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COMMERCIAL EEPROM 119

EEPROM
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Alternate Memory Width Maximum Clock Frequency (fCLK) Command User Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type I2C Control Byte JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Ready or Busy Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Serial Bus Type Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Total Dose (V) Type Width Maximum Write Cycle Time (tWC) Write Protection
TC58NVG1S3ETA00 by Toshiba

TC58NVG1S3ETA00

Toshiba

EEPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; No. of Sectors/Size: 2K;

25 ns

YES

NO

R-PDSO-G48

e3

18.4 mm

2147483648 bit

EEPROM

8

1

2K

48

268435456 words

256M

SYNCHRONOUS

70 Cel

0 Cel

256MX8

PLASTIC/EPOXY

TSOP1

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

2K

PARALLEL

260

3/3.3

3

Not Qualified

YES

1.2 mm

128K

.00005 Amp

Flash Memories

30 mA

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

TIN

GULL WING

.5 mm

DUAL

NO

NAND TYPE

12 mm

TC58NVG2S0FTA00 by Toshiba

TC58NVG2S0FTA00

Toshiba

EEPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;

R-PDSO-G48

18.4 mm

4294967296 bit

EEPROM

8

1

48

536870912 words

512M

ASYNCHRONOUS

70 Cel

0 Cel

512MX8

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

PARALLEL

3

1.2 mm

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

GULL WING

.5 mm

DUAL

12 mm

24LC65/P by Microchip Technology

24LC65/P

Microchip Technology

24LC65/P by Microchip Technology is an 8KX8 EEPROM with 1000000 Write/Erase Cycles. It operates at 0.1 MHz, has a memory density of 65536 bit, and uses I2C serial bus type. Ideal for applications requiring reliable non-volatile memory storage in commercial temperature grade environments.

.1 MHz

200

1000000 Write/Erase Cycles

1010DDDR

R-PDIP-T8

e3

9.46 mm

65536 bit

EEPROM

8

1

1

8

8192 words

8K

SYNCHRONOUS

70 Cel

0 Cel

8KX8

OPEN-DRAIN

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

SERIAL

3/5

5

Not Qualified

TS 16949

4.32 mm

I2C

.000005 Amp

EEPROMs

3 mA

6 V

2.5 V

5

NO

CMOS

COMMERCIAL

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

5 ms

24LC65T/SM by Microchip Technology

24LC65T/SM

Microchip Technology

24LC65T/SM by Microchip Technology is an EEPROM with 8KX8 organization, 1000000 Write/Erase Cycles endurance, and I2C serial bus type. It operates at 5V nominal voltage and is suitable for applications requiring small outline package style and synchronous operation.

.1 MHz

200

1000000 Write/Erase Cycles

1010DDDR

R-PDSO-G8

e3

5.28 mm

65536 bit

EEPROM

8

1

1

1

8

8192 words

8K

SYNCHRONOUS

70 Cel

0 Cel

8KX8

OPEN-DRAIN

PLASTIC/EPOXY

SOP

SOP8,.3

RECTANGULAR

SMALL OUTLINE

SERIAL

260

3/5

5

Not Qualified

TS 16949

2.03 mm

I2C

.000005 Amp

EEPROMs

3 mA

6 V

2.5 V

5

YES

CMOS

COMMERCIAL

Matte Tin (Sn) - annealed

GULL WING

1.27 mm

DUAL

40

5.25 mm

5 ms

AT28C16-20JC by Atmel

AT28C16-20JC

Atmel

Atmel's AT28C16-20JC is a 2Kx8 EEPROM chip with 3-STATE output, operating at 5V. It offers 10000 Write/Erase cycles, 200ns access time, and supports asynchronous mode. Ideal for applications requiring reliable non-volatile memory storage in commercial temperature environments.

