Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B484;
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Vyrian
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Digiode
AZTECH Wire
$4.968
Ampacity Inc.
$7.000
One Stop Electronics
$26.000
Semicontronic
$32.000
$31.200
$31.040
Vigor
$102.900
Modulus Dynamics
$111.831
Texas Native Microelectronics
$118.868
$114.113
$110.547
$104.604
Microchip USA
$179.900
Kenton Components
$132.657
Kepictronics
Supply Digital
Qasali Group International
$308.106
$282.430
Corphita
RC Electronics
$138.010
$125.960
$122.190
Corohmni
MARBEL Systems
Field Programmable Gate Arrays (FPGA) XA6SLX45T-3FGG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XA6SLX45T-3FGG484I Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
BSS138
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
SMBJ18CA
Weitron Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SZNUP2105LT1G
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
1N4148
Toshiba
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
BAV99
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
4554
Jw Miller Magnetics
Other Semiconductors;
2N2222A
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Config: SINGLE; Terminal Finish: Tin/Lead (Sn/Pb);
Micro Commercial Components
Silicon Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
E8WSDC12-32.768KTR
Abracon
Abracon's E8WSDC12-32.768KTR crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and communication systems.
1554216004
Molex
WIRE AND CABLE;
Bytesonic Electronics
EU2B-YS2J03F
Idec
ROTARY SWITCH;
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JEDEC-95 Code: TO-236AB; Qualification: Not Qualified; Package Style (Meter): SMALL OUTLINE;
STM8S003F3P6TR
STM8S003F3P6TR by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 1024 RAM bytes, 128 data EEPROM size, and 5-ch 10-bit ADC channels. Ideal for industrial applications requiring low power mode and connectivity via I2C, SPI, and UART interfaces.
5CSXFC6D6F31C6N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;
10M08SAM153I7G
Intel
Intel 10M08SAM153I7G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a supply voltage range of 2.85V to 3.15V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with bottom terminals.
LFE5U-45F-6MG285C
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
XCAU15P-2SBVB484E
Xilinx
FIELD PROGRAMMABLE GATE ARRAY;
10M02SCE144C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
10M08SCE144I7G
The Intel 10M08SCE144I7G is a Field Programmable Gate Array with 8000 logic cells and 500 CLBs. It operates at a max supply voltage of 3.15V, suitable for industrial applications requiring high-performance FPGA solutions in compact form factors. The package style includes flatpack, heat sink/slug, low profile, and fine pitch options for versatile integration.
XC6SLX100-2FGG484I
Xilinx XC6SLX100-2FGG484I FPGA features 101261 logic cells, 7911 CLBs, and 326 inputs/outputs. Ideal for industrial applications with a max clock frequency of 667 MHz, operating temperature range of -40 to 100 °C, and power supplies at 1.2V and 2.5/3.3V.
10M04SCE144C8G
Intel's 10M04SCE144C8G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-speed processing in industrial automation and telecommunications sectors.
XC7S15-2FTGB196I
The Xilinx XC7S15-2FTGB196I is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in industrial applications requiring high-speed processing and low power consumption. The package style is grid array, low profile, fine pitch with matte tin finishing for optimal performance.
10M08SCU169C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
XC7S100-1FGGA484I
Xilinx XC7S100-1FGGA484I FPGA features 102400 logic cells, 8000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with 484 terminals.
A3P1000-PQG208
Microchip Technology
A3P1000-PQG208 by Microchip Technology is a CMOS FPGA with 24576 CLBs and 1000000 gates. It operates at a max clock frequency of 350 MHz, suitable for applications requiring high-speed processing. With a package style of flatpack, fine pitch, it is ideal for commercial use in various electronic systems.
M2GL025T-1FGG484I
M2GL025T-1FGG484I by Microchip Technology is a 27696 logic cell FPGA with 267 inputs/outputs. Operating at 1.2V, it has a temperature range of -40 to 100°C and uses a grid array package for industrial applications.
XC6SLX4-2TQG144I
The Xilinx XC6SLX4-2TQG144I is a FPGA with 3840 logic cells, 300 CLBs, and max clock frequency of 667 MHz. It operates at temperatures ranging from -40 to 100 °C and is ideal for industrial applications requiring high-speed processing in compact designs.
10M25DAF256C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
The Intel 10M08SCU169C8G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-speed processing and programmable ICs in various industries such as telecommunications and automotive.
LCMXO3L-1300C-5BG256C
LCMXO3L-1300C-5BG256C by Lattice Semiconductor is a 160 CLBs FPGA with max supply voltage of 3.465V and min operating temp of 0°C. Ideal for applications requiring low profile, fine pitch grid array package style with 256 terminals.
XC7A100T-2CSG324I
Xilinx XC7A100T-2CSG324I FPGA offers 101440 logic cells, 7925 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.
LCMXO2-256ZE-1MG132C
LCMXO2-256ZE-1MG132C by Lattice Semiconductor is a 256 Logic Cell FPGA with 55 inputs/outputs, operating at 1.2V. It comes in a square grid array package and is suitable for applications requiring low power consumption and high flexibility in electronic designs.
EP1C3T144C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XA6SLX45-3CSG324Q
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;
XA6SLX45-3FGG484Q
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
XA6SLX100-2FGG484Q
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;
XA6SLX75-2FGG484Q
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
XA6SLX16-2CSG225Q
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
XA6SLX45-2FGG484Q
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XA6SLX100-2FGG484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XA6SLX100-2FG484Q
XA6SLX100-2FGG676I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 250; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
XA6SLX100-2FGG676Q
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 250; Finishing Of Terminal Used: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;
XA6SLX100-2CS484I
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e0; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: TIN LEAD;
XA6SLX100-2CSG484I
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER;
XA6SLX100-2FG676I
XA6SLX100-2FG484I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XA6SLX100-2FGG676C
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Peak Reflow Temperature (C): 250; Finishing Of Terminal Used: TIN SILVER COPPER;
XA6SLX100-2CSG484C
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1;
XA6SLX100-2FG676Q
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: TIN LEAD; JESD-609 Code: e0;
XA6SLX100-2CSG484Q
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: TIN SILVER COPPER;
XA6SLX100-2FG900C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
XA6SLX100-2FG900I
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