Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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TMS62828L-85NW
Texas Instruments
TMS62828L-85NW by Texas Instruments is a 128Kx8 SRAM with 85ns access time, operating at 5V. It features 3-STATE output characteristics and consumes a max of 35mA supply current. Ideal for applications requiring fast and reliable memory storage in commercial-grade environments.
85 ns
COMMON
R-PDIP-T32
1048576 bit
STANDARD SRAM
8
32
131072 words
128K
ASYNCHRONOUS
70 Cel
0 Cel
128KX8
3-STATE
PLASTIC/EPOXY
DIP
DIP32,.6
RECTANGULAR
IN-LINE
PARALLEL
5
Not Qualified
.00005 Amp
2 V
SRAMs
35 mA
NO
CMOS
COMMERCIAL
THROUGH-HOLE
2.54 mm
DUAL
UPD44645092AF5-E40-FQ1-A
Renesas Electronics
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: BGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
.45 ns
250 MHz
SEPARATE
R-PBGA-B165
75497472 bit
9
165
8388608 words
8M
SYNCHRONOUS
8MX9
BGA
BGA165,11X15,40
GRID ARRAY
1.5/1.8,1.8
1.7 V
YES
BALL
1 mm
BOTTOM
UPD44645362AF5-E40-FQ1-A
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: BGA; Package Shape: RECTANGULAR; Memory Density: 75497472 bit;
36
2097152 words
2M
2MX36
740 mA
UPD44645362AF5-E50-FQ1-A
200 MHz
650 mA
UPD44645094AF5-E40-FQ1-A
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: BGA; Package Shape: RECTANGULAR; No. of Words: 8388608 words;
.35 Amp
470 mA
UPD44645364AF5-E40-FQ1-A
580 mA
UPD44645364AF5-E50-FQ1-A
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: BGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
510 mA
IS61DDB251236A-250M3L
Integrated Silicon Solution
IS61DDB251236A-250M3L by Integrated Silicon Solution is a 512Kx36 DDR SRAM with synchronous operation and 250 MHz clock frequency. It features a low profile grid array package, operates at 1.8V, and has a memory density of 18874368 bits. Ideal for applications requiring high-speed data processing in commercial temperature environments.
PIPELINED ARCHITECTURE
e1
17 mm
18874368 bit
DDR SRAM
3
1
524288 words
512K
512KX36
LBGA
GRID ARRAY, LOW PROFILE
1.4 mm
.27 Amp
550 mA
1.89 V
1.71 V
1.8
TIN SILVER COPPER
15 mm
IS61QDB251236A-250M3L
IS61QDB251236A-250M3L by Integrated Silicon Solution is a 512Kx36 QDR SRAM with synchronous operation at 250 MHz. It features separate I/O, 3-STATE output, and low profile grid array package. Ideal for high-speed applications requiring fast access time and high memory density.
QDR SRAM
1000 mA
UPD44164184BF5-E40-EQ3-A
DDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA165,11X15,40;
18
1048576 words
1M
1MX18
1.46 mm
.38 Amp
400 mA
1.9 V
13 mm
UPD44165362BF5-E50-EQ3-A
QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B165;
.32 Amp
590 mA
UPD44324182BF5-E33-FQ1-A
DDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
300 MHz
37748736 bit
2MX18
.41 Amp
UPD44325094BF5-E33-FQ1-A
QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Organization: 4MX9;
4194304 words
4M
4MX9
.39 Amp
520 mA
UPD44325362BF5-E50-FQ1-A
QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
1MX36
UPD44324182BF5-E40-FQ1
DDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
1.4 V
430 mA
UPD44325092BF5-E40-FQ1
QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
.3 Amp
UPD44325182BF5-E40-FQ1
QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Access Time: .45 ns;
e0
.31 Amp
610 mA
TIN LEAD
UPD44165182BF5-E33-EQ3
QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.8;
UPD44165184BF5-E33-EQ3
QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
UPD44165364BF5-E40-EQ3
QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, LOW PROFILE;
UPD44645182AF5-E40-FQ1-A
4MX18
630 mA
CY7C1665KV18-450BZXC
Cypress Semiconductor
CY7C1665KV18-450BZXC by Cypress Semiconductor is a 4MX36 QDR SRAM with 450 MHz clock frequency, 1.8V supply, and 0.45ns access time. Ideal for high-speed applications requiring fast data processing and low power consumption in commercial-grade environments.
450 MHz
150994944 bit
4MX36
.46 Amp
1290 mA
7134LA35JI8
Integrated Device Technology
7134LA35JI8 by Integrated Device Technology is a 4Kx8 MULTI-PORT SRAM with 35ns access time, operating at 5V. It features a 52-terminal CHIP CARRIER package and supports ASYNCHRONOUS operation. Ideal for applications requiring fast and reliable memory storage in commercial-grade environments.