200 ns

AUTOMATIC WRITE; 10K ENDURANCE WRITE CYCLES; DATA RETENTION = 10 YEARS

NO

YES

10

10000 Write/Erase Cycles

R-PQCC-J32

e0

13.97 mm

16384 bit

EEPROM

8

2

1

32

2048 words

2K

ASYNCHRONOUS

70 Cel

0 Cel

2KX8

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

PARALLEL

225

5

5

Not Qualified

3.55 mm

.0001 Amp

EEPROMs

30 mA

5.5 V

4.5 V

5

YES

CMOS

COMMERCIAL

TIN LEAD

J BEND

1.27 mm

QUAD

NO

11.43 mm

1 ms

AT28C16-20SC by Atmel

AT28C16-20SC

Atmel

AT28C16-20SC by Atmel is a 2Kx8 EEPROM with 5V supply, 70°C max temp, and 200ns access time. Ideal for data storage in commercial applications due to its 10000 write/erase cycles endurance and parallel interface. Measuring 15.4mm x 7.5mm x 2.65mm, it features a small outline package with gull wing terminals for surface mounting.

200 ns

AUTOMATIC WRITE; 10K ENDURANCE WRITE CYCLES; DATA RETENTION = 10 YEARS

NO

YES

10

10000 Write/Erase Cycles

R-PDSO-G24

e0

15.4 mm

16384 bit

EEPROM

8

1

24

2048 words

2K

ASYNCHRONOUS

70 Cel

0 Cel

2KX8

3-STATE

PLASTIC/EPOXY

SOP

SOP24,.4

RECTANGULAR

SMALL OUTLINE

PARALLEL

5

5

Not Qualified

2.65 mm

.0001 Amp

EEPROMs

30 mA

5.5 V

4.5 V

5

YES

CMOS

COMMERCIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

NO

7.5 mm

1 ms

AT28LV256-20JC by Atmel

AT28LV256-20JC

Atmel

Atmel's AT28LV256-20JC is a 32Kx8 EEPROM chip with 3.3V supply, 200ns access time, and 10ms write cycle time. Ideal for applications requiring non-volatile memory storage in commercial-grade devices.

200 ns

AUTOMATIC WRITE

NO

YES

10000 Write/Erase Cycles

R-PQCC-J32

e0

13.97 mm

262144 bit

EEPROM

8

2

1

32

32768 words

32K

ASYNCHRONOUS

70 Cel

0 Cel

32KX8

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

64

PARALLEL

225

3.3

3

Not Qualified

3.55 mm

.00002 Amp

EEPROMs

15 mA

3.465 V

3.135 V

3.3

YES

CMOS

COMMERCIAL

TIN LEAD

J BEND

1.27 mm

QUAD

YES

11.43 mm

10 ms

AT28LV256-25PC by Atmel

AT28LV256-25PC

Atmel

EEPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 8;

250 ns

AUTOMATIC WRITE

NO

YES

10000 Write/Erase Cycles

R-PDIP-T28

e0

36.95 mm

262144 bit

EEPROM

8

1

28

32768 words

32K

ASYNCHRONOUS

70 Cel

0 Cel

32KX8

3-STATE

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

64

PARALLEL

3.3

3

Not Qualified

5.59 mm

.00002 Amp

EEPROMs

15 mA

3.465 V

3.135 V

3.3

NO

CMOS

COMMERCIAL

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

YES

15.24 mm

10 ms

24AA65/P by Microchip Technology

24AA65/P

Microchip Technology

24AA65/P by Microchip Technology is an 8KX8 EEPROM with 1000000 Write/Erase Cycles. It operates at 0.1 MHz with a supply voltage range of 1.8-6V, suitable for I2C serial bus applications in commercial temperature grade environments.

.1 MHz

200

1000000 Write/Erase Cycles

1010DDDR

R-PDIP-T8

e3

9.46 mm

65536 bit

EEPROM

8

1

1

8

8192 words

8K

SYNCHRONOUS

70 Cel

0 Cel

8KX8

OPEN-DRAIN

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

SERIAL

2/5

5

Not Qualified

TS 16949

4.32 mm

I2C

.000005 Amp

EEPROMs

3 mA

6 V

1.8 V

5

NO

CMOS

COMMERCIAL

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

5 ms

24C65/P by Microchip Technology

24C65/P

Microchip Technology

24C65/P by Microchip Technology is an EEPROM with a memory density of 65536 bit. It operates in synchronous mode and has a max clock frequency of 0.4 MHz. It is commonly used in applications that require non-volatile memory storage.

