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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
ICE40LP1K-SWG16TR1K by Lattice Semiconductor

ICE40LP1K-SWG16TR1K

Lattice Semiconductor

ICE40LP1K-SWG16TR1K by Lattice Semiconductor is a 1280 logic cell FPGA with CMOS technology. It operates at 1.2V, has 160 CLBs, and a max combinatorial delay of 9.36ns. Ideal for industrial applications requiring high performance in compact designs.

FPGA

1280

10

10

160

9.36 ns

CMOS

160 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

1.48 mm

1.4 mm

.491 mm

Bottom

Ball

.35 mm

16

R-PBGA-B16

ICE40LP1K-SWG16TR50 by Lattice Semiconductor

ICE40LP1K-SWG16TR50

Lattice Semiconductor

ICE40LP1K-SWG16TR50 by Lattice Semiconductor is a CMOS FPGA with 160 CLBs, operating at -40 to 100 °C. It has a supply voltage range of 1.14-1.26 V and features a grid array package suitable for industrial applications.

FPGA

160

CMOS

160 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

1.48 mm

1.4 mm

.491 mm

Bottom

Ball

.35 mm

16

R-PBGA-B16

ICE40LP1K-SWG16TR by Lattice Semiconductor

ICE40LP1K-SWG16TR

Lattice Semiconductor

ICE40LP1K-SWG16TR by Lattice Semiconductor is a 1280 logic cell FPGA with CMOS technology. It operates at 1.2V, has 160 CLBs, and a max combinatorial delay of 9.36ns. Ideal for industrial applications requiring high performance in compact designs.

FPGA

1280

10

10

160

9.36 ns

CMOS

160 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Rectangular

1.48 mm

1.4 mm

.491 mm

Bottom

Ball

.35 mm

16

R-PBGA-B16

ICE5LP4K-SWG36ITR by Lattice Semiconductor

ICE5LP4K-SWG36ITR

Lattice Semiconductor

ICE5LP4K-SWG36ITR by Lattice Semiconductor is a CMOS FPGA with 3520 logic cells and 440 CLBs. Operating at 1.2V, it has 26 inputs/outputs and a max combinatorial delay of 9ns. Ideal for industrial applications requiring high-performance programmable ICs in a square grid array package with very thin profile and fine pitch terminals.

FPGA

3520

26

26

440

9 ns

CMOS

440 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

1

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

2.078 mm

2.078 mm

.491 mm

Bottom

Ball

.35 mm

36

S-PBGA-B36

XC7A200T-2SB484I by Xilinx

XC7A200T-2SB484I

Xilinx

The Xilinx XC7A200T-2SB484I is a FPGA with 215360 logic cells, 16825 CLBs, and 285 inputs/outputs. It operates b/w -40 to 100°C and has a max supply voltage of 1.05V. Ideal for applications requiring high-speed processing and programmable ICs in compact form factors.

FPGA

215360

285

285

16825

1.05 ns

16825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.44 mm

Bottom

Ball

Tin/Lead

.8 mm

484

S-PBGA-B484

e0

XC7A200T-1SB484I by Xilinx

XC7A200T-1SB484I

Xilinx

The Xilinx XC7A200T-1SB484I is a FPGA with 215360 logic cells, 16825 CLBs, and 285 inputs/outputs. It operates b/w -40 to 100 °C and has a max supply voltage of 1.05 V. Ideal for applications requiring high-speed processing and programmable ICs in compact spaces.

FPGA

215360

285

285

16825

1.27 ns

16825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.44 mm

Bottom

Ball

Tin/Lead

.8 mm

484

S-PBGA-B484

e0

XC7K410T-2FF900I by Xilinx

XC7K410T-2FF900I

Xilinx

The Xilinx XC7K410T-2FF900I FPGA features 406720 logic cells, 31775 CLBs, and a max clock frequency of 1818 MHz. Ideal for high-performance applications requiring fast processing speeds and extensive programmability in fields like telecommunications, aerospace, and data centers.

FPGA

406720

500

500

31775

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

31775 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.35 mm

BGA900,30X30,40

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

No

LCMXO3L-1300C-5BG256I by Lattice Semiconductor

LCMXO3L-1300C-5BG256I

Lattice Semiconductor

LCMXO3L-1300C-5BG256I by Lattice Semiconductor is a FPGA with 1300 logic cells, 160 CLBs, and 206 inputs/outputs. It operates b/w -40 to 100°C, has a supply voltage range of 2.375V to 3.465V, and uses a grid array package style. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

1300

206

206

160

160 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-1300C-6BG256C by Lattice Semiconductor

LCMXO3L-1300C-6BG256C

Lattice Semiconductor

LCMXO3L-1300C-6BG256C by Lattice Semiconductor is a 160 CLBs FPGA with max supply voltage of 3.465V and nominal voltage of 2.5V. It features a grid array package style, suitable for applications requiring low profile and fine pitch requirements in electronics design and development.

