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LBGA Flash Memory 107

Flash Memory
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Alternate Memory Width Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Ready or Busy Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Serial Bus Type Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Type Width Maximum Write Cycle Time (tWC) Write Protection
MTFC4GLGDQ-AITATR by Micron Technology

MTFC4GLGDQ-AITATR

Micron Technology

Micron Technology's MTFC4GLGDQ-AITATR is a 4GX8 MLC NAND flash memory with 34359738368-bit density. Operating at 52 MHz, it has a low profile grid array package suitable for synchronous applications. With a wide temperature range (-40 to 85 °C), it offers high-speed parallel data transfer in various electronic devices.

52 MHz

NO

NO

R-PBGA-B100

e1

18 mm

34359738368 bit

FLASH

8

1

100

4294967296 words

4G

SYNCHRONOUS

85 Cel

-40 Cel

4GX8

PLASTIC/EPOXY

LBGA

BGA100,10X17,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

260

1.4 mm

3.6 V

2.7 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

NO

MLC NAND TYPE

14 mm

MTFC4GLMDQ-AITATR by Micron Technology

MTFC4GLMDQ-AITATR

Micron Technology

FLASH CARD; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B100; Memory Density: 34359738368 bit;

52 MHz

R-PBGA-B100

18 mm

34359738368 bit

FLASH CARD

8

1

100

4294967296 words

4G

SYNCHRONOUS

85 Cel

-40 Cel

4GX8

OPEN-DRAIN

PLASTIC/EPOXY

LBGA

BGA100,10X17,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

2.7

1.4 mm

3.6 V

2.7 V

YES

CMOS

BALL

1 mm

BOTTOM

NOT SPECIFIED

MLC NAND TYPE

14 mm

MTFC16GAKAEDQ-AAT by Micron Technology

MTFC16GAKAEDQ-AAT

Micron Technology

FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; Data Polling: NO;

52 MHz

NO

NO

R-PBGA-B100

e4

18 mm

137438953472 bit

FLASH CARD

8

1

100

17179869184 words

16G

SYNCHRONOUS

105 Cel

-40 Cel

16GX8

PLASTIC/EPOXY

LBGA

BGA100,10X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

260

2.7

YES

1.4 mm

3.6 V

2.7 V

YES

CMOS

INDUSTRIAL

Gold (Au) - with Nickel (Ni) barrier

BALL

1 mm

BOTTOM

30

NO

NAND TYPE

14 mm

MTFC64GAJAEDQ-AIT by Micron Technology

MTFC64GAJAEDQ-AIT

Micron Technology

FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;

52 MHz

NO

NO

R-PBGA-B100

18 mm

549755813888 bit

FLASH CARD

8

1

100

68719476736 words

64G

SYNCHRONOUS

85 Cel

-40 Cel

64GX8

PLASTIC/EPOXY

LBGA

BGA100,10X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

2.7

YES

1.4 mm

3.6 V

2.7 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

NO

NAND TYPE

14 mm

MTFC4GLGDQ-AITZ by Micron Technology

MTFC4GLGDQ-AITZ

Micron Technology

FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; Alternate Memory Width: 4;

4

R-PBGA-B100

e1

18 mm

34359738368 bit

FLASH CARD

8

1

100

4294967296 words

4G

SYNCHRONOUS

85 Cel

-40 Cel

4GX8

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

2.7

1.4 mm

3.6 V

2.7 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

14 mm

MTFC8GLWDQ-3LAATZ by Micron Technology

MTFC8GLWDQ-3LAATZ

Micron Technology

FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; No. of Functions: 1;

52 MHz

R-PBGA-B100

18 mm

68719476736 bit

FLASH CARD

8

1

100

8589934592 words

8G

SYNCHRONOUS

105 Cel

-40 Cel

8GX8

PLASTIC/EPOXY

LBGA

BGA100,10X17,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

1.703 mm

3.6 V

2.7 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NAND TYPE

14 mm

MT28EW01GABA1HPC-0AAT by Micron Technology

MT28EW01GABA1HPC-0AAT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Screening Level: AEC-Q100;

