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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC7V585T-1FF1761I by Xilinx

XC7V585T-1FF1761I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA1760,42X42,40;

FPGA

582720

750

750

1818 MHz

CMOS

Field Programmable Gate Arrays

1,1.8 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA1760,42X42,40

Bottom

Ball

Tin/Lead

1 mm

1760

S-PBGA-B1760

e0

No

XC7VX330T-1FF1761I by Xilinx

XC7VX330T-1FF1761I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

326400

650

650

1818 MHz

CMOS

Field Programmable Gate Arrays

1,1.8 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA1760,42X42,40

Bottom

Ball

Tin/Lead

1 mm

1760

S-PBGA-B1760

e0

No

XC7VX485T-2FF1761C by Xilinx

XC7VX485T-2FF1761C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

485760

700

700

1818 MHz

CMOS

Field Programmable Gate Arrays

1

.97 V

1.03 V

1,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA1760,42X42,40

Bottom

Ball

Tin/Lead

1 mm

1760

S-PBGA-B1760

e0

No

XC7VX690T-1FF1761I by Xilinx

XC7VX690T-1FF1761I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;

FPGA

693120

850

850

1818 MHz

CMOS

Field Programmable Gate Arrays

1,1.8 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA1760,42X42,40

Bottom

Ball

Tin/Lead

1 mm

1760

S-PBGA-B1760

e0

No

XC7VX690T-2FF1761C by Xilinx

XC7VX690T-2FF1761C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;

FPGA

693120

850

850

1818 MHz

CMOS

Field Programmable Gate Arrays

1,1.8 V

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA1760,42X42,40

Bottom

Ball

Tin/Lead

1 mm

1760

S-PBGA-B1760

e0

No

XC5VLX110-1FF1760C by Xilinx

XC5VLX110-1FF1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.9 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1760

S-PBGA-B1760

e0

No

XC5VLX110-1FFG1760C by Xilinx

XC5VLX110-1FFG1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.9 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin/Silver/Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX110-1FFG1760I by Xilinx

XC5VLX110-1FFG1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.9 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin/Silver/Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX110-2FF1760C by Xilinx

XC5VLX110-2FF1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.77 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1760

S-PBGA-B1760

e0

No

XC5VLX110-2FF1760I by Xilinx

XC5VLX110-2FF1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.77 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1760

S-PBGA-B1760

e0

No

XC5VLX110-2FFG1760C by Xilinx

XC5VLX110-2FFG1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

110592

800

800

8640

0.77 ns

Field Programmable Gate Arrays

8640 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin/Silver/Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX220-1FF1760I by Xilinx

XC5VLX220-1FF1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

221184

800

800

17280

0.9 ns

Field Programmable Gate Arrays

17280 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Lead

1 mm

1760

S-PBGA-B1760

e0

No

XC5VLX220-1FFG1760C by Xilinx

XC5VLX220-1FFG1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

221184

800

800

17280

0.9 ns

Field Programmable Gate Arrays

17280 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX220-1FFG1760I by Xilinx

XC5VLX220-1FFG1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

221184

800

800

17280

0.9 ns

Field Programmable Gate Arrays

17280 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX220-2FF1760I by Xilinx

XC5VLX220-2FF1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

221184

800

800

17280

0.77 ns

Field Programmable Gate Arrays

17280 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Lead

1 mm

1760

S-PBGA-B1760

e0

No

XC5VLX220-2FFG1760C by Xilinx

XC5VLX220-2FFG1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

221184

800

800

17280

0.77 ns

Field Programmable Gate Arrays

17280 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX330-1FF1760I by Xilinx

XC5VLX330-1FF1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

331776

1200

1200

25920

0.9 ns

Field Programmable Gate Arrays

25920 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Lead

1 mm

1760

S-PBGA-B1760

e0

No

XC5VLX330-1FFG1760C by Xilinx

XC5VLX330-1FFG1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

331776

1200

1200

25920

0.9 ns

Field Programmable Gate Arrays

25920 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX330-1FFG1760I by Xilinx

XC5VLX330-1FFG1760I

Xilinx

Xilinx XC5VLX330-1FFG1760I is a FPGA with 331776 logic cells, 25920 CLBs, and 1200 inputs/outputs. Operating at 1.05V, it has a max combinatorial delay of 0.9ns. Ideal for industrial applications requiring high-speed processing in compact form factors.

