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HVQCCN Power Management ICs 742

Power Management ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Adjustable Threshold Other IC type Nominal Bandwidth Control Mode Control Technique Maximum Input Voltage Minimum Input Voltage Nominal Input Voltage JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage (Vsup) Maximum Negative Input Voltage Normal Position (V) No. of Channels No. of Functions No. of Outputs No. of Terminals Maximum On-state Resistance (Ron) Maximum Operating Temperature Minimum Operating Temperature Output (V) Maximum Output Current Maximum Output Voltage Minimum Output Voltage Nominal Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Protection(s) Qualification Main Out Ripple Voltage Screening Level Maximum Seated Height Sub-Category Maximum Supply Current (Isup) Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage (Vsup) Surface Mount Maximum Switch-on Time Switcher Config Switching (V) Maximum Switching Frequency Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Nominal Threshold Voltage (V) Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Maximum Total Power Output Trim or Adjustable Output (V) Width (mm)
MC33FS8410G3ESR2 by NXP Semiconductors

MC33FS8410G3ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Pitch: .5 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8410G6ESR2 by NXP Semiconductors

MC33FS8410G6ESR2

NXP Semiconductors

MC33FS8410G6ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating b/w -40 to 125°C. It has a supply voltage range of 5.1-36V and max current of 25mA. Ideal for power supply management circuits in automotive applications due to AEC-Q100 screening level.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G0ES by NXP Semiconductors

MC33FS8430G0ES

NXP Semiconductors

MC33FS8430G0ES by NXP Semiconductors is a Power Management IC with 6 channels, operating voltage range of 5.1V to 36V, and AEC-Q100 screening level. It features a package style of CHIP CARRIER and is suitable for automotive power supply management applications.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G0ESR2 by NXP Semiconductors

MC33FS8430G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Position: QUAD;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G2ES by NXP Semiconductors

MC33FS8430G2ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Finish: TIN;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G4ES by NXP Semiconductors

MC33FS8430G4ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Peak Reflow Temperature (C): 260;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8435G0ES by NXP Semiconductors

MC33FS8435G0ES

NXP Semiconductors

MC33FS8435G0ES by NXP Semiconductors is a Power Management IC with 6 channels, operating from -40 to 125 °C. It has a supply voltage range of 5.1V to 36V and a max current of 25mA. This chip carrier package is suitable for power supply management circuits in automotive applications due to its AEC-Q100 screening level.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8435G0ESR2 by NXP Semiconductors

MC33FS8435G0ESR2

NXP Semiconductors

MC33FS8435G0ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating from -40 to 125°C. It features a supply voltage range of 5.1-36V, suitable for automotive applications due to AEC-Q100 screening and compact chip carrier package style.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510A0ES by NXP Semiconductors

MC33FS8510A0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 40;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8530A4ES by NXP Semiconductors

MC33FS8530A4ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G1ES by NXP Semiconductors

MC33FS8430G1ES

NXP Semiconductors

MC33FS8430G1ES by NXP Semiconductors is a Power Management IC with 6 channels, operating from -40 to 125°C. It has a supply voltage range of 5.1-36V and a max seated height of 1mm. Ideal for power supply management circuits in automotive applications due to AEC-Q100 screening level.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G1ESR2 by NXP Semiconductors

MC33FS8430G1ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G2ESR2 by NXP Semiconductors

MC33FS8430G2ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Screening Level: AEC-Q100;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G4ESR2 by NXP Semiconductors

MC33FS8430G4ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8500A0ESR2 by NXP Semiconductors

MC33FS8500A0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Channels: 6;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510A2ES by NXP Semiconductors

MC33FS8510A2ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: -40 Cel;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510D3ES by NXP Semiconductors

MC33FS8510D3ES

NXP Semiconductors

MC33FS8510D3ES by NXP Semiconductors is a Power Management IC with 6 channels, operating b/w -40 to 125°C. It has a supply voltage range of 5.1-36V and terminal pitch of 0.5mm. Ideal for automotive applications due to AEC-Q100 screening level and compact chip carrier package style.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8520A0ESR2 by NXP Semiconductors

MC33FS8520A0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Seated Height: 1 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8530A0ES by NXP Semiconductors

MC33FS8530A0ES

NXP Semiconductors

MC33FS8530A0ES by NXP Semiconductors is a Power Management IC with 6 channels, operating voltage range of 5.1V to 36V, and AEC-Q100 screening level. It comes in a square chip carrier package with 56 terminals, suitable for power supply management circuits in automotive applications.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8530A0ESR2 by NXP Semiconductors

MC33FS8530A0ESR2

NXP Semiconductors

MC33FS8530A0ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating from -40 to 125°C. It has a supply voltage range of 5.1-36V and supports AEC-Q100 screening for automotive applications. The chip carrier package style with a low profile makes it suitable for compact designs in various electronic systems.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8420G0ES by NXP Semiconductors

MC33FS8420G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Channels: 6;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8400G0ES by NXP Semiconductors

MC33FS8400G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8400G5ES by NXP Semiconductors

MC33FS8400G5ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; JESD-30 Code: S-PQCC-N56;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8405G0ESR2 by NXP Semiconductors

MC33FS8405G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Length: 8 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8415G0ESR2 by NXP Semiconductors

MC33FS8415G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Voltage (Vsup): 36 V;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8425G0ES by NXP Semiconductors

MC33FS8425G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Pitch: .5 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8425G0ESR2 by NXP Semiconductors

MC33FS8425G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; JESD-30 Code: S-PQCC-N56;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8500A0ES by NXP Semiconductors

MC33FS8500A0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; JESD-609 Code: e3;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

BQ298009RUGT by Texas Instruments

BQ298009RUGT

Texas Instruments

BQ298009RUGT by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 1.5V to 5.5V, and temperature grade of INDUSTRIAL. It is designed for POWER SUPPLY SUPPORT CIRCUITS in applications requiring a compact CHIP CARRIER package with very thin profile and surface mount capability.