105 ns

R-PBGA-B64

13 mm

1073741824 bit

FLASH

16

1

64

67108864 words

64M

ASYNCHRONOUS

105 Cel

-40 Cel

64MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

NOR TYPE

11 mm

MT28EW01GABA1LPC-0AAT by Micron Technology

MT28EW01GABA1LPC-0AAT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;

105 ns

R-PBGA-B64

13 mm

1073741824 bit

FLASH

16

1

64

67108864 words

64M

ASYNCHRONOUS

105 Cel

-40 Cel

64MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

AEC-Q100

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOR TYPE

11 mm

MT28EW512ABA1HPC-0AAT by Micron Technology

MT28EW512ABA1HPC-0AAT

Micron Technology

MT28EW512ABA1HPC-0AAT by Micron Technology is a 32MX16 FLASH Memory IC with 536870912 bit memory density. Operating at 105 ns access time, it has a supply voltage range of 2.7V to 3.6V and supports asynchronous mode. Ideal for industrial applications requiring high-speed data storage in compact form factors.

105 ns

8

R-PBGA-B64

13 mm

536870912 bit

FLASH

16

1

64

33554432 words

32M

ASYNCHRONOUS

105 Cel

-40 Cel

32MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

11 mm

MT28EW512ABA1LPC-0AAT by Micron Technology

MT28EW512ABA1LPC-0AAT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Length: 13 mm;

105 ns

8

R-PBGA-B64

13 mm

536870912 bit

FLASH

16

1

64

33554432 words

32M

ASYNCHRONOUS

105 Cel

-40 Cel

32MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

11 mm

MT28FW512ABA1HPC-0AAT by Micron Technology

MT28FW512ABA1HPC-0AAT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, LOW PROFILE;

105 ns

R-PBGA-B64

13 mm

536870912 bit

FLASH

16

1

64

33554432 words

32M

ASYNCHRONOUS

105 Cel

-40 Cel

32MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

11 mm

MT28FW512ABA1LPC-0AAT by Micron Technology

MT28FW512ABA1LPC-0AAT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.4 mm;

105 ns

R-PBGA-B64

13 mm

536870912 bit

FLASH

16

1

64

33554432 words

32M

ASYNCHRONOUS

105 Cel

-40 Cel

32MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

11 mm

MT28EW01GABA1HPC-1SIT by Micron Technology

MT28EW01GABA1HPC-1SIT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;

95 ns

R-PBGA-B64

13 mm

1073741824 bit

FLASH

16

1

64

67108864 words

64M

ASYNCHRONOUS

85 Cel

-40 Cel

64MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

260

3

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

11 mm

MT28EW01GABA1LPC-1SIT by Micron Technology

MT28EW01GABA1LPC-1SIT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;

95 ns

R-PBGA-B64

13 mm

1073741824 bit

FLASH

16

1

64

67108864 words

64M

ASYNCHRONOUS

85 Cel

-40 Cel

64MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

260

3

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

11 mm

MT28EW512ABA1HPC-1SIT by Micron Technology

MT28EW512ABA1HPC-1SIT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;

95 ns

8

R-PBGA-B64

13 mm

536870912 bit

FLASH

16

1

64

33554432 words

32M

ASYNCHRONOUS

85 Cel

-40 Cel

32MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

3

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

11 mm

MT28EW512ABA1LPC-1SIT by Micron Technology

MT28EW512ABA1LPC-1SIT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;

95 ns

8

R-PBGA-B64

13 mm

536870912 bit

FLASH

16

1

64

33554432 words

32M

ASYNCHRONOUS

85 Cel

-40 Cel

32MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

3

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

11 mm

MT28FW01GABA1HPC-0AAT by Micron Technology

MT28FW01GABA1HPC-0AAT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Technology: CMOS;

R-PBGA-B64

13 mm

1073741824 bit

FLASH

16

1

64

67108864 words

64M

ASYNCHRONOUS

105 Cel

-40 Cel

64MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

NOR TYPE

11 mm

S40410081B1B2I000 by Cypress Semiconductor

S40410081B1B2I000

Cypress Semiconductor

Cypress Semiconductor's S40410081B1B2I000 is a 100-terminal, 8GX8 organization, MLC NAND flash memory with 68719476736-bit density. Operating at -40 to 85 °C, it features synchronous mode and parallel interface for industrial applications. Package: PLASTIC/EPOXY, RECTANGULAR shape, GRID ARRAY style with low profile.

