of applications, this cutting-edge technology offers unparalleled performance and flexibility. With Xilinx's reputation for quality and reliability, you can trust that your project will exceed expectations. Experience faster time-to-market, lower costs, and superior functionality with the XC2C512-7FT256C. Embrace the future of technology with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the device lightweight and cost-effective.

Propagation Delay: 7.5 ns

Low propagation delay allows for fast signal processing and improved performance.

Surface Mount: YES

Surface mount capability makes installation and assembly of the device easier and more efficient.

Maximum Supply Voltage: 1.9 V

Operating within a low maximum supply voltage range helps in reducing power consumption and increasing device efficiency.

No. of Macro Cells: 512

A high number of macro cells provide flexibility in programming and customization of logic functions.

Technology Used: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast operation.

No. of Inputs: 212

Having a large number of inputs allows for complex logic operations to be implemented.

Package Shape: SQUARE

Square package shape allows for efficient use of space on a PCB and easy integration into existing designs.

Form Of Terminal: BALL

Ball terminals provide a reliable connection and are suitable for advanced packaging techniques.

Architecture: PLA-TYPE

PLA-type architecture offers versatile programmability and customization options for different logic functions.

Nominal Supply Voltage (V): 1.8

Operating at a nominal supply voltage of 1.8V ensures compatibility with standard power sources.

Power Supplies (V): 1.5/3.3,1.8

Support for multiple power supply voltages allows for flexibility in system integration and compatibility.

No. of Terminals: 256

Having a large number of terminals enables multiple connections and interfaces to other components.

Programmable IC Type: FLASH PLD

Flash programmability offers reconfigurability and the ability to easily update logic functions as needed.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array and low profile package style provide high-density mounting and space-saving benefits.

In-System Programmable: YES

In-system programmability allows for easy updates and modifications to the device without the need for physical reprogramming.

Output Function: MACROCELL

Outputting signals through macrocells enables specific logic functions to be executed efficiently.

Minimum Supply Voltage: 1.7 V

Support for a low minimum supply voltage ensures reliable operation even in low-power scenarios.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance ensures stable and reliable performance under varying environmental conditions.

Pitch Of Terminal: 1 mm

A small pitch of terminals allows for high-density mounting and space efficiency on a PCB.

Organization: 0 DEDICATED INPUTS, 212 I/O

Dedicated inputs allow for specific logic functions to be implemented seamlessly, while a high number of I/O lines enable versatile connectivity.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Finishing Of Terminal Used: TIN LEAD

Tin lead finish on terminals provides good solderability and reliability in electronic assembly processes.

Position Of Terminal: BOTTOM

Bottom terminal positioning allows for easy soldering and mounting on a PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage precautions.

Maximum Seated Height: 1.55 mm

Low maximum seated height enables slim and compact device integration within electronic systems.

Width: 17 mm

A compact width of 17mm allows for space-efficient mounting on a PCB.

Maximum Clock Frequency: 119 MHz

High maximum clock frequency supports fast operation and real-time processing of logic functions.

No. of Outputs: 212

Having a high number of outputs enables the device to drive multiple external components and perform complex logic functions.

Maximum Time At Peak Reflow Temperature (s): 30

The device can withstand a peak reflow temperature for up to 30 seconds, ensuring robustness during soldering processes.

Peak Reflow Temperature °C: 225

Peak reflow temperature of 225C allows for reliable solder joint formation during assembly.

Length: 17 mm

A compact length of 17mm facilitates efficient PCB layout and space-saving integration.

JTAG Boundary Scan Test: YES

JTAG boundary scan test capability enables easy testing and debugging of the device during development and production.

No. of I/O Lines: 212

High number of I/O lines offer versatile connectivity options and enable seamless integration with external peripherals.

Grading Of Temperature: COMMERCIAL

Commercial temperature grading ensures reliable performance in standard operating conditions.

Technical Specifications

Programmable Logic Devices (PLD) XC2C512-7FT256C attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Xilinx

IC Features

Programmable IC Type:

In-System Programmable:

Yes

Organization:

0 Dedicated Inputs, 212 I/O

No. of Outputs:

212

Output Function:

Macrocell

No. of Inputs:

212

No. of Macro Cells:

512

No. of Dedicated Inputs:

0

No. of I/O Lines:

212

Maximum Clock Frequency:

119 MHz

Propagation Delay:

7.5 ns

Technology:

CMOS

Architecture:

PLA-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

1.8

Minimum Supply Voltage:

1.7 V

Maximum Supply Voltage:

1.9 V

Power Supplies (V):

1.5/3.3,1.8 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Moisture Sensitivity Level (MSL):

3

Maximum Time At Peak Reflow Temperature:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Grid Array, Low Profile

Package Code:

Package Shape:

Package Equivalence Code:

BGA256,16X16,40

Width:

17 mm

Length:

17 mm

Maximum Seated Height:

1.55 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

256

Terminal Pitch:

1 mm

Terminal Finish:

Tin Lead

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

JTAG Boundary Scan Test:

Yes

Qualified:

No

Trade Compliance

XC2C512-7FT256C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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