Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CY8C4547AXI-S475
Infineon Technologies
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
S-PQFP-G64
14 mm
64
85 Cel
-40 Cel
PLASTIC/EPOXY
LQFP
QFP64,.63SQ,32
SQUARE
FLATPACK, LOW PROFILE
1.6 mm
5.5 V
1.71 V
3.3 V
YES
CMOS
GULL WING
.8 mm
QUAD
PROGRAMMABLE SoC
CY8C4547AXQ-S475
105 Cel
CY8C4547AZI-S455
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Package Equivalence Code: QFP64,.47SQ,20;
10 mm
LFQFP
QFP64,.47SQ,20
FLATPACK, LOW PROFILE, FINE PITCH
.5 mm
CY8C4547AZI-S473
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Package Equivalence Code: QFP48,.35SQ,20;
S-PQFP-G48
7 mm
48
QFP48,.35SQ,20
CY8C4548AZI-S485
CY8C4548AZQ-S483
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Technology: CMOS;
CY8C4546AXI-S475
CY8C4547AZI-S453
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Length: 7 mm;
CY8C4547AZI-S463
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Terminal Pitch: .5 mm;
CY8C4547AZQ-S475
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Terminal Pitch: .5 mm;
CY8C4548AXI-S485
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Terminal Position: QUAD;
CY8C4547AZQ-S473
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Nominal Supply Voltage: 3.3 V;
CY8C4547AZQ-S455
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Nominal Supply Voltage: 3.3 V;
CY8C4548AZI-S483
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
CY8C4546AZI-S475
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Length: 10 mm;
CY8C4546AZI-S473
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Maximum Supply Voltage: 5.5 V;
CY8C4548AZQ-S485
CY8C4548AXQ-S485
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Nominal Supply Voltage: 3.3 V;
CY8C4548AXI-S475
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, LOW PROFILE;
CY8C4547AZQ-S453
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Surface Mount: YES;
CY8C4547AZI-S465
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
MIMX8DL1AVNFZBA
NXP Semiconductors
SoC; Terminal Form: BALL; No. of Terminals: 388; Package Shape: SQUARE; Terminal Position: BOTTOM; Peak Reflow Temperature (C): 260;
S-PBGA-B388
15 mm
3
388
260
1.7 mm
BALL
BOTTOM
40
SoC
SE051A2HQ1/Z01XEZ
SE051A2HQ1/Z01XEZ by NXP Semiconductors is a 20-terminal chip carrier with cryptographic authenticator. It operates b/w -40°C to 105°C, with supply voltage range of 1.62V to 3.6V. Ideal for applications requiring secure authentication in compact spaces.
S-XQCC-N20
3 mm
1
20
UNSPECIFIED
HVQCCN
LCC20,.12SQ,16
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
.33 mm
3.6 V
1.62 V
1.8 V
NO LEAD
.4 mm
CRYPTOGRAPHIC AUTHENTICATOR
SE051P2HQ1/Z011AZ
SE051P2HQ1/Z011AZ by NXP Semiconductors is a cryptographic authenticator IC with 20 terminals, operating voltage range of 1.62V to 3.6V, and max temp of 105°C. Ideal for secure applications requiring high-level encryption in compact designs due to its CMOS technology and small square chip carrier package style.
SE051W2HQ1/Z019TZ
CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
ATSAM4C16CB-AUT
Microchip Technology
Microchip Technology's ATSAM4C16CB-AUT is a 100-terminal uC with CMOS tech. Operates b/w -40 to 85 °C, with supply voltage range of 1.08-1.32 V. Ideal for System on Chip applications due to its thin profile and fine pitch design.
S-PQFP-G100
100
TFQFP
TQFP100,.63SQ
FLATPACK, THIN PROFILE, FINE PITCH
1.2 mm
1.32 V
1.08 V
1.2 V
SYSTEM ON CHIP
ATSAM4C8CB-AUT
Microchip Technology's ATSAM4C8CB-AUT is a 100-terminal, CMOS System on Chip with 1.08-1.32 V supply range and -40 to 85°C operating temp. Ideal for applications requiring a thin profile, fine pitch package such as IoT devices and embedded systems.
ATSAM4C16CB-AUTR
Microchip Technology's ATSAM4C16CB-AUTR is a 100-terminal, CMOS technology System on Chip with 1.08-1.32 V supply voltage range. Ideal for applications requiring high performance in a compact form factor with operating temperatures from -40 to 85 °C.
ATSAM4C8CB-AUTR
Microchip Technology's ATSAM4C8CB-AUTR is a SYSTEM ON CHIP with 100 terminals in a FLATPACK package. It operates b/w -40 to 85 °C with supply voltage range of 1.08V to 1.32V, making it ideal for low-power applications in various electronic devices.
XCVM1302-2MLENSVF1369
Xilinx
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
S-PBGA-B1369
35 mm
1369
110 Cel
0 Cel
HBGA
BGA1369,37X37,36
GRID ARRAY, HEAT SINK/SLUG
4 mm
.825 V
.775 V
.8 V
.92 mm
MICROPROCESSOR CIRCUIT
XCVM1302-2MSINSVF1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;
XCVM1402-1LSENSVF1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
100 Cel
.724 V
.676 V
.7 V
XCVM1402-1LSINSVF1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Length: 35 mm;
XCVM1402-2HSINBVB1024
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1024; Package Code: HBGA; Package Shape: SQUARE; Length: 31 mm;
S-PBGA-B1024
31 mm
1024
BGA1024,32X32,36
2.94 mm
.906 V
.854 V
.88 V
XCVM1402-2HSIVFVC1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.75 mm;
S-PBGA-B1596
37.5 mm
1596
BGA
BGA1596,40X40,36
GRID ARRAY
3.75 mm
XCVM1302-1LLINSVF1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
XCVM1302-1LSINSVF1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .676 V;
XCVM1302-2LLENSVF1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;
XCVM1402-2MLINSVF1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Width: 35 mm;
XCVM1502-1LSINFVB1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1369;
3.83 mm
XCVM1502-1MSINFVB1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA1369,37X37,36;
XCVM1502-2LSENFVB1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVM1502-1MLINFVB1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
XCVM1302-2MSENSVF1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA1369,37X37,36;
XCVM1402-1LLINSVF1369
XCVC1502-1LSENSVG1369
XCVC1502-2HSINSVG1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
XCVC1702-1LLINSVG1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;
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