4

R-PBGA-B100

18 mm

68719476736 bit

FLASH

8

1

100

8589934592 words

8G

SYNCHRONOUS

85 Cel

-40 Cel

8GX8

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

MLC NAND TYPE

14 mm

S40410081B1B2W000 by Cypress Semiconductor

S40410081B1B2W000

Cypress Semiconductor

Cypress Semiconductor's S40410081B1B2W000 is a 8GX8 MLC NAND Flash Memory with 68719476736 bit memory density. Operating at 3V, it offers 8589934592 words and features synchronous operation in a low profile grid array package. Ideal for applications requiring high memory capacity and fast data access speeds.

4

R-PBGA-B100

18 mm

68719476736 bit

FLASH

8

1

100

8589934592 words

8G

SYNCHRONOUS

85 Cel

-25 Cel

8GX8

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

OTHER

BALL

1 mm

BOTTOM

MLC NAND TYPE

14 mm

S40410161B1B2I010 by Cypress Semiconductor

S40410161B1B2I010

Cypress Semiconductor

Cypress Semiconductor's S40410161B1B2I010 is a 16GX8 MLC NAND flash memory with 137.4 Gb density. Operating at 3V, it has a temperature range of -40 to 85°C and uses synchronous parallel technology. Ideal for industrial applications requiring high-speed data storage in a compact GRID ARRAY package measuring 18mm x 14mm x 1.4mm.

4

R-PBGA-B100

18 mm

137438953472 bit

FLASH

8

1

100

17179869184 words

16G

SYNCHRONOUS

85 Cel

-40 Cel

16GX8

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

MLC NAND TYPE

14 mm

S40410161B1B2W010 by Cypress Semiconductor

S40410161B1B2W010

Cypress Semiconductor

S40410161B1B2W010 by Cypress Semiconductor is a 16GX8 MLC NAND Flash Memory with 137.4Gb density. Operating at 3V, it has a low profile grid array package and synchronous mode for parallel programming. Ideal for applications requiring high memory capacity in compact devices with temperatures ranging from -25 to 85°C.

4

R-PBGA-B100

18 mm

137438953472 bit

FLASH

8

1

100

17179869184 words

16G

SYNCHRONOUS

85 Cel

-25 Cel

16GX8

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

OTHER

BALL

1 mm

BOTTOM

MLC NAND TYPE

14 mm

MT28EW128ABA1HPC-1SIT by Micron Technology

MT28EW128ABA1HPC-1SIT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Access Time: 70 ns;

70 ns

8

R-PBGA-B64

e1

13 mm

134217728 bit

FLASH

16

1

64

8388608 words

8M

ASYNCHRONOUS

85 Cel

-40 Cel

8MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

260

3

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

11 mm

MT28EW256ABA1HPC-1SIT by Micron Technology

MT28EW256ABA1HPC-1SIT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; No. of Words Code: 16M;

70 ns

8

R-PBGA-B64

13 mm

268435456 bit

FLASH

16

1

64

16777216 words

16M

ASYNCHRONOUS

85 Cel

-40 Cel

16MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

3

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

11 mm

MT28EW256ABA1LPC-1SIT by Micron Technology

MT28EW256ABA1LPC-1SIT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, LOW PROFILE;

70 ns

8

R-PBGA-B64

13 mm

268435456 bit

FLASH

16

1

64

16777216 words

16M

ASYNCHRONOUS

85 Cel

-40 Cel

16MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

3

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

11 mm

MT28FW02GBBA1LPC-0AAT by Micron Technology

MT28FW02GBBA1LPC-0AAT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Length: 13 mm;

105 ns

R-PBGA-B64

13 mm

2147483648 bit

FLASH

16

1

64

134217728 words

128M

ASYNCHRONOUS

105 Cel

-40 Cel

128MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

11 mm

IS21ES04G-JQLI by Integrated Silicon Solution

IS21ES04G-JQLI

Integrated Silicon Solution

IS21ES04G-JQLI by Integrated Silicon Solution is a 4GX8 flash memory with 34359738368 bit density. Operating at 3.3V, it offers synchronous mode and industrial temperature grade suitability. With a package size of 18mm x 14mm, this low-profile grid array memory chip is ideal for high-performance applications requiring parallel data processing.

