Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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XCVC1702-1MSIVSVA1596
Xilinx
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;
S-PBGA-B1596
37.5 mm
1596
110 Cel
-40 Cel
PLASTIC/EPOXY
HBGA
BGA1596,40X40,36
SQUARE
GRID ARRAY, HEAT SINK/SLUG
4 mm
.825 V
.775 V
.8 V
YES
CMOS
BALL
.92 mm
BOTTOM
MICROPROCESSOR CIRCUIT
LS1023ASN7KQB
NXP Semiconductors
LS1023ASN7KQB by NXP Semiconductors is a multifunction peripheral IC with CMOS technology. It operates b/w 0-105°C, with supply voltage range of 0.87-0.93V. This square package has 621 terminals in a grid array style, suitable for various uPs and uCs applications.
S-PBGA-B621
e1
21 mm
3
621
105 Cel
0 Cel
HFBGA
BGA621,25X25,32
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
250
2.07 mm
.93 V
.87 V
.9 V
OTHER
TIN SILVER COPPER
.8 mm
30
MULTIFUNCTION PERIPHERAL
MIMX8MN5DVPIZCA
SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 306; Package Code: TFBGA; Package Shape: SQUARE;
S-PBGA-B306
11 mm
306
95 Cel
TFBGA
BGA306,21X21,20
GRID ARRAY, THIN PROFILE, FINE PITCH
1.01 mm
1 V
.95 V
.5 mm
SoC
MIMX8MN3DVPIZAA
The NXP Semiconductors MIMX8MN3DVPIZAA is a SoC with CMOS technology, featuring 306 terminals in a grid array package. It operates b/w 0-95°C, with supply voltage ranging from 0.9-1V. Ideal for applications requiring high performance and compact design in various electronic devices.
260
40
MIMX8MN1DVPIZAA
The NXP Semiconductors MIMX8MN1DVPIZAA is a SoC with 306 terminals in a grid array package. It operates b/w 0-95°C, with supply voltage ranging from 0.9-1V. Ideal for applications requiring high performance and low power consumption in compact electronic devices.
MIMX8MN5DVPIZDA
XCVC1702-2MSIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
S-PBGA-B2197
45 mm
2197
BGA2197,47X47,36
XCVC1702-2MLIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
XCVC1702-1LSEVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
100 Cel
.724 V
.676 V
.7 V
XCVC1702-1LSIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 4 mm;
XCVC1702-2LSEVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA2197,47X47,36;
XCVC1702-1LLIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVC1702-1MSEVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; JESD-609 Code: e1;
XCVC1702-1MSIVSVA2197
XCVC1702-2LLEVSVA2197
XCVC1702-1MLIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
XCVC1702-2MLEVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .775 V;
XCVC1702-2MSEVSVA2197
XCVM1502-1MLIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B2197;
NOT SPECIFIED
Tin/Silver/Copper (Sn/Ag/Cu)
XCVM1502-2MLEVSVA2197
XCVM1502-2MSIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;
XCVM1502-1MSIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);
XCVM1502-2MLIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
XCVM1502-2MSEVSVA2197
XCVM1502-1LSEVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;
XCVM1502-1MSEVSVA2197
XCVM1502-2LLEVSVA2197
XCVM1502-1LLIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .676 V;
XCVM1502-1LSIVSVA2197
XCVM1502-2LSEVSVA2197
LS1023AXN7KQB
MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;
MIMXRT105SCVL5B
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE; Width: 10 mm;
S-PBGA-B196
10 mm
196
LFBGA
BGA196,14X14,32
GRID ARRAY, LOW PROFILE, FINE PITCH
1.52 mm
1.26 V
1.15 V
.65 mm
SYSTEM ON CHIP
PN7150B0HN/C11006E
PN7150B0HN/C11006E by NXP Semiconductors is a NFC controller with a supply voltage range of 1.65V to 1.95V and operating temperature range of -30°C to 85°C. It comes in a square package with 40 terminals and is suitable for applications requiring contactless communication.