.4 MHz

200

1000000 Write/Erase Cycles

1010DDDR

R-PDIP-T8

e3

9.46 mm

65536 bit

EEPROM

8

1

1

8

8192 words

8K

SYNCHRONOUS

70 Cel

0 Cel

8KX8

OPEN-DRAIN

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

SERIAL

5

5

Not Qualified

TS 16949

4.32 mm

I2C

.000005 Amp

EEPROMs

3 mA

6 V

4.5 V

5

NO

CMOS

COMMERCIAL

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

5 ms

24C65/SM by Microchip Technology

24C65/SM

Microchip Technology

24C65/SM by Microchip Technology is an EEPROM with 8KX8 organization, operating at 5V. It features a max clock frequency of 0.4 MHz and offers 1000000 Write/Erase cycles endurance. Ideal for applications requiring reliable non-volatile memory storage in commercial-grade electronic devices.

.4 MHz

200

1000000 Write/Erase Cycles

1010DDDR

R-PDSO-G8

e3

5.28 mm

65536 bit

EEPROM

8

1

1

1

8

8192 words

8K

SYNCHRONOUS

70 Cel

0 Cel

8KX8

OPEN-DRAIN

PLASTIC/EPOXY

SOP

SOP8,.3

RECTANGULAR

SMALL OUTLINE

SERIAL

260

5

5

Not Qualified

TS 16949

2.03 mm

I2C

.000005 Amp

EEPROMs

3 mA

6 V

4.5 V

5

YES

CMOS

COMMERCIAL

Matte Tin (Sn) - annealed

GULL WING

1.27 mm

DUAL

40

5.25 mm

5 ms

TH58NVG4S0FTA20 by Toshiba

TH58NVG4S0FTA20

Toshiba

Toshiba's TH58NVG4S0FTA20 EEPROM operates at 3.3V, with 48 terminals in a small outline package. It has a memory density of 17179869184 bits and is ideal for commercial applications requiring parallel operation with a programming voltage of 3V.

R-PDSO-G48

18.4 mm

17179869184 bit

EEPROM

8

1

48

2147483648 words

2G

ASYNCHRONOUS

70 Cel

0 Cel

2GX8

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

PARALLEL

3

1.2 mm

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

GULL WING

.5 mm

DUAL

12 mm

TH58NVG5S0FTA20 by Toshiba

TH58NVG5S0FTA20

Toshiba

Toshiba's TH58NVG5S0FTA20 EEPROM features 48 terminals, 3.3V supply voltage, and 70°C max temp. Ideal for commercial applications, it offers a memory density of 34359738368 bits in a small outline package with gull wing terminals.

R-PDSO-G48

18.4 mm

34359738368 bit

EEPROM

8

1

48

4294967296 words

4G

ASYNCHRONOUS

70 Cel

0 Cel

4GX8

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

PARALLEL

3

1.2 mm

3.6 V

2.7 V

3.3

YES

CMOS

COMMERCIAL

GULL WING

.5 mm

DUAL

12 mm

AT24C64-10PC by Atmel

AT24C64-10PC

Atmel

AT24C64-10PC by Atmel is an 8Kx8 EEPROM with a max clock frequency of 0.4 MHz and endurance of 1M write/erase cycles. It operates on a 5V supply, has I2C serial bus type, and is commonly used in applications requiring non-volatile memory storage.

