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XCR3512XL-12FTG256C

Xilinx

XCR3512XL-12FTG256C by Xilinx

Xilinx XCR3512XL-12FTG256C is a 512 macrocell EE PLD with 212 I/O lines, operating at max 77 MHz. It features in-system programmability and JTAG boundary scan test for versatile applications in commercial-grade electronics. The device has a low profile grid array package with 256 terminals, suitable for high-speed digital designs requiring fast propagation delay of 12 ns.

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Overview

Unlock the power of cutting-edge technology with the XCR3512XL-12FTG256C by Xilinx. As a leading manufacturer in the field of Programmable Logic Devices, Xilinx delivers top-quality products that cater to a wide range of applications. This versatile PLD offers unmatched flexibility and efficiency, making it the ideal choice for your next project. Say goodbye to limitations and hello to endless possibilities with the XCR3512XL-12FTG256C!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability of the device, making it suitable for various applications.

Propagation Delay: 12 ns

Low propagation delay allows for fast signal processing, making the device efficient in time-sensitive applications.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, the device can handle a wide range of input voltages, increasing its versatility.

No. of Macro Cells: 512

The high number of macro cells provides flexibility in design and implementation of complex logic functions.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the device.

Nominal Supply Voltage (V): 3.3

A stable nominal supply voltage ensures consistent performance and reliability of the device.

Maximum Clock Frequency: 77 MHz

High maximum clock frequency allows for quick operation and processing of signals, making the device suitable for high-speed applications.

Technical Specifications

Programmable Logic Devices (PLD) XCR3512XL-12FTG256C attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Xilinx

IC Features

Programmable IC Type:

In-System Programmable:

Yes

Organization:

0 Dedicated Inputs, 212 I/O

Output Function:

Macrocell

No. of Macro Cells:

512

No. of Dedicated Inputs:

0

No. of I/O Lines:

212

Maximum Clock Frequency:

77 MHz

Propagation Delay:

12 ns

Technology:

CMOS

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

3.3

Minimum Supply Voltage:

3 V

Maximum Supply Voltage:

3.6 V

Power Supplies (V):

3.3 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Maximum Time At Peak Reflow Temperature:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Grid Array, Low Profile

Package Code:

Package Shape:

Package Equivalence Code:

BGA256,16X16,40

Width:

17 mm

Length:

17 mm

Maximum Seated Height:

1.55 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

256

Terminal Pitch:

1 mm

Terminal Finish:

Tin Silver Copper

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

JTAG Boundary Scan Test:

Yes

Qualified:

No

Trade Compliance

XCR3512XL-12FTG256C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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