S-XQCC-N40
6 mm
85 Cel
-30 Cel
HVQCCN
LCC40,.24SQ,20
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
1 mm
1.95 V
1.65 V
1.8 V
NO LEAD
QUAD
NFC CONTROLLER
SLS32AIA020X4USON10XTMA4
Infineon Technologies
CRYPTOGRAPHIC AUTHENTICATOR; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 10; Package Code: HVSON; Package Shape: SQUARE;
S-PDSO-N10
3 mm
10
-25 Cel
HVSON
SOLCC10,.12,20
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
.6 mm
5.5 V
1.62 V
5 V
DUAL
CRYPTOGRAPHIC AUTHENTICATOR
SLS32AIA010MLUSON10XTMA2
SLS32AIA010MLUSON10XTMA2 by Infineon Technologies is a cryptographic authenticator IC with 10 terminals, CMOS technology, and 3.3V nominal voltage. It operates in industrial temperature range (-40 to 105 °C) and has a small outline package style suitable for surface mount applications.
3.3 V
INDUSTRIAL
NRF52832-QFAB-T
Nordic Semiconductor Asa
NRF52832-QFAB-T by Nordic Semiconductor Asa is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C and supports supply voltage range of 1.7V to 3.6V. Ideal for applications requiring low-profile, surface-mountable ICs in compact designs.
S-XQCC-N48
48
UNSPECIFIED
LCC48,.24SQ,16
.9 mm
3.6 V
1.7 V
3 V
.4 mm
ATMXT640UD-CCU001
Microchip Technology
Microchip Technology's ATMXT640UD-CCU001 is a 3.3V capacitive touch screen controller with 88 terminals in a square package style. Operating temperature ranges from -40 to 85 °C, suitable for various applications requiring precise touch input control. Its ultra-thin profile and fine pitch make it ideal for compact electronic devices.
S-PBGA-B88
88
VFBGA
BGA88,10X10,20
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
3.47 V
3.14 V
CAPACITIVE TOUCH SCREEN CONTROLLERS
MIMXRT1051CVJ5BR
The NXP Semiconductors MIMXRT1051CVJ5BR is a System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring a low profile, fine pitch package style and grid array configuration.
12 mm
ESP32-C3FN4
Espressif Systems (Shanghai)
ESP32-C3FN4 by Espressif Systems (shanghai) Operates at 3.6V, -40 to 85°C temp range, CMOS tech. Ideal for microprocessor circuits in IoT devices due to its small size (5x5mm), low power consumption, and quad terminal position.
ALSO HAVE PACKING METHOD TR, 7 INCH WITH 1000 QUANTITY
S-PQCC-N32
5 mm
32
LCC32,.2SQ,20
CYPM1111-40LQXIT
CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Width: 6 mm;
2.75 V
CYPM1211-40LQXIT
CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel;
2.7 V
S6J32HELTNSC2D000
SoC; Terminal Form: GULL WING; No. of Terminals: 216; Package Code: HLFQFP; Package Shape: SQUARE; Package Equivalence Code: QFP216,1.02SQ,16;
S-PQFP-G216
24 mm
216
HLFQFP
QFP216,1.02SQ,16
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
AEC-Q100; TS 16949
1.7 mm
1.3 V
1.1 V
1.2 V
GULL WING
S6J32JELSNSC20000
SoC; Terminal Form: GULL WING; No. of Terminals: 216; Package Code: HLFQFP; Package Shape: SQUARE; Width: 24 mm;
125 Cel
S6J32JEKSNSE20000
SoC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: HLFQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH;
S-PQFP-G208
28 mm
208
QFP208,1.2SQ,20
MCIMX6S5DVM10ADR
MCIMX6S5DVM10ADR by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w 0-95°C, with supply voltage ranging from 1.35-1.5V. Ideal for applications requiring low-profile, fine-pitch grid arrays in plastic/epoxy packages.
S-PBGA-B624
624
BGA624,25X25,32
1.6 mm
1.5 V
1.35 V
XVF3000-TQ128-CA
Xmos
XVF3000-TQ128-CA by Xmos is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-70 °C and has a supply voltage range of 0.95-1.05 V. This IC, in a FLATPACK package style, is ideal for applications requiring high-performance uPs/uCs in compact designs.
S-PQFP-G128
14 mm
128
70 Cel
HTFQFP
TQFP128,.63SQ,16
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
1.2 mm
1.05 V
XUF216-512-TQ128-I20A
XUF216-512-TQ128-I20A by Xmos is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 0.95V to 1.05V. This IC, in FLATPACK style, is ideal for applications requiring high performance in compact spaces.
MCIMX6U5DVM10ADR
MCIMX6U5DVM10ADR by NXP Semiconductors is a SoC with 624 terminals, operating at 0-95°C. It has a supply voltage range of 1.35-1.5V and uses CMOS technology. This IC is suitable for applications requiring low profile, fine pitch grid array packages in surface mount configurations.
1.4 V
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