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Flexxon Global Flash Memory 20

Flash Memory
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Alternate Memory Width Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Ready or Busy Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Serial Bus Type Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Type Width Maximum Write Cycle Time (tWC) Write Protection
FEMC016GTTG7-T13-27 by Flexxon Global

FEMC016GTTG7-T13-27

Flexxon Global

FEMC016GTTG7-T13-27 by Flexxon Global is a SLC NAND flash memory with 16GX8 organization and 137.4Gb density. It operates in industrial temperature range (-40 to 85°C) and has AEC-Q100 screening level for automotive applications. The package is rectangular, surface mountable, with 100 terminals at a nominal voltage of 3.3V.

R-PBGA-B100

137438953472 bit

FLASH CARD

8

1

100

17179869184 words

16G

85 Cel

-40 Cel

16GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

SLC NAND TYPE

FEMC032GTTE7-T13-26 by Flexxon Global

FEMC032GTTE7-T13-26

Flexxon Global

FEMC032GTTE7-T13-26 by Flexxon Global is a 32GX8 MLC NAND flash memory with 274877906944-bit density. Operating at -25 to 85 °C, it has AEC-Q100 screening for automotive applications. With 3.3V supply and 100 terminals in a rectangular package, it's ideal for high-density data storage needs.

R-PBGA-B100

274877906944 bit

FLASH CARD

8

1

100

34359738368 words

32G

85 Cel

-25 Cel

32GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

OTHER

BALL

BOTTOM

MLC NAND TYPE

FEMC064GTTE7-T14-46 by Flexxon Global

FEMC064GTTE7-T14-46

Flexxon Global

FEMC064GTTE7-T14-46 by Flexxon Global is a Flash Memory with 64GX8 organization, MLC NAND type, and 549755813888 bit memory density. It operates b/w -25 to 85 °C, suitable for automotive applications meeting AEC-Q100 standards. With 153 terminals and CMOS technology, it offers high performance in a compact rectangular package.

R-PBGA-B153

549755813888 bit

FLASH CARD

8

1

153

68719476736 words

64G

85 Cel

-25 Cel

64GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

OTHER

BALL

BOTTOM

MLC NAND TYPE

FEMC004GTTG7-T13-17 by Flexxon Global

FEMC004GTTG7-T13-17

Flexxon Global

FEMC004GTTG7-T13-17 by Flexxon Global is a SLC NAND flash memory with 4GX8 organization and 4G word code. It operates at industrial temperature grade (-40 to 85 °C) and has a memory density of 34.36Gb. It is suitable for applications requiring high reliability and endurance, such as automotive electronics or industrial control systems.

R-PBGA-B100

34359738368 bit

FLASH CARD

8

1

100

4294967296 words

4G

85 Cel

-40 Cel

4GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

SLC NAND TYPE

FEMC008GTTE7-T13-17 by Flexxon Global

FEMC008GTTE7-T13-17

Flexxon Global

FEMC008GTTE7-T13-17 by Flexxon Global is an SLC NAND flash memory with 8GX8 organization, 3.3V supply voltage, and 85°C max operating temp. Ideal for automotive applications due to AEC-Q100 screening level and TS 16949 certification, offering high reliability in harsh environments.

R-PBGA-B100

68719476736 bit

FLASH CARD

8

1

100

8589934592 words

8G

85 Cel

-25 Cel

8GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

OTHER

BALL

BOTTOM

SLC NAND TYPE

FEMC016GTTG7-T13-16 by Flexxon Global

FEMC016GTTG7-T13-16

Flexxon Global

FEMC016GTTG7-T13-16 by Flexxon Global is a 16GX8 MLC NAND flash card with 137.4Tb memory density, suitable for industrial applications. It operates at -40 to 85°C, has 100 terminals in a rectangular package, and meets AEC-Q100 standards.

R-PBGA-B100

137438953472 bit

FLASH CARD

8

1

100

17179869184 words

16G

85 Cel

-40 Cel

16GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

MLC NAND TYPE

FEMC004GTTG7-T13-16 by Flexxon Global

FEMC004GTTG7-T13-16

Flexxon Global

FEMC004GTTG7-T13-16 by Flexxon Global is a 3.3V MLC NAND Flash Memory with 4GX8 organization, 100 terminals, and 34359738368 bit memory density. It operates in industrial temperature range (-40 to 85 °C) and is suitable for applications requiring high-density storage in automotive electronics or industrial devices.

