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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCV1000-6FG680C by Xilinx

XCV1000-6FG680C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE;

FPGA

27648

512

512

6144

1124022

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 1124022 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA680,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

680

S-PBGA-B680

e0

No

XCV600-5FG680C by Xilinx

XCV600-5FG680C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE;

FPGA

15552

512

512

3456

661111

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 661111 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA680,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

680

S-PBGA-B680

e0

No

XCV600-5FG680I by Xilinx

XCV600-5FG680I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

15552

512

512

3456

661111

294 MHz

0.7 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 661111 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA680,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

680

S-PBGA-B680

e0

No

XCV600-6FG680C by Xilinx

XCV600-6FG680C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE;

FPGA

15552

512

512

3456

661111

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

3456 CLBS, 661111 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA680,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

680

S-PBGA-B680

e0

No

XCV800-6FG680C by Xilinx

XCV800-6FG680C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE;

FPGA

21168

512

512

4704

888439

333 MHz

0.6 ns

CMOS

Field Programmable Gate Arrays

4704 CLBS, 888439 Gates

2.5

2.375 V

2.625 V

1.2/3.6,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

40 mm

40 mm

1.7 mm

BGA680,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

680

S-PBGA-B680

e0

No

XCV1000E-6BG560C by Xilinx

XCV1000E-6BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

27648

404

404

6144

331776

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV1000E-6BG560I by Xilinx

XCV1000E-6BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

27648

404

404

6144

331776

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV1000E-6FG1156I by Xilinx

XCV1000E-6FG1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

27648

660

660

6144

331776

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.6 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XCV1000E-6FG680C by Xilinx

XCV1000E-6FG680C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: BGA; Package Shape: SQUARE;

FPGA

27648

512

512

6144

331776

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

1.9 mm

BGA680,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

680

S-PBGA-B680

e0

No

XCV1000E-6FG680I by Xilinx

XCV1000E-6FG680I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.2/3.6,1.8;

FPGA

27648

512

512

6144

331776

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

1.9 mm

BGA680,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

680

S-PBGA-B680

e0

No

XCV1000E-6FG900C by Xilinx

XCV1000E-6FG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

27648

660

660

6144

331776

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

900

S-PBGA-B900

e0

No

XCV1000E-6FG900I by Xilinx

XCV1000E-6FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; No. of Equivalent Gates: 331776;

FPGA

27648

660

660

6144

331776

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

900

S-PBGA-B900

e0

No

XCV1000E-7BG560C by Xilinx

XCV1000E-7BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

27648

404

404

6144

331776

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV1000E-7BG560I by Xilinx

XCV1000E-7BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

27648

404

404

6144

331776

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV1000E-7FG1156C by Xilinx

XCV1000E-7FG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

27648

660

660

6144

331776

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.6 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XCV1000E-7FG680C by Xilinx

XCV1000E-7FG680C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: BGA; Package Shape: SQUARE;

FPGA

27648

512

512

6144

331776

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

1.9 mm

BGA680,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

680

S-PBGA-B680

e0

No

XCV1000E-7FG860C by Xilinx

XCV1000E-7FG860C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 860; Package Code: BGA; Package Shape: SQUARE;

FPGA

27648

660

660

6144

331776

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

6144 CLBS, 331776 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

2.2 mm

BGA860,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

860

S-PBGA-B860

e0

No

XCV100E-6CS144I by Xilinx

XCV100E-6CS144I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

2700

94

94

600

32400

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV100E-6FG256C by Xilinx

XCV100E-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

176

176

600

32400

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV100E-6FG256I by Xilinx

XCV100E-6FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B256;

FPGA

2700

176

176

600

32400

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV100E-7CS144C by Xilinx

XCV100E-7CS144C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

2700

94

94

600

32400

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

12 mm

12 mm

1.2 mm

BGA144,13X13,32

Bottom

Ball

Tin/Lead (Sn63Pb37)

.8 mm

144

S-PBGA-B144

e0

No

XCV100E-7FG256C by Xilinx

XCV100E-7FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

176

176

600

32400

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV100E-7FG256I by Xilinx

XCV100E-7FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Length: 17 mm;

FPGA

2700

176

176

600

32400

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 32400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV1600E-6BG560C by Xilinx