R-PBGA-B100

e1

18 mm

34359738368 bit

FLASH

8

3

1

100

4294967296 words

4G

SYNCHRONOUS

85 Cel

-40 Cel

4GX8

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

260

3.3

1.4 mm

3.6 V

2.7 V

3.3

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

10

14 mm

MT29F1T08CUCCBH8-6R:C by Micron Technology

MT29F1T08CUCCBH8-6R:C

Micron Technology

MT29F1T08CUCCBH8-6R:C by Micron Technology is a Flash Memory with 128GX8 organization, 3.3V nominal voltage, and 1099511627776 bit memory density. It is used in applications requiring high-speed data storage and retrieval, such as smartphones, tablets, and solid-state drives (SSDs).

R-PBGA-B152

18 mm

1099511627776 bit

FLASH

8

1

152

137438953472 words

128G

SYNCHRONOUS/ASYNCHRONOUS

70 Cel

0 Cel

128GX8

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3.3

1.4 mm

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

MLC NAND TYPE

14 mm

MX66L2G45GXRI00 by Macronix

MX66L2G45GXRI00

Macronix

Macronix's MX66L2G45GXRI00 is a 256MX8 NOR flash memory with 133 MHz clock frequency, SPI serial bus type. Operating at -40 to 85 °C, it offers 100000 write/erase cycles endurance. Ideal for industrial applications requiring high-speed data storage in compact devices.

IT CAN ALSO CONFIGURED AS 1G X 2 AND 2G X 1

4

133 MHz

20

100000 Write/Erase Cycles

R-PBGA-B24

8 mm

2147483648 bit

FLASH

8

1

24

268435456 words

256M

SYNCHRONOUS

85 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

LBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

SERIAL

NOT SPECIFIED

3

1.3 mm

SPI

.0006 Amp

130 mA

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

NOR TYPE

6 mm

HARDWARE/SOFTWARE

MTFC4GMWDQ-3MAIT by Micron Technology

MTFC4GMWDQ-3MAIT

Micron Technology

FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; No. of Words Code: 4G;

R-PBGA-B100

18 mm

34359738368 bit

FLASH CARD

8

1

100

4294967296 words

4G

SYNCHRONOUS

85 Cel

-40 Cel

4GX8

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

2.7

1.4 mm

3.6 V

2.7 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

14 mm

MTFC4GLMDQ-AITZ by Micron Technology

MTFC4GLMDQ-AITZ

Micron Technology

FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;

52 MHz

R-PBGA-B100

18 mm

34359738368 bit

FLASH CARD

8

1

100

4294967296 words

4G

SYNCHRONOUS

85 Cel

-40 Cel

4GX8

OPEN-DRAIN

PLASTIC/EPOXY

LBGA

BGA100,10X17,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

2.7

1.4 mm

3.6 V

2.7 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

MLC NAND TYPE

14 mm

MTFC8GLWDQ-3LAITZ by Micron Technology

MTFC8GLWDQ-3LAITZ

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;

R-PBGA-B100

e1

18 mm

68719476736 bit

FLASH

8

1

100

8589934592 words

8G

SYNCHRONOUS

85 Cel

-40 Cel

8GX8

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

260

2.7

1.4 mm

3.6 V

2.7 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

14 mm

MTFC4GLGDQ-AITA by Micron Technology

MTFC4GLGDQ-AITA

Micron Technology

MTFC4GLGDQ-AITA by Micron Technology is a 4GX8 MLC NAND flash memory with 34359738368-bit density. Operating in synchronous mode, it has a low profile grid array package style and operates at industrial temperature grade. Ideal for applications requiring high memory capacity and fast data access speeds.

