1932 Microprocessors 45

Part# Info			Specs
Part	RoHS	Manufacturer	Description	ADC Channels	Additional Features	Address Bus Width	Bit Size	Boundary Scan	Bus Compatibility	CPU Family	Maximum Clock Frequency	DAC Channels	DMA Channels	External Data Bus Width	Format	Integrated Cache	JESD-30 Code	JESD-609 Code	Length	Low Power Mode	Moisture Sensitivity Level (MSL)	No. of DMA Channels	No. of External Interrupts	No. of I/O Lines	No. of Serial I/Os	No. of Terminals	On Chip Data RAM Width	On Chip Program ROM Width	Maximum Operating Temperature	Minimum Operating Temperature	PWM Channels	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style (Meter)	Peak Reflow Temperature (C)	Power Supplies (V)	Qualification	RAM Bytes	RAM Words	ROM Words	ROM Programmability	Screening Level	Maximum Seated Height	Speed	Sub-Category	Maximum Supply Current	Maximum Supply Voltage	Minimum Supply Voltage	Nominal Supply Voltage	Surface Mount	Technology	Temperature Grade	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Maximum Time At Peak Reflow Temperature (s)	Total Dose (V)	Width	Peripheral IC Type	Data EEPROM Size	Connectivity	Peripherals	Analog To Digital Convertors
T4081NSE7PQB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1500 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4081NSE7QTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Integrated Cache: YES;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1667 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4081NSE7TTB		NXP Semiconductors	The NXP Semiconductors T4081NSE7TTB microprocessor features a 64-bit external data bus width, 16-bit address bus width, and a max clock frequency of 133.3 MHz. It is ideal for applications requiring high-speed processing and low power consumption, such as embedded systems and IoT devices.			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1800 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4081NSN7PQB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Length: 45 mm;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1500 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4081NSN7QTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1667 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4081NSN7TTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Speed: 1800 rpm;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1800 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4081NXE7PQB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1500 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4081NXE7QTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; External Data Bus Width: 64;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1667 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4081NXE7TTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1800 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4081NXN7PQB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Integrated Cache: YES;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1500 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4081NXN7QTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1932;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1667 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4081NXN7TTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Format: FIXED POINT;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1800 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4160NSE7TTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1800 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4160NSN7TTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1800 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4161NSE7PQB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Format: FIXED POINT;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1500 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4161NSE7QTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1667 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4161NSE7TTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1800 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4161NSN7PQB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Boundary Scan: YES;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1500 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4161NSN7QTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1667 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4161NSN7TTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1800 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4161NXE7PQB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Format: FIXED POINT;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1500 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4161NXE7QTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1667 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4161NXE7TTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Width: 45 mm;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1800 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4161NXN7PQB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Boundary Scan: YES;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1500 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4161NXN7QTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1667 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4161NXN7TTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Address Bus Width: 16;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	HBGA		SQUARE	GRID ARRAY, HEAT SINK/SLUG	250								3.33 mm	1800 rpm						YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4240NSE7PQB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Format: FIXED POINT;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1500 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4240NSE7TTB		NXP Semiconductors	NXP Semiconductors T4240NSE7TTB microprocessor features 64-bit external data bus, 16-bit address bus, and integrated cache. Ideal for applications requiring high processing speed and low power consumption. Package style is grid array with 1932 terminals in a square shape measuring 45mm x 45mm.			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1800 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4240NSN7PQB		NXP Semiconductors	The NXP Semiconductors T4240NSN7PQB microprocessor features a 64-bit external data bus width, 16-bit address bus width, and a max clock frequency of 133.3 MHz. Ideal for applications requiring high-speed processing such as networking equipment, servers, and industrial automation systems.			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1500 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4240NSN7QTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1667 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4240NSN7TTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1800 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4240NXE7PQB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1500 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4240NXN7PQB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Length: 45 mm;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1500 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4241NSE7PQB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 64;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1500 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4241NSE7QTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Integrated Cache: YES;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1667 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4241NSE7TTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1800 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4241NSN7PQB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Low Power Mode: YES;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1500 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4241NSN7QTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1667 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4241NSN7TTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1800 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4241NXE7PQB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1500 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4241NXE7QTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Speed: 1667 rpm;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1667 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4241NXE7TTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.055 V;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1800 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4241NXN7PQB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Format: FIXED POINT;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1500 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4241NXN7QTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Speed: 1667 rpm;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1667 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC
T4241NXN7TTB		NXP Semiconductors	MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;			16		YES			133.3 MHz			64	FIXED POINT	YES	S-PBGA-B1932	e1	45 mm	YES	3					1932						PLASTIC/EPOXY	BGA		SQUARE	GRID ARRAY	250								3.33 mm	1800 rpm			1.055 V	.995 V	1.025 V	YES	CMOS		TIN SILVER COPPER	BALL	1 mm	BOTTOM	30		45 mm	MICROPROCESSOR, RISC