DATA RETENTION: 100 YEARS

.4 MHz

100

1000000 Write/Erase Cycles

1010DDDR

R-PDIP-T8

e0

9.59 mm

65536 bit

EEPROM

8

1

8

8192 words

8K

SYNCHRONOUS

70 Cel

0 Cel

8KX8

OPEN-DRAIN

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

SERIAL

5

Not Qualified

5.33 mm

I2C

.000035 Amp

EEPROMs

3 mA

5.5 V

4.5 V

5

NO

CMOS

COMMERCIAL

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

10 ms

HARDWARE

EPC1064VPC8 by Altera

EPC1064VPC8

Altera

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; JESD-609 Code: e0;

4 WIRE INTERFACE TO FLEX 8000 DEVICES

6 MHz

COMMON

R-PDIP-T8

e0

9.398 mm

65536 bit

CONFIGURATION MEMORY

1

1

1

8

65536 words

64K

SYNCHRONOUS

70 Cel

0 Cel

64KX1

3-STATE

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

SERIAL

220

3.3

Not Qualified

4.318 mm

OTP ROMs

3.6 V

3 V

3.3

NO

MOS

COMMERCIAL

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

EPC1064VLC20 by Altera

EPC1064VLC20

Altera

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; JESD-609 Code: e0;

4 WIRE INTERFACE TO FLEX 8000 DEVICES

6 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

65536 bit

CONFIGURATION MEMORY

1

1

1

20

65536 words

64K

SYNCHRONOUS

70 Cel

0 Cel

64KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

220

3.3

Not Qualified

4.572 mm

OTP ROMs

3.6 V

3 V

3.3

YES

MOS

COMMERCIAL

TIN LEAD

J BEND

1.27 mm

QUAD

8.9662 mm

EPC1064VTC32 by Altera

EPC1064VTC32

Altera

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Terminal Pitch: .8 mm;

4 WIRE INTERFACE TO FLEX 8000 DEVICES

4 MHz

COMMON

S-PQFP-G32

e0

7 mm

65536 bit

CONFIGURATION MEMORY

1

3

1

32

65536 words

64K

SYNCHRONOUS

70 Cel

0 Cel

64KX1

3-STATE

PLASTIC/EPOXY

LQFP

TQFP32,.35SQ,32

SQUARE

FLATPACK, LOW PROFILE

220

3.3

Not Qualified

1.27 mm

OTP ROMs

3.6 V

3 V

3.3

YES

MOS

COMMERCIAL

TIN LEAD

GULL WING

.8 mm

QUAD

7 mm

AT28C256-15PC by Atmel

AT28C256-15PC

Atmel

AT28C256-15PC by Atmel is a 32KX8 EEPROM with 10000 Write/Erase Cycles. Operating at 5V, it offers a max access time of 150ns and features a memory density of 262144 bits. Ideal for applications requiring non-volatile memory storage in commercial temperature environments.

150 ns

AUTOMATIC WRITE

NO

YES

10

10000 Write/Erase Cycles

R-PDIP-T28

e0

37.0205 mm

262144 bit

EEPROM

8

1

1

28

32768 words

32K

ASYNCHRONOUS

70 Cel

0 Cel

32KX8

3-STATE

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

64

PARALLEL

225

5

5

Not Qualified

MIL-STD-883

4.826 mm

.0002 Amp

EEPROMs

50 mA

5.5 V

4.5 V

5

NO

CMOS

COMMERCIAL

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

30

YES

15.24 mm

10 ms

AT28HC256-12PC by Atmel

AT28HC256-12PC

Atmel

AT28HC256-12PC by Atmel is a 32KX8 EEPROM with 3-STATE output, operating at 5V. It offers 10000 Write/Erase cycles, 120 ns access time, and supports data polling. Ideal for applications requiring reliable non-volatile memory storage in commercial temperature environments.

120 ns

AUTOMATIC WRITE

NO

YES

10000 Write/Erase Cycles

R-PDIP-T28

e0

37.0205 mm

262144 bit

EEPROM

8

1

1

28

32768 words

32K

ASYNCHRONOUS

70 Cel

0 Cel

32KX8

3-STATE

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

64

PARALLEL

5

5

Not Qualified

MIL-STD-883

4.826 mm

.0003 Amp

EEPROMs

80 mA

5.5 V

4.5 V

5

NO

CMOS

COMMERCIAL

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

YES

15.24 mm

10 ms

AT25010-10PC by Atmel

AT25010-10PC

Atmel

Atmel's AT25010-10PC is a 1024-bit EEPROM with 128x8 organization, operating at 5V. It features SPI serial bus, 3MHz clock frequency, and 1000000 write/erase cycles. Ideal for applications requiring reliable non-volatile memory in commercial temperature environments.