R-PBGA-B100

e1

18 mm

34359738368 bit

FLASH CARD

8

1

100

4294967296 words

4G

SYNCHRONOUS

85 Cel

-40 Cel

4GX8

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

260

2.7

1.4 mm

3.6 V

2.7 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

MLC NAND TYPE

14 mm

MTFC4GLGDQ-AITZTR by Micron Technology

MTFC4GLGDQ-AITZTR

Micron Technology

FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; Width: 14 mm;

4

R-PBGA-B100

e1

18 mm

34359738368 bit

FLASH CARD

8

1

100

4294967296 words

4G

SYNCHRONOUS

85 Cel

-40 Cel

4GX8

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

2.7

1.4 mm

3.6 V

2.7 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

14 mm

MTFC4GLMDQ-AITZTR by Micron Technology

MTFC4GLMDQ-AITZTR

Micron Technology

FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; No. of Words: 4294967296 words;

52 MHz

R-PBGA-B100

18 mm

34359738368 bit

FLASH CARD

8

1

100

4294967296 words

4G

SYNCHRONOUS

85 Cel

-40 Cel

4GX8

OPEN-DRAIN

PLASTIC/EPOXY

LBGA

BGA100,10X17,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

2.7

1.4 mm

3.6 V

2.7 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

MLC NAND TYPE

14 mm

S29GL064N90FFIS13 by Infineon Technologies

S29GL064N90FFIS13

Infineon Technologies

FLASH; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Length: 13 mm; Command User Interface: NO;

90 ns

8

NO

NO

R-PBGA-B64

13 mm

67108864 bit

FLASH

16

1

64

4194304 words

4M

ASYNCHRONOUS

85 Cel

-40 Cel

4MX16

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

YES

1.4 mm

64K

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

YES

NOR TYPE

11 mm

S29GL064N90FFIS22 by Infineon Technologies

S29GL064N90FFIS22

Infineon Technologies

FLASH; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Parallel or Serial: PARALLEL;

90 ns

8

NO

NO

R-PBGA-B64

13 mm

67108864 bit

FLASH

16

1

64

4194304 words

4M

ASYNCHRONOUS

85 Cel

-40 Cel

4MX16

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

YES

1.4 mm

64K

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

YES

NOR TYPE

11 mm

S29GL064N90FFIS23 by Infineon Technologies

S29GL064N90FFIS23

Infineon Technologies

FLASH; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Position: BOTTOM;

90 ns

8

NO

NO

R-PBGA-B64

13 mm

67108864 bit

FLASH

16

1

64

4194304 words

4M

ASYNCHRONOUS

85 Cel

-40 Cel

4MX16

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

YES

1.4 mm

64K

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

YES

NOR TYPE

11 mm

S29GL032N11FFIS22 by Infineon Technologies

S29GL032N11FFIS22

Infineon Technologies

FLASH; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Width: 11 mm; Terminal Position: BOTTOM;

110 ns

8

NO

NO

R-PBGA-B64

13 mm

33554432 bit

FLASH

16

1

64

2097152 words

2M

ASYNCHRONOUS

85 Cel

-40 Cel

2MX16

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

YES

1.4 mm

64K

3.6 V

1.65 V

3

YES

CMOS

BALL

1 mm

BOTTOM

YES

NOR TYPE

11 mm

S29GL032N90FFIS12 by Infineon Technologies

S29GL032N90FFIS12

Infineon Technologies

FLASH; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Length: 13 mm; Maximum Seated Height: 1.4 mm;

90 ns

8

NO

NO

R-PBGA-B64

13 mm

33554432 bit

FLASH

16

1

64

2097152 words

2M

ASYNCHRONOUS

85 Cel

-40 Cel

2MX16

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

YES

1.4 mm

64K

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

YES

NOR TYPE

11 mm

S29GL032N90FFIS13 by Infineon Technologies

S29GL032N90FFIS13

Infineon Technologies

FLASH; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, LOW PROFILE; No. of Words Code: 2M;

90 ns

8

NO

NO

R-PBGA-B64

13 mm

33554432 bit

FLASH

16

1

64

2097152 words

2M

ASYNCHRONOUS

85 Cel

-40 Cel

2MX16

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

YES

1.4 mm

64K

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

YES

NOR TYPE

11 mm

S29GL064N11FFIS12 by Infineon Technologies

S29GL064N11FFIS12

Infineon Technologies

FLASH; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Organization: 4MX16; Terminal Position: BOTTOM;