R-PBGA-B100

34359738368 bit

FLASH CARD

8

1

100

4294967296 words

4G

85 Cel

-40 Cel

4GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

MLC NAND TYPE

FEMC008GTTG7-T13-17 by Flexxon Global

FEMC008GTTG7-T13-17

Flexxon Global

FEMC008GTTG7-T13-17 by Flexxon Global is an 8GX8 SLC NAND flash memory with 68719476736-bit density. Operating at -40 to 85 °C, it's AEC-Q100 and TS 16949 compliant for industrial use. With a rectangular package and PLASTIC/EPOXY material, it has 100 terminals for surface mount applications.

R-PBGA-B100

68719476736 bit

FLASH CARD

8

1

100

8589934592 words

8G

85 Cel

-40 Cel

8GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

SLC NAND TYPE

FEMC016GTTE7-T13-27 by Flexxon Global

FEMC016GTTE7-T13-27

Flexxon Global

FEMC016GTTE7-T13-27 by Flexxon Global is a SLC NAND flash memory with 16GX8 organization and 137.4Gb density. It operates at -25 to 85°C, has 100 terminals, and uses CMOS technology. Ideal for automotive applications due to AEC-Q100 screening level and TS16949 certification.

R-PBGA-B100

137438953472 bit

FLASH CARD

8

1

100

17179869184 words

16G

85 Cel

-25 Cel

16GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

OTHER

BALL

BOTTOM

SLC NAND TYPE

FEMC016GTTE7-T14-16 by Flexxon Global

FEMC016GTTE7-T14-16

Flexxon Global

FEMC016GTTE7-T14-16 by Flexxon Global is a 16GX8 MLC NAND flash memory card with 137.4Tb density and 3.3V supply voltage. Ideal for automotive applications due to AEC-Q100 screening, TS 16949 compliance, and operating temperature range of -25°C to 85°C.

R-PBGA-B153

137438953472 bit

FLASH CARD

8

1

153

17179869184 words

16G

85 Cel

-25 Cel

16GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

OTHER

BALL

BOTTOM

MLC NAND TYPE

FEMC002GTTE7-T14-17 by Flexxon Global

FEMC002GTTE7-T14-17

Flexxon Global

FEMC002GTTE7-T14-17 by Flexxon Global is a SLC NAND flash memory with 2GX8 organization, 17179869184 bit memory density, and 3.3V nominal voltage. Ideal for automotive applications due to AEC-Q100 screening level and TS 16949 certification, operating b/w -25°C to 85°C temperature range.

R-PBGA-B153

17179869184 bit

FLASH CARD

8

1

153

2147483648 words

2G

85 Cel

-25 Cel

2GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

OTHER

BALL

BOTTOM

SLC NAND TYPE

FEMC002GTTG7-T24-17 by Flexxon Global

FEMC002GTTG7-T24-17

Flexxon Global

FEMC002GTTG7-T24-17 by Flexxon Global is a SLC NAND flash memory with 2GX8 organization, 17179869184 bit memory density, and operates at industrial temperature grade. It has 153 terminals, package shape is rectangular made of plastic/epoxy material. Ideal for automotive applications due to AEC-Q100 screening level and TS 16949 certification.

R-PBGA-B153

17179869184 bit

FLASH CARD

8

1

153

2147483648 words

2G

85 Cel

-40 Cel

2GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

SLC NAND TYPE

FEMC008GTTA7-T13-16 by Flexxon Global

FEMC008GTTA7-T13-16

Flexxon Global

FEMC008GTTA7-T13-16 by Flexxon Global is an 8GX8 MLC NAND flash memory card with 68719476736 bit density. Operating at -40 to 85 °C, it has a supply voltage of 3.3V and meets AEC-Q100 standards. Ideal for industrial applications requiring high-density memory in a compact rectangular package.

R-PBGA-B100

68719476736 bit

FLASH CARD

8

1

100

8589934592 words

8G

85 Cel

-40 Cel

8GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

MLC NAND TYPE

FEMC008GTTG7-T13-16 by Flexxon Global

FEMC008GTTG7-T13-16

Flexxon Global

FEMC008GTTG7-T13-16 by Flexxon Global is an 8GX8 MLC NAND flash memory card with 68719476736-bit density. It operates at industrial temperature grade (-40 to 85 °C) and has a supply voltage of 3.3V. Suitable for automotive applications due to AEC-Q100 screening level and TS16949 certification.