4-WIRE SERIAL INTERFACE

3 MHz

100

1000000 Write/Erase Cycles

R-PDIP-T8

e0

9.59 mm

1024 bit

EEPROM

8

1

8

128 words

128

SYNCHRONOUS

70 Cel

0 Cel

128X8

3-STATE

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

SERIAL

5

Not Qualified

5.33 mm

SPI

.0001 Amp

EEPROMs

6 mA

5.5 V

4.5 V

5

NO

CMOS

COMMERCIAL

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

5 ms

HARDWARE/SOFTWARE

AT28C256E-15SC by Atmel

AT28C256E-15SC

Atmel

EEPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;

150 ns

AUTOMATIC WRITE

NO

YES

100000 Write/Erase Cycles

R-PDSO-G28

e0

17.9 mm

262144 bit

EEPROM

8

2

1

28

32768 words

32K

ASYNCHRONOUS

70 Cel

0 Cel

32KX8

3-STATE

PLASTIC/EPOXY

SOP

SOP28,.4

RECTANGULAR

SMALL OUTLINE

64

PARALLEL

240

5

5

Not Qualified

MIL-STD-883

2.65 mm

.0002 Amp

EEPROMs

50 mA

5.5 V

4.5 V

5

YES

CMOS

COMMERCIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

YES

7.5 mm

10 ms

AT28C256-20JC by Atmel

AT28C256-20JC

Atmel

Atmel's AT28C256-20JC is a 32Kx8 EEPROM chip with 3-STATE output, operating at 5V. It offers 10000 Write/Erase cycles, 200ns access time, and supports asynchronous mode. Ideal for applications requiring non-volatile memory storage in commercial temperature environments.

200 ns

AUTOMATIC WRITE

NO

YES

10000 Write/Erase Cycles

R-PQCC-J32

e0

13.97 mm

262144 bit

EEPROM

8

2

1

32

32768 words

32K

ASYNCHRONOUS

70 Cel

0 Cel

32KX8

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC32,.5X.6

RECTANGULAR

CHIP CARRIER

64

PARALLEL

225

5

5

Not Qualified

MIL-STD-883

3.556 mm

.0002 Amp

EEPROMs

50 mA

5.5 V

4.5 V

5

YES

CMOS

COMMERCIAL

TIN LEAD

J BEND

1.27 mm

QUAD

YES

11.43 mm

10 ms

24AA02/SN by Microchip Technology

24AA02/SN

Microchip Technology

24AA02/SN by Microchip Technology is a 2048-bit EEPROM with 256x8 organization, operating at 5V. It features I2C serial bus, 1000000 write/erase cycles endurance, and synchronous operation. Ideal for applications requiring small outline packages and low power consumption in commercial temperature grades.

.4 MHz

200

1000000 Write/Erase Cycles

1010XXXR

R-PDSO-G8

e3

4.9 mm

2048 bit

EEPROM

8

1

1

1

8

256 words

256

SYNCHRONOUS

70 Cel

0 Cel

256X8

OPEN-DRAIN

PLASTIC/EPOXY

SOP

SOP8,.23

RECTANGULAR

SMALL OUTLINE

SERIAL

260

5

Not Qualified

1.75 mm

I2C

.0001 Amp

3 mA

5.5 V

4.5 V

5

YES

CMOS

COMMERCIAL

MATTE TIN

GULL WING

1.27 mm

DUAL

30

3.9 mm

10 ms

HARDWARE

24LC21/P by Microchip Technology

24LC21/P

Microchip Technology

24LC21/P by Microchip Technology is an EEPROM with 128x8 organization, operating at 5V. It features I2C control byte 1010XXXR and offers 1000000 write/erase cycles. Ideal for applications requiring low power consumption and reliable non-volatile memory storage in commercial temperature environments.