35 ns
S-PQCC-J52
32768 bit
MULTI-PORT SRAM
2
52
4096 words
4K
4KX8
QCCJ
LDCC52,.8SQ
SQUARE
CHIP CARRIER
225
.004 Amp
250 mA
J BEND
1.27 mm
QUAD
20
CY7C131-55JXCT
CY7C131-55JXCT by Cypress Semiconductor is a 1Kx8 SRAM with 55ns access time, operating at 5V. It features asynchronous mode, 3-STATE output, and common I/O type. Ideal for commercial applications requiring fast memory access in a compact chip carrier package.
55 ns
INTERRUPT FLAG
e3
19.1262 mm
8192 bit
1024 words
1K
1KX8
260
5.08 mm
.015 Amp
4.5 V
110 mA
5.5 V
Matte Tin (Sn)
CY7C1380D-167AXCT
CY7C1380D-167AXCT by Cypress Semiconductor is a 512Kx36 SRAM with synchronous operation and 3-STATE output. It operates at a max clock frequency of 167 MHz, suitable for applications requiring fast access times such as networking equipment and high-performance computing systems. With a low profile flatpack package style and common I/O type, it offers reliable performance in compact designs.
3.4 ns
167 MHz
R-PQFP-G100
20 mm
100
LQFP
QFP100,.63X.87
FLATPACK, LOW PROFILE
2.5/3.3,3.3
1.6 mm
.07 Amp
275 mA
3.6 V
3.135 V
3.3
MATTE TIN
GULL WING
.65 mm
40
14 mm
CY7C1061AV33-10ZXCT
CY7C1061AV33-10ZXCT by Cypress Semiconductor is a 3.3V SRAM with 1MX16 organization, operating in asynchronous mode. It features 10ns access time, 70°C max temp, and 275mA supply current. Ideal for applications requiring fast memory access in commercial-grade devices.
10 ns
R-PDSO-G54
22.415 mm
16777216 bit
16
54
1MX16
TSOP2
TSOP54,.46,32
SMALL OUTLINE, THIN PROFILE
1.2 mm
.05 Amp
3 V
.8 mm
10.16 mm
CY7C1347G-133AXCT
CY7C1347G-133AXCT by Cypress Semiconductor is a 128KX36 ZBT SRAM with 133 MHz clock frequency, 4 ns access time, and 3.3V supply voltage. Ideal for high-speed synchronous applications requiring fast memory access and low power consumption in commercial-grade environments.
4 ns
133 MHz
4718592 bit
ZBT SRAM
128KX36
.04 Amp
3.14 V
225 mA
3.63 V
CY7C131E-55JXC
CY7C131E-55JXC by Cypress Semiconductor is a 1Kx8 SRAM chip with 55ns access time, operating at 5V. It features asynchronous mode, 3-state output, and common I/O type. Ideal for commercial applications requiring fast memory access in a compact square chip carrier package.
CY7C136E-25JXC
CY7C136E-25JXC by Cypress Semiconductor is a 2Kx8 MULTI-PORT SRAM with 25ns access time, operating at 5V. It features a 3-STATE output and supports asynchronous mode. Ideal for applications requiring fast and reliable memory storage in commercial-grade environments.
25 ns
16384 bit
2048 words
2K
2KX8
30
CY7C136E-25NXC
CY7C136E-25NXC by Cypress Semiconductor is a 2Kx8 MULTI-PORT SRAM with 25 ns access time, operating at 5V. It features a 3-STATE output and operates in asynchronous mode. Ideal for applications requiring fast and reliable memory storage in commercial-grade environments.
S-PQFP-G52
10 mm
QFP
QFP52,.52SQ
FLATPACK
2.5 mm
UPD46184182BF1-E40-EQ1
DDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Access Time: .45 ns;
NOT SPECIFIED
UPD46184184BF1-E40-EQ1-A
DDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
e6
TIN BISMUTH
UPD46184185BF1-E40-EQ1-A
DDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; No. of Words: 1048576 words;
480 mA
UPD46184362BF1-E33-EQ1-A
DDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Organization: 512KX36;
.43 Amp
UPD46184362BF1-E40-EQ1-A
DDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Pitch: 1 mm;
UPD46185092BF1-E40-EQ1-A
QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Organization: 2MX9;
2MX9
UPD46185094BF1-E33-EQ1-A
QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.9 V;
UPD46185094BF1-E40-EQ1-A
QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.46 mm;
UPD46185182BF1-E33-EQ1-A
QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Memory Width: 18;
UPD46185182BF1-E40-EQ1-A
QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Memory Density: 18874368 bit;
UPD46185362BF1-E33-EQ1-A
QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
UPD46185364BF1-E40-EQ1-A
QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Finish: TIN BISMUTH;
UPD46364182BF1-E33-EQ1-A
DDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Memory Width: 18;
UPD46364362BF1-E33-EQ1-A
DDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Organization: 1MX36;
UPD46364365BF1-E40-EQ1-A
DDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
UPD46365084BF1-E40-EQ1-A
QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V;
33554432 bit
4MX8
UPD46365092BF1-E40-EQ1-A
QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Memory Density: 37748736 bit;
UPD46365094BF1-E40-EQ1-A
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