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XC2C32A-6CP56C

Xilinx

XC2C32A-6CP56C by Xilinx

XC2C32A-6CP56C by Xilinx is a programmable logic device (PLD) with 32 macro cells. It uses CMOS technology and has a max clock frequency of 300 MHz. This PLD is commonly used for in-system programming and outputting macrocell functions.

Median Price

$6.360

Lifecycle Status

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5

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1k+

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Nova Conductors

Japan . 10 parts In-Stock

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Vigor

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AZTECH Wire

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$11.640

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Microchip USA

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One Stop Electronics

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Ampacity Inc.

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Advanced Electronics

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MARBEL Systems

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Kenton Components

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Modulus Dynamics

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Supply Digital

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Qasali Group International

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Overview

Discover the XC2C32A-6CP56C by Xilinx, a top-quality Programmable Logic Device (PLD) that offers unmatched performance and versatility. Manufactured by Xilinx, a renowned industry leader, this innovative device is perfect for a wide range of applications. With its advanced technology and powerful features, it delivers exceptional value, benefits, and advantages to customers. Experience lightning-fast propagation delay, reliable surface mounting, and an extensive array of terminals. From its user-friendly design to its impressive clock frequency, the XC2C32A-6CP56C is the ultimate solution for all your programmable logic needs. Don't miss out on this game-changing product!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and resistance to damage, making it suitable for various applications.

Propagation Delay:

6 ns - Ensures fast and efficient signal transmission, allowing for high-performance operation.

Surface Mount:

YES - Offers easy and convenient integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage:

1.9 V - Provides a wide voltage range, allowing compatibility with different power sources.

No. of Macro Cells:

32 - Enables complex logic functions and programmability, enhancing versatility and customization options.

Technology Used:

CMOS - Utilizes low power consumption and provides reliable performance, making it energy-efficient and ideal for battery-operated devices.

Package Shape:

SQUARE - Offers ease of handling and compatibility with standard packaging systems, ensuring convenient and efficient manufacturing processes.

Form Of Terminal:

BALL - Facilitates reliable electrical connections and soldering, ensuring secure and stable connections.

Nominal Supply Voltage (V):

1.8 - Provides a stable and standard voltage level for optimal performance and compatibility.

Power Supplies (V):

1.5/3.3, 1.8 - Allows flexibility in power source selection, catering to different voltage requirements in various applications.

No. of Terminals:

56 - Provides sufficient connectivity options and interface capabilities, accommodating diverse input and output requirements.

Programmable IC Type:

FLASH PLD - Offers reprogrammability for easy updates or modifications, enhancing flexibility and adaptability in designs.

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH - Features a compact and space-saving design, enabling high-density packaging and miniaturization.

In-System Programmable:

YES - Allows for programming and configuration without the need for device removal, offering convenient on-the-fly adjustments and updates.

Output Function:

MACROCELL - Supports various logic functions and output configurations, enabling complex and customizable digital circuit designs.

Minimum Supply Voltage:

1.7 V - Ensures reliable operation even at low voltage levels, enhancing compatibility and robustness in diverse applications.

Maximum Operating Temperature:

70 °C - Enables reliable operation in challenging environmental conditions, ensuring stability and longevity.

Pitch Of Terminal:

0.5 mm - Provides a fine pitch for high-density connections, allowing for compact designs and efficient use of available space.

Organization:

33 I/O - Offers a balanced number of input and output pins, facilitating diverse interfacing requirements and efficient data exchange.

Minimum Operating Temperature:

0 °C - Allows for reliable operation even in extreme cold environments, ensuring consistent performance.

Finishing Of Terminal Used:

TIN LEAD - Provides corrosion resistance and reliable solder joint integrity, enhancing the longevity and reliability of the device.

Position Of Terminal:

BOTTOM - Simplifies assembly and ensures secure connections, optimizing manufacturing processes and reliability.

Moisture Sensitivity Level (MSL):

3 - Indicates the level of protection against moisture, ensuring proper handling and storage for optimal performance and reliability.

Maximum Seated Height:

1.35 mm - Features a low profile design, allowing for compact integration and compatibility with space-constrained applications.

Width:

6 mm - Offers a compact form factor, facilitating easy integration and fitting within tight spaces.

Maximum Clock Frequency:

300 MHz - Provides high-speed operation and accommodates demanding applications that require fast data processing.

Maximum Time At Peak Reflow Temperature (s):

30 - Specifies the allowable time for the device during reflow operations, ensuring proper soldering and preventing damage.

Peak Reflow Temperature °C:

240 - Specifies the maximum temperature during reflow soldering processes to prevent overheating and device failure.

Length:

6 mm - Features a compact and standardized length for easy handling, compatibility, and integration into various designs.

JTAG Boundary Scan Test:

YES - Facilitates efficient testing and debugging during development and production, ensuring quality and reliability.

No. of I/O Lines:

33 - Provides a suitable number of input/output lines for versatile connectivity and data exchange in various applications.

Grading Of Temperature:

COMMERCIAL - Indicates the device's temperature grade, ensuring proper performance within specified temperature ranges for commercial applications.

Technical Specifications

Programmable Logic Devices (PLD) XC2C32A-6CP56C attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Xilinx

IC Features

Programmable IC Type:

In-System Programmable:

Yes

Organization:

33 I/O

Output Function:

Macrocell

No. of Macro Cells:

32

No. of I/O Lines:

33

Maximum Clock Frequency:

300 MHz

Propagation Delay:

6 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Additional Features:

Real Digital Design Technology

Power Characteristics

Nominal Supply Voltage:

1.8

Minimum Supply Voltage:

1.7 V

Maximum Supply Voltage:

1.9 V

Power Supplies (V):

1.5/3.3,1.8 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Peak Reflow Temperature:

240 °C (464 °F)

Moisture Sensitivity Level (MSL):

3

Maximum Time At Peak Reflow Temperature:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Package Equivalence Code:

BGA56,10X10,20

Width:

6 mm

Length:

6 mm

Maximum Seated Height:

1.35 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

56

Terminal Pitch:

.5 mm

Terminal Finish:

Tin Lead

Standards

JESD-30 Code:

S-PBGA-B56

JESD-609 Code:

e0

JTAG Boundary Scan Test:

Yes

Qualified:

No

Trade Compliance

XC2C32A-6CP56C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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