.4 MHz

200

1000000 Write/Erase Cycles

1010XXXR

R-PDIP-T8

e3

9.46 mm

1024 bit

EEPROM

8

1

1

8

128 words

128

SYNCHRONOUS

70 Cel

0 Cel

128X8

OPEN-DRAIN

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

SERIAL

3/5

5

Not Qualified

4.32 mm

I2C

.0001 Amp

EEPROMs

3 mA

5.5 V

4.5 V

5

NO

CMOS

COMMERCIAL

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

10 ms

XC17128ELPD8C by Xilinx

XC17128ELPD8C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Length: 9.3599 mm;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

R-PDIP-T8

e0

9.3599 mm

131072 bit

CONFIGURATION MEMORY

1

1

1

8

131072 words

128K

SYNCHRONOUS

70 Cel

0 Cel

128KX1

3-STATE

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

SERIAL

225

3.3

Not Qualified

4.5974 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

NO

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

THROUGH-HOLE

2.54 mm

DUAL

30

7.62 mm

XC17128EPD8C by Xilinx

XC17128EPD8C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.75 V;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

R-PDIP-T8

e0

9.3599 mm

131072 bit

CONFIGURATION MEMORY

1

1

1

8

131072 words

128K

SYNCHRONOUS

70 Cel

0 Cel

128KX1

3-STATE

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

SERIAL

225

5

Not Qualified

4.5974 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

NO

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

THROUGH-HOLE

2.54 mm

DUAL

30

7.62 mm

XC17256ELPD8C by Xilinx

XC17256ELPD8C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

R-PDIP-T8

e0

9.3599 mm

262144 bit

CONFIGURATION MEMORY

1

1

1

8

262144 words

256K

SYNCHRONOUS

70 Cel

0 Cel

256KX1

3-STATE

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

SERIAL

225

3.3

Not Qualified

4.5974 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

NO

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

THROUGH-HOLE

2.54 mm

DUAL

30

7.62 mm

XC17256EPD8C by Xilinx

XC17256EPD8C

Xilinx

The Xilinx XC17256EPD8C is a 256Kx1 EEPROM with synchronous operation and 3-STATE output. It operates at 5V, has a clock frequency of 15MHz, and is ideal for configuration memory applications. With a package style of IN-LINE and through-hole terminal form, it offers high memory density in a compact design.

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

R-PDIP-T8

e0

9.3599 mm

262144 bit

CONFIGURATION MEMORY

1

1

1

8

262144 words

256K

SYNCHRONOUS

70 Cel

0 Cel

256KX1

3-STATE

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

SERIAL

225

5

Not Qualified

4.5974 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

NO

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

THROUGH-HOLE

2.54 mm

DUAL

30

7.62 mm

XC1765ELPD8C by Xilinx

XC1765ELPD8C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP8,.3;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

2.5 MHz

COMMON

R-PDIP-T8

e0

9.3599 mm

65536 bit

CONFIGURATION MEMORY

1

1

1

8

65536 words

64K

SYNCHRONOUS

70 Cel

0 Cel

64KX1

3-STATE

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

SERIAL

225

3.3

Not Qualified

4.5974 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

NO

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

THROUGH-HOLE

2.54 mm

DUAL

30

7.62 mm

XC1765EPD8C by Xilinx

XC1765EPD8C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Technology: CMOS;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

10 MHz

COMMON

R-PDIP-T8

e0

9.3599 mm

65536 bit

CONFIGURATION MEMORY

1

1

1

8

65536 words

64K

SYNCHRONOUS

70 Cel

0 Cel

64KX1

3-STATE

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

SERIAL

225

5

Not Qualified

4.5974 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

NO

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

THROUGH-HOLE

2.54 mm

DUAL

30

7.62 mm

XC17128ELVO8C by Xilinx

XC17128ELVO8C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Supply Current: 5 mA;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

R-PDSO-G8

e0

4.9276 mm

131072 bit

CONFIGURATION MEMORY

1

3

1

8

131072 words

128K

SYNCHRONOUS

70 Cel

0 Cel

128KX1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

SERIAL

225

3.3

Not Qualified

1.1938 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

30

3.937 mm

XC17128EVO8C by Xilinx

XC17128EVO8C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Form: GULL WING;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