FPGA

331776

1200

1200

25920

0.9 ns

Field Programmable Gate Arrays

25920 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX330-2FF1760C by Xilinx

XC5VLX330-2FF1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

331776

1200

1200

25920

0.77 ns

Field Programmable Gate Arrays

25920 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Lead

1 mm

1760

S-PBGA-B1760

e0

No

XC5VLX155-1FFG1760C by Xilinx

XC5VLX155-1FFG1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

155648

800

800

12160

0.9 ns

Field Programmable Gate Arrays

12160 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX155-1FFG1760I by Xilinx

XC5VLX155-1FFG1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

155648

800

800

12160

0.9 ns

Field Programmable Gate Arrays

12160 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XC5VLX155-2FF1760I by Xilinx

XC5VLX155-2FF1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

155648

800

800

12160

0.77 ns

Field Programmable Gate Arrays

12160 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Lead

1 mm

1760

S-PBGA-B1760

e0

No

XC5VLX155-2FFG1760C by Xilinx

XC5VLX155-2FFG1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

155648

800

800

12160

0.77 ns

Field Programmable Gate Arrays

12160 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.5 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

1SG280HN1F43E1VG by Intel

1SG280HN1F43E1VG

Intel

Intel's 1SG280HN1F43E1VG FPGA boasts 2753000 logic cells, 344125 CLBs, and 704 inputs/outputs. Ideal for applications requiring high-speed data processing and complex algorithm implementation in industries like telecommunications, aerospace, and automotive.

FPGA

2753000

704

704

344125

344125 CLBS

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.881 mm

BGA1760,42X42,40

Bottom

Ball

1 mm

1760

S-PBGA-B1760

1SG280HN1F43I1VG by Intel

1SG280HN1F43I1VG

Intel

Intel's 1SG280HN1F43I1VG FPGA boasts 2753000 logic cells, 344125 CLBs, and 704 inputs/outputs. With a package style of grid array and square shape, it is ideal for applications requiring high-performance programmable ICs in various industries.

FPGA

2753000

704

704

344125

344125 CLBS

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.881 mm

BGA1760,42X42,40

Bottom

Ball

1 mm

1760

S-PBGA-B1760

1SG280HN1F43I2LG by Intel

1SG280HN1F43I2LG

Intel

Intel's 1SG280HN1F43I2LG FPGA boasts 2753000 logic cells, 344125 CLBs, and 704 inputs/outputs. Ideal for applications requiring high-speed processing and complex logic operations in a compact form factor with a package style of grid array.

FPGA

2753000

704

704

344125

344125 CLBS

0.85

.82 V

.88 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.881 mm

BGA1760,42X42,40

Bottom

Ball

1 mm

1760

S-PBGA-B1760

1SG280HN3F43E3VG by Intel

1SG280HN3F43E3VG

Intel

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

2753000

704

704

344125

344125 CLBS

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.881 mm

BGA1760,42X42,40

Bottom

Ball

1 mm

1760

S-PBGA-B1760

1SG280HN3F43I3VG by Intel

1SG280HN3F43I3VG

Intel

Intel's 1SG280HN3F43I3VG FPGA boasts 2753000 logic cells, 344125 CLBs, and 704 inputs/outputs. With a package style of grid array and square shape, it is ideal for applications requiring high-performance programmable ICs in industries like telecommunications and aerospace.