R-PBGA-B100

68719476736 bit

FLASH CARD

8

1

100

8589934592 words

8G

85 Cel

-40 Cel

8GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

MLC NAND TYPE

FEMC004GTTE7-T13-17 by Flexxon Global

FEMC004GTTE7-T13-17

Flexxon Global

FEMC004GTTE7-T13-17 by Flexxon Global is a SLC NAND flash memory with 4GX8 organization, 3.3V supply voltage, and 100 terminals. It operates b/w -25°C to 85°C, suitable for automotive applications meeting AEC-Q100 standards. With a memory density of 34.36 Gb, it's ideal for high-performance storage solutions in harsh environments.

R-PBGA-B100

34359738368 bit

FLASH CARD

8

1

100

4294967296 words

4G

85 Cel

-25 Cel

4GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

OTHER

BALL

BOTTOM

SLC NAND TYPE

FEMC004GTTE7-T14-16 by Flexxon Global

FEMC004GTTE7-T14-16

Flexxon Global

FEMC004GTTE7-T14-16 by Flexxon Global is a Flash Memory with 4GX8 organization, MLC NAND type, and 3.3V nominal voltage. It is suitable for applications requiring high memory density and operates in a wide temperature range (-25 to 85 °C).

R-PBGA-B153

34359738368 bit

FLASH CARD

8

1

153

4294967296 words

4G

85 Cel

-25 Cel

4GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

OTHER

BALL

BOTTOM

MLC NAND TYPE

FEMC004GTTG7-T24-16 by Flexxon Global

FEMC004GTTG7-T24-16

Flexxon Global

FEMC004GTTG7-T24-16 by Flexxon Global is a 3.3V MLC NAND flash memory with 4GX8 organization, 34359738368-bit density, and AEC-Q100 screening. Ideal for industrial applications requiring reliable data storage in temperatures ranging from -40 to 85°C. This rectangular package with 153 terminals is designed for surface mount assembly.

R-PBGA-B153

34359738368 bit

FLASH CARD

8

1

153

4294967296 words

4G

85 Cel

-40 Cel

4GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

MLC NAND TYPE

FEMC008GTTE7-T13-16 by Flexxon Global

FEMC008GTTE7-T13-16

Flexxon Global

Flexxon Global's FEMC008GTTE7-T13-16 Flash Memory features 8GX8 organization, MLC NAND technology, and 3.3V nominal voltage. Ideal for automotive applications with AEC-Q100 screening level, TS 16949 certification, and operating temperatures ranging from -25 to 85°C.

R-PBGA-B100

68719476736 bit

FLASH CARD

8

1

100

8589934592 words

8G

85 Cel

-25 Cel

8GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

OTHER

BALL

BOTTOM

MLC NAND TYPE

FEMC016GTTA7-T13-16 by Flexxon Global

FEMC016GTTA7-T13-16

Flexxon Global

FEMC016GTTA7-T13-16 by Flexxon Global is a 16GX8 MLC NAND flash card with 137.4Tb memory density, operating at -40 to 85°C. Suitable for industrial applications, it features AEC-Q100 screening and TS 16949 certification, with a supply voltage of 3.3V and 100 terminals in a rectangular package.

R-PBGA-B100

137438953472 bit

FLASH CARD

8

1

100

17179869184 words

16G

85 Cel

-40 Cel

16GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

MLC NAND TYPE

FEMC016GTTE7-T13-16 by Flexxon Global

FEMC016GTTE7-T13-16

Flexxon Global

FEMC016GTTE7-T13-16 by Flexxon Global is a flash memory with 16GX8 organization and MLC NAND type technology. It has a memory density of 137438953472 bits and operates at temperatures ranging from -25 to 85°C. This memory card is suitable for applications requiring high storage capacity and reliable performance.

R-PBGA-B100

137438953472 bit

FLASH CARD

8

1

100

17179869184 words

16G

85 Cel

-25 Cel

16GX8

PLASTIC/EPOXY

RECTANGULAR

AEC-Q100; TS 16949

3.3

YES

CMOS

OTHER

BALL

BOTTOM

MLC NAND TYPE