R-PDSO-G8

e0

4.9276 mm

131072 bit

CONFIGURATION MEMORY

1

3

1

8

131072 words

128K

SYNCHRONOUS

70 Cel

0 Cel

128KX1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

SERIAL

225

5

Not Qualified

1.1938 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

30

3.937 mm

XC17256EVO8C by Xilinx

XC17256EVO8C

Xilinx

XC17256EVO8C by Xilinx is a 256KX1 EEPROM with synchronous operation and 3-STATE output. It operates at 5V, has a clock frequency of 15 MHz, and is ideal for configuration memory applications due to its small outline package style.

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

R-PDSO-G8

e0

4.9276 mm

262144 bit

CONFIGURATION MEMORY

1

3

1

8

262144 words

256K

SYNCHRONOUS

70 Cel

0 Cel

256KX1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

SERIAL

225

5

Not Qualified

1.1938 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

30

3.937 mm

XC1736ESO8C by Xilinx

XC1736ESO8C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: Tin/Lead (Sn85Pb15);

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

10 MHz

COMMON

R-PDSO-G8

e0

4.9276 mm

36288 bit

CONFIGURATION MEMORY

1

3

1

8

36288 words

36288

SYNCHRONOUS

70 Cel

0 Cel

36288X1

3-STATE

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

SERIAL

225

5

Not Qualified

1.7272 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

30

3.937 mm

XC1736EVO8C by Xilinx

XC1736EVO8C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Additional Features: USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

10 MHz

COMMON

R-PDSO-G8

e0

4.9276 mm

36288 bit

CONFIGURATION MEMORY

1

3

1

8

36288 words

36288

SYNCHRONOUS

70 Cel

0 Cel

36288X1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

SERIAL

225

5

Not Qualified

1.1938 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

30

3.937 mm

XC1765ELSO8C by Xilinx

XC1765ELSO8C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Standby Current: .00005 Amp;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

2.5 MHz

COMMON

R-PDSO-G8

e0

4.9276 mm

65536 bit

CONFIGURATION MEMORY

1

3

1

8

65536 words

64K

SYNCHRONOUS

70 Cel

0 Cel

64KX1

3-STATE

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

SERIAL

225

3.3

Not Qualified

1.7272 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

30

3.937 mm

XC1765ELVO8C by Xilinx

XC1765ELVO8C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Equivalence Code: TSOP8,.25;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

2.5 MHz

COMMON

R-PDSO-G8

e0

4.9276 mm

65536 bit

CONFIGURATION MEMORY

1

3

1

8

65536 words

64K

SYNCHRONOUS

70 Cel

0 Cel

64KX1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

SERIAL

225

3.3

Not Qualified

1.1938 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

30

3.937 mm

XC1765ESO8C by Xilinx

XC1765ESO8C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Power Supplies (V): 5;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

10 MHz

COMMON

R-PDSO-G8

e0

4.9276 mm

65536 bit

CONFIGURATION MEMORY

1

3

1

8

65536 words

64K

SYNCHRONOUS

70 Cel

0 Cel

64KX1

3-STATE

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

SERIAL

225

5

Not Qualified

1.7272 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

30

3.937 mm

XC1765EVO8C by Xilinx

XC1765EVO8C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; No. of Words: 65536 words;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

10 MHz

COMMON

R-PDSO-G8

e0

4.9276 mm

65536 bit

CONFIGURATION MEMORY

1

3

1

8

65536 words

64K

SYNCHRONOUS

70 Cel

0 Cel

64KX1

3-STATE

PLASTIC/EPOXY

TSOP2

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

SERIAL

225

5

Not Qualified

1.1938 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

1.27 mm

DUAL

30

3.937 mm

XC17128ELPC20C by Xilinx

XC17128ELPC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Peak Reflow Temperature (C): 225;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

131072 bit

CONFIGURATION MEMORY

1

3

1

20

131072 words

128K

SYNCHRONOUS

70 Cel

0 Cel

128KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC17128EPC20C by Xilinx

XC17128EPC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Width: 8.9662 mm;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