FPGA

160

160 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-1300C-6BG256I by Lattice Semiconductor

LCMXO3L-1300C-6BG256I

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE; Width: 14 mm;

FPGA

1300

206

206

160

160 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-2100C-5BG256C by Lattice Semiconductor

LCMXO3L-2100C-5BG256C

Lattice Semiconductor

LCMXO3L-2100C-5BG256C by Lattice Semiconductor is a 264 CLB FPGA with max supply voltage of 3.465V, ideal for applications requiring low profile and fine pitch grid array packages. Operating temp range from 0 to 85°C makes it suitable for various electronic designs needing high performance in compact spaces.

FPGA

264

264 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-4300C-5BG256C by Lattice Semiconductor

LCMXO3L-4300C-5BG256C

Lattice Semiconductor

LCMXO3L-4300C-5BG256C by Lattice Semiconductor is a 540 CLB FPGA with max supply voltage of 3.465V and min operating temp of 0°C. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

FPGA

540

540 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-4300C-5BG256I by Lattice Semiconductor

LCMXO3L-4300C-5BG256I

Lattice Semiconductor

LCMXO3L-4300C-5BG256I by Lattice Semiconductor is a 4300 Logic Cells FPGA with 540 CLBs and 206 Inputs/Outputs. It operates b/w -40 to 100°C, has a supply voltage range of 2.375V to 3.465V, and uses a GRID ARRAY package style. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

4300

206

206

540

540 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-6900C-5BG256C by Lattice Semiconductor

LCMXO3L-6900C-5BG256C

Lattice Semiconductor

LCMXO3L-6900C-5BG256C by Lattice Semiconductor is a 858 CLBs FPGA with max supply voltage of 3.465V, suitable for applications requiring low profile, fine pitch grid arrays. Operating temp range from 0 to 85°C, making it ideal for various industrial and commercial projects.

FPGA

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-6900C-5BG256I by Lattice Semiconductor

LCMXO3L-6900C-5BG256I

Lattice Semiconductor

LCMXO3L-6900C-5BG256I by Lattice Semiconductor is a FPGA with 6900 logic cells, 858 CLBs, and 206 inputs/outputs. It operates b/w -40 to 100°C, with a supply voltage range of 2.375V to 3.465V. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

6900

206

206

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-6900C-6BG256C by Lattice Semiconductor

LCMXO3L-6900C-6BG256C

Lattice Semiconductor

LCMXO3L-6900C-6BG256C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, operating b/w 0-85°C. Featuring a grid array package style, it has 0.8mm terminal pitch and is suitable for applications requiring low profile, fine pitch ICs in electronics manufacturing.

FPGA

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3L-6900C-6BG256I by Lattice Semiconductor

LCMXO3L-6900C-6BG256I

Lattice Semiconductor

LCMXO3L-6900C-6BG256I by Lattice Semiconductor is a FPGA with 6900 logic cells, 858 CLBs, and 206 inputs/outputs. It operates b/w -40 to 100°C, has a supply voltage range of 2.375V to 3.465V, and uses a grid array package style. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

6900

206

206

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

XCS30XL-5BG256C by Xilinx

XCS30XL-5BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

576

196

196

576

10000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCS40XL-5BG256C by Xilinx

XCS40XL-5BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

784

205

205

784

13000

250 MHz

1 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC6VLX195T-3FF784C by Xilinx

XC6VLX195T-3FF784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

400

400

1412 MHz

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.86 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VLX240T-3FF1759C by Xilinx

XC6VLX240T-3FF1759C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;

FPGA

241152

720

720

1412 MHz

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1759,42X42,40

Bottom

Ball

Tin Lead

1 mm

1759

S-PBGA-B1759

e0

No

XC6VLX75T-3FF484C by Xilinx

XC6VLX75T-3FF484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

240

240

1412 MHz

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XCS30-3BG256C by Xilinx

XCS30-3BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

576

196

196

576

10000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin Lead

1.27 mm

256

S-PBGA-B256

e0

No

XCS30-4BG256C by Xilinx

XCS30-4BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

576

196

196

576

10000

166 MHz

1.2 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin Lead

1.27 mm

256

S-PBGA-B256

e0

No

XCS30XL-4BG256C by Xilinx

XCS30XL-4BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

576

196

196

576

10000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Maximum usable gates 30000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCS40-3BG256C by Xilinx