110 ns

8

NO

NO

R-PBGA-B64

13 mm

67108864 bit

FLASH

16

1

64

4194304 words

4M

ASYNCHRONOUS

85 Cel

-40 Cel

4MX16

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

YES

1.4 mm

64K

3.6 V

1.65 V

3

YES

CMOS

BALL

1 mm

BOTTOM

YES

NOR TYPE

11 mm

S29GL064N90FFIS12 by Infineon Technologies

S29GL064N90FFIS12

Infineon Technologies

FLASH; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Programming Voltage (V): 3; Operating Mode: ASYNCHRONOUS;

90 ns

8

NO

NO

R-PBGA-B64

13 mm

67108864 bit

FLASH

16

1

64

4194304 words

4M

ASYNCHRONOUS

85 Cel

-40 Cel

4MX16

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

YES

1.4 mm

64K

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

YES

NOR TYPE

11 mm

S29GL064N90FFIS20 by Infineon Technologies

S29GL064N90FFIS20

Infineon Technologies

S29GL064N90FFIS20 by Infineon Technologies is a 64Mb NOR Flash Memory with 4MX16 organization, operating at 3V. It features an access time of 90ns and offers parallel programming. Ideal for applications requiring fast read/write speeds in a compact form factor.

90 ns

8

NO

NO

R-PBGA-B64

13 mm

67108864 bit

FLASH

16

1

64

4194304 words

4M

ASYNCHRONOUS

85 Cel

-40 Cel

4MX16

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

YES

1.4 mm

64K

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

YES

NOR TYPE

11 mm

S29GL032N90FFIS10 by Infineon Technologies

S29GL032N90FFIS10

Infineon Technologies

FLASH; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Access Time: 90 ns; No. of Words Code: 2M;

90 ns

8

NO

NO

R-PBGA-B64

13 mm

33554432 bit

FLASH

16

3

1

64

2097152 words

2M

ASYNCHRONOUS

85 Cel

-40 Cel

2MX16

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

YES

1.4 mm

64K

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

YES

NOR TYPE

11 mm

S29GL064N11FFIS10 by Infineon Technologies

S29GL064N11FFIS10

Infineon Technologies

FLASH; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; No. of Functions: 1; Nominal Supply Voltage / Vsup (V): 3;

110 ns

8

NO

NO

R-PBGA-B64

13 mm

67108864 bit

FLASH

16

1

64

4194304 words

4M

ASYNCHRONOUS

85 Cel

-40 Cel

4MX16

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

YES

1.4 mm

64K

3.6 V

1.65 V

3

YES

CMOS

BALL

1 mm

BOTTOM

YES

NOR TYPE

11 mm

S29GL064N11FFIS13 by Infineon Technologies

S29GL064N11FFIS13

Infineon Technologies

FLASH; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3; Package Style (Meter): GRID ARRAY, LOW PROFILE;

110 ns

8

NO

NO

R-PBGA-B64

13 mm

67108864 bit

FLASH

16

1

64

4194304 words

4M

ASYNCHRONOUS

85 Cel

-40 Cel

4MX16

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

YES

1.4 mm

64K

3.6 V

1.65 V

3

YES

CMOS

BALL

1 mm

BOTTOM

YES

NOR TYPE

11 mm

S29GL064N11FFIS20 by Infineon Technologies

S29GL064N11FFIS20

Infineon Technologies

FLASH; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel;

110 ns

8

NO

NO

R-PBGA-B64

13 mm

67108864 bit

FLASH

16

1

64

4194304 words

4M

ASYNCHRONOUS

85 Cel

-40 Cel

4MX16

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

YES

1.4 mm

64K

3.6 V

1.65 V

3

YES

CMOS

BALL

1 mm

BOTTOM

YES

NOR TYPE

11 mm

S29GL064N11FFIS22 by Infineon Technologies

S29GL064N11FFIS22

Infineon Technologies

FLASH; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Surface Mount: YES; Maximum Seated Height: 1.4 mm;

110 ns

8

NO

NO

R-PBGA-B64

13 mm

67108864 bit

FLASH

16

1

64

4194304 words

4M

ASYNCHRONOUS

85 Cel

-40 Cel

4MX16

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

YES

1.4 mm

64K

3.6 V

1.65 V

3

YES

CMOS

BALL

1 mm

BOTTOM

YES

NOR TYPE

11 mm