131072 bit

CONFIGURATION MEMORY

1

3

1

20

131072 words

128K

SYNCHRONOUS

70 Cel

0 Cel

128KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

5

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC17256EPC20C by Xilinx

XC17256EPC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

262144 bit

CONFIGURATION MEMORY

1

3

1

20

262144 words

256K

SYNCHRONOUS

70 Cel

0 Cel

256KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

5

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC1736EPC20C by Xilinx

XC1736EPC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

10 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

36288 bit

CONFIGURATION MEMORY

1

3

1

20

36288 words

36288

SYNCHRONOUS

70 Cel

0 Cel

36288X1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

5

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC1765ELPC20C by Xilinx

XC1765ELPC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

2.5 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

65536 bit

CONFIGURATION MEMORY

1

3

1

20

65536 words

64K

SYNCHRONOUS

70 Cel

0 Cel

64KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

XC1765EPC20C by Xilinx

XC1765EPC20C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Surface Mount: YES;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

10 MHz

COMMON

S-PQCC-J20

e0

8.9662 mm

65536 bit

CONFIGURATION MEMORY

1

3

1

20

65536 words

64K

SYNCHRONOUS

70 Cel

0 Cel

64KX1

3-STATE

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

5

Not Qualified

4.572 mm

.00005 Amp

OTP ROMs

10 mA

5.25 V

4.75 V

5

YES

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

30

8.9662 mm

AT17LV256-10PC by Atmel

AT17LV256-10PC

Atmel

AT17LV256-10PC by Atmel is a 256KX1 EEPROM with 3.3V supply, 10MHz clock frequency, and 75ns access time. It is ideal for configuration memory applications due to its synchronous operation and 3-STATE output characteristics. The package style is IN-LINE with DUAL terminals in a RECTANGULAR shape, making it suitable for various commercial temperature grade environments.

75 ns

IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO

10 MHz

R-PDIP-T8

e0

9.271 mm

262144 bit

CONFIGURATION MEMORY

1

1

1

8

262144 words

256K

SYNCHRONOUS

70 Cel

0 Cel

256KX1

3-STATE

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

SERIAL

3.3

Not Qualified

5.334 mm

.00005 Amp

EEPROMs

5 mA

3.6 V

3 V

3.3

NO

CMOS

COMMERCIAL

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

AT17LV512-10JC by Atmel

AT17LV512-10JC

Atmel

AT17LV512-10JC by Atmel is a 512KX1 EEPROM chip with synchronous operation, 15 MHz clock frequency, and 524288-bit memory density. It is used in configuration memory applications, operates at 3.3V supply voltage, and has a max temperature of 70°C.

IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO

15 MHz

S-PQCC-J20

e0

8.9662 mm

524288 bit

CONFIGURATION MEMORY

1

2

1

20

524288 words

512K

SYNCHRONOUS

70 Cel

0 Cel

512KX1

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

SERIAL

225

3.3

Not Qualified

4.572 mm

EEPROMs

5 mA

3.6 V

3 V

3.3

YES

CMOS

COMMERCIAL

TIN LEAD

J BEND

1.27 mm

QUAD

8.9662 mm

HARDWARE

XC1701LPD8C by Xilinx

XC1701LPD8C

Xilinx

CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

15 MHz

COMMON

R-PDIP-T8

e0

9.3599 mm

1048576 bit

CONFIGURATION MEMORY

1

1

1

8

1048576 words

1M

SYNCHRONOUS

70 Cel

0 Cel

1MX1

3-STATE

PLASTIC/EPOXY

DIP

DIP8,.3

RECTANGULAR

IN-LINE

SERIAL

225

3.3

Not Qualified

4.5974 mm

.00005 Amp

OTP ROMs

10 mA

3.6 V

3 V

3.3

NO

CMOS

COMMERCIAL

Tin/Lead (Sn85Pb15)

THROUGH-HOLE

2.54 mm

DUAL

30

7.62 mm