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BQ298009RUGT

Texas Instruments

BQ298009RUGT by Texas Instruments

BQ298009RUGT by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 1.5V to 5.5V, and temperature grade of INDUSTRIAL. It is designed for POWER SUPPLY SUPPORT CIRCUITS in applications requiring a compact CHIP CARRIER package with very thin profile and surface mount capability.

Median Price

$1.150

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,450 parts In-Stock

1+ parts

$1.134

100+ parts

$0.770

1k+ parts

$0.395

10k+ parts

-

2,450

$1.134

$0.770

$0.395

-

DigiKey

USA . 790 parts In-Stock

1+ parts

$1.150

100+ parts

$0.667

1k+ parts

$0.587

10k+ parts

$0.540

790

$1.150

$0.667

$0.587

$0.540

Mouser Electronics

USA . 483 parts In-Stock

1+ parts

$1.150

100+ parts

$0.667

1k+ parts

$0.564

10k+ parts

$0.539

483

$1.150

$0.667

$0.564

$0.539

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,421 parts In-Stock

1+ parts

$1.077

100+ parts

-

1k+ parts

-

10k+ parts

-

3,421

$1.077

-

-

-

Vyrian

USA . 6,935 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,935

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,164 parts In-Stock

1+ parts

$0.960

100+ parts

-

1k+ parts

-

10k+ parts

-

1,164

$0.960

-

-

-

Semicontronic

India . 1,013 parts In-Stock

1+ parts

$0.960

100+ parts

$0.936

1k+ parts

$0.931

10k+ parts

-

1,013

$0.960

$0.936

$0.931

-

Corphita

USA . 1,530 parts In-Stock

1+ parts

$1.021

100+ parts

-

1k+ parts

-

10k+ parts

-

1,530

$1.021

-

-

-

Corohmni

South Africa . 365 parts In-Stock

1+ parts

$1.134

100+ parts

-

1k+ parts

-

10k+ parts

-

365

$1.134

-

-

-

Component Stockers USA

USA . 3,161 parts In-Stock

1+ parts

$1.300

100+ parts

$0.840

1k+ parts

$0.430

10k+ parts

-

3,161

$1.300

$0.840

$0.430

-

Parana Technologies

USA . 344 parts In-Stock

1+ parts

$4.376

100+ parts

-

1k+ parts

$4.794

10k+ parts

-

344

$4.376

-

$4.794

-

DigiPath Technology Company

USA . 138 parts In-Stock

1+ parts

$4.819

100+ parts

-

1k+ parts

-

10k+ parts

-

138

$4.819

-

-

-

ChromeModa Solutions

Germany . 6,385 parts In-Stock

1+ parts

$4.917

100+ parts

$4.032

1k+ parts

-

10k+ parts

-

6,385

$4.917

$4.032

-

-

IDEA Electronic Components Group

UK . 1,521 parts In-Stock

1+ parts

$4.917

100+ parts

-

1k+ parts

$4.425

10k+ parts

-

1,521

$4.917

-

$4.425

-

AZTECH Wire

Italy . 1,090 parts In-Stock

1+ parts

$14.580

100+ parts

-

1k+ parts

-

10k+ parts

-

1,090

$14.580

-

-

-

Native Components

USA . 363 parts In-Stock

1+ parts

$119.405

100+ parts

-

1k+ parts

-

10k+ parts

$114.629

363

$119.405

-

-

$114.629

Northwest PG Solutions

USA . 134 parts In-Stock

1+ parts

$131.345

100+ parts

-

1k+ parts

-

10k+ parts

-

134

$131.345

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 5,003 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,003

-

-

-

-

Overview

Elevate your power management capabilities with the BQ298009RUGT by Texas Instruments. Crafted with precision and expertise, this Power Management IC boasts top-notch quality and reliability. Ideal for a wide range of applications, this product offers unparalleled value and benefits to customers seeking efficient power supply support circuitry. Experience the advantage of cutting-edge technology in a compact chip carrier package, perfect for industrial-grade operations. Trust Texas Instruments to deliver excellence in every detail, ensuring optimal performance and peace of mind for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a longer operational lifespan.

Surface Mount: YES

Facilitates easy installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.6 V

Optimal voltage for efficient power management and performance.

Maximum Operating Temperature: 85 °C

Allows the device to operate reliably in high-temperature environments.

Minimum Operating Temperature: -40 °C

Ensures functionality in low-temperature conditions without sacrificing performance.

Technical Specifications

Power Management ICs BQ298009RUGT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N8

JESD-609 Code:

e4

Length:

1.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.4 mm

Maximum Supply Current (Isup):

.008 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

2.9

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

BQ298009RUGT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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