NO

POWER SUPPLY SUPPORT CIRCUIT

S-PQCC-N8

e4

1.5 mm

1

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC8,.06SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.4 mm

.008 mA

5.5 V

1.5 V

3.6 V

YES

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

2.9

30

1.5 mm

BQ25798RQMR by Texas Instruments

BQ25798RQMR

Texas Instruments

BQ25798RQMR by Texas Instruments is a Power Management IC with 29 terminals, operating b/w -40 to 85°C. It supports a supply voltage range of 3.6V to 24V and features a BUCK-BOOST switcher configuration. Ideal for industrial applications requiring adjustable threshold voltages in compact designs.

YES

POWER SUPPLY SUPPORT CIRCUIT

S-PQCC-N29

e4

4 mm

2

1

1

29

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC29,.16SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

24 V

3.6 V

15 V

YES

BUCK-BOOST

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

+3.2V

30

4 mm

MCP16501TA-E/RMBVAO by Microchip Technology

MCP16501TA-E/RMBVAO

Microchip Technology

MCP16501TA-E/RMBVAO by Microchip Technology is a Power Management IC with AEC-Q100 screening. It has 24 terminals, operates b/w -40 to 125 °C, and supports a supply voltage range of 2.7V to 5.5V. Ideal for power supply support circuits in automotive applications due to its compact chip carrier package style and adjustable threshold feature.

YES

POWER SUPPLY SUPPORT CIRCUIT

S-PQCC-N24

4 mm

4

1

24

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

5.5 V

2.7 V

5 V

YES

NO LEAD

.5 mm

QUAD

2.55

4 mm

LP873345RHDT by Texas Instruments

LP873345RHDT

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY SUPPORT CIRCUIT

5.5 V

2.8 V

S-PQCC-N28

e3

5 mm

2

5

1

4

28

125 Cel

-40 Cel

3 A

PLASTIC/EPOXY

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.8 V

3.7 V

YES

2200 kHz

AUTOMOTIVE

MATTE TIN

NO LEAD

.5 mm

QUAD

30

5 mm

LP873244RHDTQ1 by Texas Instruments

LP873244RHDTQ1

Texas Instruments

LP873244RHDTQ1 by Texas Instruments is a Power Management IC with 2 channels, 4 outputs, and a max output current of 2A. It operates b/w -40 to 125°C, suitable for automotive applications due to AEC-Q100 screening level. The IC has a compact chip carrier package with dimensions of 5x5mm and supports an adjustable threshold voltage.

YES

POWER SUPPLY SUPPORT CIRCUIT

5.5 V

2.8 V

S-PQCC-N28

e3

5 mm

2

2

1

4

28

125 Cel

-40 Cel

2 A

PLASTIC/EPOXY

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

5.5 V

2.8 V

3.7 V

YES

2200 kHz

MATTE TIN

NO LEAD

.5 mm

QUAD

+0.36V

30

5 mm

MVR5510AMBA4ES by NXP Semiconductors

MVR5510AMBA4ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Voltage (Vsup): 60 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AVMA4EP by NXP Semiconductors

MVR5510AVMA4EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: NO LEAD;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMA0ES by NXP Semiconductors

MVR5510AMMA0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Adjustable Threshold: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMAHES by NXP Semiconductors

MVR5510AMMAHES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: NO LEAD;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AVMA6EP by NXP Semiconductors

MVR5510AVMA6EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Voltage (Vsup): 60 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AVMAHEP by NXP Semiconductors

MVR5510AVMAHEP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Channels: 9;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMA4ES by NXP Semiconductors

MVR5510AMMA4ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Width (mm): 8 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBA0ES by NXP Semiconductors

MVR5510AMBA0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Voltage (Vsup): 60 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBA6ES by NXP Semiconductors

MVR5510AMBA6ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBAHES by NXP Semiconductors

MVR5510AMBAHES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Supply Voltage (Vsup): 2.7 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMDA6ES by NXP Semiconductors

MVR5510AMDA6ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Nominal Threshold Voltage (V): +7.5V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMDAHES by NXP Semiconductors

MVR5510AMDAHES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMA6ES by NXP Semiconductors

MVR5510AMMA6ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Supply Voltage (Vsup): 2.7 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AVMA0EP by NXP Semiconductors

MVR5510AVMA0EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Length: 8 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

TPS65941111RWERQ1 by Texas Instruments

TPS65941111RWERQ1

Texas Instruments

TPS65941111RWERQ1 by Texas Instruments is a Power Management IC with 3.3V supply voltage, 14A output current, and 2400 kHz switching frequency. Ideal for automotive applications due to AEC-Q100 screening level and -40 to 125 °C operating temperature range. Package style includes chip carrier, heat sink/slug, very thin profile.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e4

8 mm

3

20

1

9

56

125 Cel

-40 Cel

14 A

PLASTIC/EPOXY

HVQCCN

LCC56,.32SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

.9 mm

5.5 V

2.8 V

3.3 V

YES

2400 kHz

AUTOMOTIVE

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.5 mm

QUAD

2.75

30

8 mm