FPGA

2753000

704

704

344125

344125 CLBS

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.881 mm

BGA1760,42X42,40

Bottom

Ball

1 mm

1760

S-PBGA-B1760

1SG280LN3F43I1VP by Intel

1SG280LN3F43I1VP

Intel

Intel 1SG280LN3F43I1VP is a FPGA with 2753000 logic cells, 344125 CLBs, and 704 inputs/outputs. It is used in applications requiring high-speed data processing and complex algorithm implementation due to its programmable nature and grid array package style. Operating temperature ranges from -40°C to 100°C, making it suitable for various environments.

FPGA

2753000

704

704

344125

344125 CLBS

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.881 mm

BGA1760,42X42,40

Bottom

Ball

1 mm

1760

S-PBGA-B1760

XCKU115-1FLVB1760C by Xilinx

XCKU115-1FLVB1760C

Xilinx

Xilinx XCKU115-1FLVB1760C FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs in a compact GRID ARRAY package with PLASTIC/EPOXY material. Operating temperature range of 0-85°C makes it suitable for various industrial uses.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU115-1FLVB1760I by Xilinx

XCKU115-1FLVB1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU115-2FLVB1760E by Xilinx

XCKU115-2FLVB1760E

Xilinx

Xilinx XCKU115-2FLVB1760E FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 100°C.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU115-2FLVB1760I by Xilinx

XCKU115-2FLVB1760I

Xilinx

Xilinx XCKU115-2FLVB1760I FPGA offers 1451100 logic cells, 5520 CLBs, and 832 inputs/outputs. Ideal for industrial applications requiring high processing power in a compact form factor. Operates b/w -40 to 100 °C with a supply voltage range of 0.922V to 0.979V.

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU115-3FLVB1760E by Xilinx

XCKU115-3FLVB1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1451100

832

832

5520

Field Programmable Gate Arrays

5520 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCVU095-2FFVB1760E by Xilinx

XCVU095-2FFVB1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.81 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCVU095-2FFVB1760I by Xilinx

XCVU095-2FFVB1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

832

832

768

768 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.81 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCVU125-2FLVB1760E by Xilinx

XCVU125-2FLVB1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1566600

884

884

1200

1200 CLBS

.95

.922 V

.979 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCVU125-2FLVB1760I by Xilinx

XCVU125-2FLVB1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1566600

884

884

1200

1200 CLBS

.95

.922 V

.979 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

XCKU085-1FLVB1760I by Xilinx

XCKU085-1FLVB1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU085-1FLVB1760C by Xilinx

XCKU085-1FLVB1760C

Xilinx

Xilinx XCKU085-1FLVB1760C FPGA boasts 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. Ideal for high-performance applications requiring a max supply voltage of 0.979 V. Package style is grid array with square shape and ball terminals, suitable for various electronic designs.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU095-1FFVB1760C by Xilinx

XCKU095-1FFVB1760C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU085-2FLVB1760E by Xilinx

XCKU085-2FLVB1760E

Xilinx

XCKU085-2FLVB1760E by Xilinx is a PLASTIC/EPOXY FPGA with 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. It is used for various applications in fields like telecommunications, aerospace, and automotive.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU095-2FFVB1760E by Xilinx

XCKU095-2FFVB1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU095-1FFVB1760I by Xilinx

XCKU095-1FFVB1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU085-2FLVB1760I by Xilinx

XCKU085-2FLVB1760I

Xilinx

Xilinx XCKU085-2FLVB1760I FPGA offers 1088325 logic cells, 62190 CLBs, and 676 inputs/outputs. Ideal for industrial applications requiring high processing power in a compact form factor. Operates b/w -40 to 100 °C with a supply voltage range of 0.922V to 0.979V.

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU095-2FFVB1760I by Xilinx

XCKU095-2FFVB1760I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1176000

702

702

67200

Field Programmable Gate Arrays

67200 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.71 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No

XCKU085-3FLVB1760E by Xilinx

XCKU085-3FLVB1760E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;

FPGA

1088325

676

676

62190

Field Programmable Gate Arrays

62190 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

4.11 mm

BGA1760,42X42,40

Bottom

Ball

Tin Silver Copper

1 mm

1760

S-PBGA-B1760

e1

No