XCS40-3BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

784

205

205

784

13000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCS40-4BG256C by Xilinx

XCS40-4BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

784

205

205

784

13000

166 MHz

1.2 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XCS40XL-4BG256C by Xilinx

XCS40XL-4BG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

784

205

205

784

13000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC7K325T-1FB900I by Xilinx

XC7K325T-1FB900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

25475

0.74 ns

25475 CLBS

1

.97 V

1.03 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.54 mm

Bottom

Ball

Tin Lead

1 mm

900

S-PBGA-B900

e0

XC4010E-1BG225C by Xilinx

XC4010E-1BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

166 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4010E-3BG225C by Xilinx

XC4010E-3BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4010E-3BG225I by Xilinx

XC4010E-3BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 160;

FPGA

400

160

160

400

7000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4010E-4BG225C by Xilinx

XC4010E-4BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

400

160

160

400

7000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4010E-4BG225I by Xilinx

XC4010E-4BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 400;

FPGA

400

160

160

400

7000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

400 CLBS, 7000 Gates

Max usable 10000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-1BG225C by Xilinx

XC4013E-1BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

1368

192

192

576

10000

166 MHz

1.3 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-2BG225C by Xilinx

XC4013E-2BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

1368

192

192

576

10000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-2BG225I by Xilinx

XC4013E-2BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; No. of Equivalent Gates: 10000;

FPGA

1368

192

192

576

10000

125 MHz

1.6 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-3BG225C by Xilinx

XC4013E-3BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

1368

192

192

576

10000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-3BG225I by Xilinx

XC4013E-3BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 4.5 V;

FPGA

1368

192

192

576

10000

125 MHz

2 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-4BG225C by Xilinx

XC4013E-4BG225C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;

FPGA

1368

192

192

576

10000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.75 V

5.25 V

5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4013E-4BG225I by Xilinx

XC4013E-4BG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 5;

FPGA

1368

192

192

576

10000

111 MHz

2.7 ns

CMOS

Field Programmable Gate Arrays

576 CLBS, 10000 Gates

Max usable 13000 Logic gates

5

4.5 V

5.5 V

5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA225,15X15

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.5 mm

225

S-PBGA-B225

e0

No

XC4085XLA-09BG352I by Xilinx

XC4085XLA-09BG352I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

7448

289

289

3136

55000

227 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

3136 CLBS, 55000 Gates

Can also use 180000 gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

35 mm

35 mm

1.7 mm

BGA352,26X26,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

352

S-PBGA-B352

e0

No

XC4036XLA-09BG432C by Xilinx

XC4036XLA-09BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

1296

288

288

1296

22000

227 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

1296 CLBS, 22000 Gates

Can also use 65000 gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XC4052XLA-08BG432C by Xilinx

XC4052XLA-08BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

1936

352

352

1936

33000

263 MHz

1 ns

CMOS

Field Programmable Gate Arrays

1936 CLBS, 33000 Gates

Can also use 100000 gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XC4085XLA-08BG432C by Xilinx

XC4085XLA-08BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

7448

352

352

3136

55000

263 MHz

1 ns

CMOS

Field Programmable Gate Arrays

3136 CLBS, 55000 Gates

Can also use 180000 gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XC4085XLA-09BG432C by Xilinx

XC4085XLA-09BG432C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;

FPGA

7448

352

352

3136

55000

227 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

3136 CLBS, 55000 Gates

Can also use 180000 gates

3.3

3 V

3.6 V

3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA432,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

432

S-PBGA-B432

e0

No

XC40200XV-07BG560C by Xilinx

XC40200XV-07BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

7056

448

448

7056

130000

296 MHz

1 ns

CMOS

Field Programmable Gate Arrays

7056 CLBS, 130000 Gates

Can also use 400000 gates

2.5

2.3 V

2.7 V

2.5,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin Lead

1.27 mm

560

S-PBGA-B560

e0

No

XC4085XLA-09BG560I by Xilinx

XC4085XLA-09BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Maximum Seated Height: 1.7 mm;

FPGA

3136

448

448

3136

55000

227 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

3136 CLBS, 55000 Gates

Can also use 180000 gates

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No