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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC7K70T-L2FBG676E by Xilinx

XC7K70T-L2FBG676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B676;

FPGA

65600

300

300

5125

0.91 ns

CMOS

Field Programmable Gate Arrays

5125 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9,1.8,3.3 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.54 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XA6SLX100-2FGG484I by Xilinx

XA6SLX100-2FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

101261

326

326

667 MHz

CMOS

Field Programmable Gate Arrays

1.2,1.2/3.3,2.5/3.3 V

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX100-2FGG484Q by Xilinx

XA6SLX100-2FGG484Q

Xilinx

XA6SLX100-2FGG484Q by Xilinx is a CMOS FPGA with 101261 logic cells, 326 inputs/outputs, and max clock freq of 667MHz. Ideal for applications requiring high-speed processing like telecommunications, automotive systems, and industrial automation.

FPGA

101261

326

326

667 MHz

CMOS

Field Programmable Gate Arrays

1.2,1.2/3.3,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX16-2CSG225Q by Xilinx

XA6SLX16-2CSG225Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;

FPGA

14579

160

160

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX16-2CSG324I by Xilinx

XA6SLX16-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA324,18X18,32;

FPGA

14579

232

232

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX16-2CSG324Q by Xilinx

XA6SLX16-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

14579

232

232

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX16-3CSG225Q by Xilinx

XA6SLX16-3CSG225Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 62.5 MHz;

FPGA

14579

160

160

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX25-2CSG324I by Xilinx

XA6SLX25-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Power Supplies (V): 1.2,2.5/3.3;

FPGA

24051

226

226

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX25-2CSG324Q by Xilinx

XA6SLX25-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

24051

226

226

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX25-2FGG484Q by Xilinx

XA6SLX25-2FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

24051

266

266

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX25-3CSG324I by Xilinx

XA6SLX25-3CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; No. of Outputs: 226;

FPGA

24051

226

226

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX25-3CSG324Q by Xilinx

XA6SLX25-3CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

24051

226

226

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX25T-2CSG324Q by Xilinx

XA6SLX25T-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; No. of Inputs: 190;

FPGA

24051

190

190

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX25T-2FGG484Q by Xilinx

XA6SLX25T-2FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

24051

250

250

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX25T-3FGG484Q by Xilinx

XA6SLX25T-3FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 250;

FPGA

24051

250

250

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX4-2CSG225I by Xilinx

XA6SLX4-2CSG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Screening Level: AEC-Q100;

FPGA

3840

132

132

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX4-2CSG225Q by Xilinx

XA6SLX4-2CSG225Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

3840

132

132

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX45-2CSG324I by Xilinx

XA6SLX45-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

43661

218

218

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX45-2CSG324Q by Xilinx

XA6SLX45-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

43661

218

218

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX45-2CSG484I by Xilinx

XA6SLX45-2CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B484;

FPGA

43661

320

320

667 MHz

CMOS

Field Programmable Gate Arrays

1.2,1.2/3.3,2.5/3.3 V

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX45-2FGG484I by Xilinx

XA6SLX45-2FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

43661

316

316

3411

667 MHz

0.26 ns

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100; TS 16949

XA6SLX45-3CSG324I by Xilinx

XA6SLX45-3CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

43661

218

218

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX45-3CSG324Q by Xilinx

XA6SLX45-3CSG324Q

Xilinx

The Xilinx XA6SLX45-3CSG324Q is a FPGA with 43661 logic cells, 218 inputs/outputs, and max clock frequency of 62.5 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

FPGA

43661

218

218

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX45-3CSG484I by Xilinx

XA6SLX45-3CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

43661

320

320

862 MHz

CMOS

Field Programmable Gate Arrays

1.2,1.2/3.3,2.5/3.3 V

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX45-3FGG484I by Xilinx

XA6SLX45-3FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA484,22X22,40;

FPGA

43661

316

316

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX45-3FGG484Q by Xilinx

XA6SLX45-3FGG484Q

Xilinx

The Xilinx XA6SLX45-3FGG484Q is a FPGA with 43661 logic cells, 316 inputs/outputs, and max clock frequency of 62.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for automotive, industrial, or telecommunications sectors.

FPGA

43661

316

316

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100; TS 16949

XA6SLX45T-2CSG324Q by Xilinx

XA6SLX45T-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Pitch Of Terminal: .8 mm;

FPGA

43661

190

190

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX45T-2FGG484Q by Xilinx

XA6SLX45T-2FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 43661;

FPGA

43661

296

296

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX45T-3CSG324Q by Xilinx

XA6SLX45T-3CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

43661

190

190

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX45T-3FGG484I by Xilinx

XA6SLX45T-3FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B484;

FPGA

43661

296

296

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX45T-3FGG484Q by Xilinx

XA6SLX45T-3FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

43661

296

296

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX75-2CSG484Q by Xilinx

XA6SLX75-2CSG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

328

328

5831

0.26 ns

5831 CLBS

1.23

1.2 V

1.26 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

XA6SLX75-2FGG484Q by Xilinx

XA6SLX75-2FGG484Q

Xilinx

XA6SLX75-2FGG484Q by Xilinx is a FPGA with 74637 logic cells, 280 inputs/outputs, and max clock frequency of 62.5 MHz. Ideal for applications requiring high-speed processing like telecommunications, networking, and industrial automation.

