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24LC65T/SM

Microchip Technology

24LC65T/SM by Microchip Technology

24LC65T/SM by Microchip Technology is an EEPROM with 8KX8 organization, 1000000 Write/Erase Cycles endurance, and I2C serial bus type. It operates at 5V nominal voltage and is suitable for applications requiring small outline package style and synchronous operation.

Median Price

$1.829

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,621 parts In-Stock

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Q Components

USA . 5,300 parts In-Stock

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VNN

France . 3,934 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,873 parts In-Stock

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A2Z Electronics, Inc.

USA . 1,644 parts In-Stock

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Bristol Electronics

USA . 543 parts In-Stock

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$1.829

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$1.607

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543

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$1.607

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Nova Conductors

Japan . 86 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,343 parts In-Stock

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$11.000

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Microchip USA

USA . 4,043 parts In-Stock

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$13.832

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AZTECH Wire

Italy . 776 parts In-Stock

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$16.170

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Component Stockers USA

USA . 1,833 parts In-Stock

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$36.140

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Kepictronics

USA . 45,279 parts In-Stock

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Metaverse IC Inc.

Canada . 45,279 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,060 parts In-Stock

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Marpe Global Electronics

Taiwan . 7,277 parts In-Stock

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QualityLine Systems

Poland . 7,277 parts In-Stock

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XL Components Corporation

Australia . 7,277 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Perfect Parts

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Overview

Experience the superior quality and reliability of Microchip Technology with the 24LC65T/SM EEPROM. This small outline memory device offers endless possibilities for applications in various industries, providing a seamless experience with its synchronous operating mode and high endurance of 1,000,000 write/erase cycles. Benefit from its wide supply voltage range, low standby current, and ease of integration with its surface-mount package. Trust in the innovative technology and exceptional performance of Microchip Technology to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and durability to the EEPROM, making it a reliable choice for various applications.

Surface Mount: YES

Ease of installation and integration on circuit boards, simplifying manufacturing processes.

Maximum Operating Temperature: 70 °C

Can operate at relatively high temperatures, suitable for applications that require extended operation in harsh environments.

Memory Density: 65536 bit

Offers a high memory density, allowing for storage of a large amount of data in a compact form factor.

Endurance: 1000000 Write/Erase Cycles

High endurance ensures long-term reliability and durability, making it suitable for frequent read and write operations.

Serial Bus Type: I2C

I2C interface provides a simple and efficient way to communicate with other devices, enhancing compatibility and ease of use.

Technical Specifications

EEPROM 24LC65T/SM attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.1 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5.28 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Programming Voltage (V):

5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

2.03 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.25 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

24LC65T/SM Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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