XCV1600E-6BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

34992

404

404

7776

419904

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

7776 CLBS, 419904 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV1600E-6FG900C by Xilinx

XCV1600E-6FG900C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

FPGA

34992

700

700

7776

419904

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

7776 CLBS, 419904 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

900

S-PBGA-B900

e0

No

XCV1600E-6FG900I by Xilinx

XCV1600E-6FG900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

34992

700

700

7776

419904

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

7776 CLBS, 419904 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA900,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

900

S-PBGA-B900

e0

No

XCV1600E-7BG560I by Xilinx

XCV1600E-7BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B560;

FPGA

34992

404

404

7776

419904

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

7776 CLBS, 419904 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV1600E-7FG1156C by Xilinx

XCV1600E-7FG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

34992

724

724

7776

419904

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

7776 CLBS, 419904 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.6 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XCV1600E-7FG860C by Xilinx

XCV1600E-7FG860C

Xilinx

Xilinx XCV1600E-7FG860C is a FPGA with 34992 logic cells, 7776 CLBs, and 419904 gates. It operates at a max frequency of 400 MHz and has 660 inputs/outputs. Ideal for applications requiring high-speed processing in compact designs.

FPGA

34992

660

660

7776

419904

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

7776 CLBS, 419904 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

2.2 mm

BGA860,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

860

S-PBGA-B860

e0

No

XCV2000E-6BG560C by Xilinx

XCV2000E-6BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

43200

404

404

9600

518400

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV2000E-6BG560I by Xilinx

XCV2000E-6BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

43200

404

404

9600

518400

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV2000E-6FG1156C by Xilinx

XCV2000E-6FG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

43200

804

804

9600

518400

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.6 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XCV2000E-6FG1156I by Xilinx

XCV2000E-6FG1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.2/3.6,1.8;

FPGA

43200

804

804

9600

518400

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.6 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XCV2000E-6FG680C by Xilinx

XCV2000E-6FG680C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: BGA; Package Shape: SQUARE;

FPGA

43200

512

512

9600

518400

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

1.9 mm

BGA680,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

680

S-PBGA-B680

e0

No

XCV2000E-6FG680I by Xilinx

XCV2000E-6FG680I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

43200

512

512

9600

518400

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

1.9 mm

BGA680,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

680

S-PBGA-B680

e0

No

XCV2000E-6FG860I by Xilinx

XCV2000E-6FG860I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 860; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 225;

FPGA

43200

660

660

9600

518400

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

2.2 mm

BGA860,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

860

S-PBGA-B860

e0

No

XCV2000E-7BG560C by Xilinx

XCV2000E-7BG560C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;

FPGA

43200

404

404

9600

518400

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV2000E-7BG560I by Xilinx

XCV2000E-7BG560I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE;

FPGA

43200

404

404

9600

518400

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

42.5 mm

42.5 mm

1.7 mm

BGA560,33X33,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

560

S-PBGA-B560

e0

No

XCV2000E-7FG1156C by Xilinx

XCV2000E-7FG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

43200

804

804

9600

518400

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.6 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XCV2000E-7FG1156I by Xilinx

XCV2000E-7FG1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Organization: 9600 CLBS, 518400 GATES;

FPGA

43200

804

804

9600

518400

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.6 mm

BGA1156,34X34,40

Bottom

Ball

Tin Lead

1 mm

1156

S-PBGA-B1156

e0

No

XCV2000E-7FG860C by Xilinx

XCV2000E-7FG860C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 860; Package Code: BGA; Package Shape: SQUARE;

FPGA

43200

660

660

9600

518400

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

9600 CLBS, 518400 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

2.2 mm

BGA860,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

860

S-PBGA-B860

e0

No

XCV200E-6FG256C by Xilinx

XCV200E-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

176

176

1176

63504

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV200E-6FG256I by Xilinx

XCV200E-6FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 176;

FPGA

5292

176

176

1176

63504

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV200E-6FG456C by Xilinx

XCV200E-6FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

284

284

1176

63504

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XCV200E-6FG456I by Xilinx

XCV200E-6FG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

5292

284

284

1176

63504

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XCV200E-7FG256C by Xilinx

XCV200E-7FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

176

176

1176

63504

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV200E-7FG256I by Xilinx

XCV200E-7FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

5292

176

176

1176

63504

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCV200E-7FG456C by Xilinx

XCV200E-7FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

5292

284

284

1176

63504

400 MHz

0.42 ns

CMOS

Field Programmable Gate Arrays

1176 CLBS, 63504 Gates

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No