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XC17256EPD8C

Xilinx

XC17256EPD8C by Xilinx

The Xilinx XC17256EPD8C is a 256Kx1 EEPROM with synchronous operation and 3-STATE output. It operates at 5V, has a clock frequency of 15MHz, and is ideal for configuration memory applications. With a package style of IN-LINE and through-hole terminal form, it offers high memory density in a compact design.

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Overview

Unlock the power of reliable data storage with the XC17256EPD8C EEPROM by Xilinx. As a trusted leader in semiconductor technology, Xilinx brings you a high-quality product that offers seamless synchronous operation and 256Kx1 organization for efficient performance. Ideal for a wide range of applications, from industrial automation to consumer electronics, this EEPROM provides customers with unmatched value, benefits, and advantages. Trust Xilinx to deliver excellence in memory solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can protect the internal components of the EEPROM, ensuring a longer lifespan for the product.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer and more efficient communication between the EEPROM and other devices.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes the EEPROM compatible with a wide range of electronic systems and applications.

Maximum Clock Frequency (fCLK): 15 MHz

The high maximum clock frequency enables the EEPROM to process data quickly, making it suitable for applications that require fast read and write speeds.

Memory Density: 262144 bit

With a high memory density, this EEPROM can store a large amount of data, making it ideal for applications that require extensive data storage.

Technical Specifications

EEPROM XC17256EPD8C attributes and parameters. Explore more EEPROM devices from Xilinx

Specs

Additional Features:

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

Maximum Clock Frequency (fCLK):

15 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

Length:

9.3599 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256KX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

225

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.5974 mm

Maximum Standby Current:

.00005 Amp

Sub-Category:

OTP ROMs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.62 mm

Trade Compliance

XC17256EPD8C Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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