FPGA

74637

280

280

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX75-3CSG484Q by Xilinx

XA6SLX75-3CSG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

328

328

5831

0.21 ns

5831 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

XA6SLX75-3FGG484Q by Xilinx

XA6SLX75-3FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

74637

280

280

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX75T-2FGG484I by Xilinx

XA6SLX75T-2FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

268

268

5831

667 MHz

0.26 ns

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100; TS 16949

XA6SLX75T-2FGG484Q by Xilinx

XA6SLX75T-2FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

74637

268

268

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX75T-3FGG484Q by Xilinx

XA6SLX75T-3FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;

FPGA

74637

268

268

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX9-2CSG225I by Xilinx

XA6SLX9-2CSG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

9152

160

160

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX9-2CSG225Q by Xilinx

XA6SLX9-2CSG225Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B225;

FPGA

9152

160

160

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX9-2CSG324I by Xilinx

XA6SLX9-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 62.5 MHz;

FPGA

9152

200

200

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX9-2CSG324Q by Xilinx

XA6SLX9-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;

FPGA

9152

200

200

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XC7V2000T-1FLG1925C by Xilinx

XC7V2000T-1FLG1925C

Xilinx

Xilinx XC7V2000T-1FLG1925C is a FPGA with 1954560 logic cells, 152700 CLBs, and max clock frequency of 1818 MHz. Ideal for high-performance applications requiring advanced programmable ICs in compact form factors.

FPGA

1954560

1200

1200

152700

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

152700 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.75 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1925

S-PBGA-B1925

e1

No

XC7V2000T-2FHG1761C by Xilinx

XC7V2000T-2FHG1761C

Xilinx

The Xilinx XC7V2000T-2FHG1761C is a high-performance FPGA with 1954560 logic cells and 152700 CLBs. Operating at up to 1818 MHz, it has 850 inputs/outputs and uses CMOS technology. Ideal for applications requiring fast processing speeds in a compact form factor.

FPGA

1954560

850

850

152700

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

152700 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.75 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1761

S-PBGA-B1761

e1

No

XC7V2000T-2FLG1925C by Xilinx

XC7V2000T-2FLG1925C

Xilinx

Xilinx XC7V2000T-2FLG1925C is a FPGA with 1954560 logic cells, 152700 CLBs, and 1200 inputs/outputs. It operates at max frequency of 1818 MHz, suitable for high-performance applications like signal processing and data acceleration. With CMOS technology and low power supply requirements (1-1.8 V), it offers efficient programmable solutions in a compact grid array package.

FPGA

1954560

1200

1200

152700

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

152700 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.75 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1925

S-PBGA-B1925

e1

No

XC7VX1140T-1FLG1930C by Xilinx

XC7VX1140T-1FLG1930C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1930; Package Code: BGA; Package Shape: SQUARE;

FPGA

1139200

1100

1100

89000

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

89000 CLBS

1

.97 V

1.03 V

0.9,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.75 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1930

S-PBGA-B1930

e1

No

XC7VX1140T-1FLG1930I by Xilinx

XC7VX1140T-1FLG1930I

Xilinx

The Xilinx XC7VX1140T-1FLG1930I is a high-performance FPGA with 1139200 logic cells and 89000 CLBs. Operating at up to 1818 MHz, it offers 1100 inputs/outputs and uses CMOS technology. Ideal for applications requiring fast processing speeds in fields like telecommunications and aerospace.

FPGA

1139200

1100

1100

89000

1818 MHz

0.74 ns

CMOS

Field Programmable Gate Arrays

89000 CLBS

1

.97 V

1.03 V

1,1.8 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.75 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1930

S-PBGA-B1930

e1

No

XC7VX1140T-2FLG1930C by Xilinx

XC7VX1140T-2FLG1930C

Xilinx

Xilinx XC7VX1140T-2FLG1930C FPGA offers 1139200 logic cells, 89000 CLBs, and a max clock frequency of 1818 MHz. Ideal for high-performance applications requiring advanced programmable ICs with a wide range of inputs and outputs.

FPGA

1139200

1100

1100

89000

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

89000 CLBS

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

45 mm

45 mm

3.75 mm

BGA1924,44X44,40

Bottom

Ball

Tin Silver Copper

1 mm

1930

S-PBGA-B1930

e1

No