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XC17128EPDG8C

Xilinx

XC17128EPDG8C by Xilinx

Xilinx XC17128EPDG8C is a 128Kx1 EEPROM with 15MHz clock frequency, operating at 5V. It features synchronous operation, 3-STATE output, and serial interface. Ideal for configuration memory applications in commercial-grade devices due to its compact size and low standby current of 0.00005A.

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Overview

Unlock the power of advanced memory solutions with the XC17128EPDG8C by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-tier quality and reliability. This EEPROM device offers seamless integration, high performance, and versatility for a wide range of applications. Experience the value of enhanced data storage capabilities, streamlined operations, and increased efficiency with the XC17128EPDG8C. Elevate your projects with this cutting-edge solution from Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, making it suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with most systems and devices.

Maximum Operating Temperature: 70 °C

The high operating temperature range allows the EEPROM to be used in demanding environments without the risk of damage.

Memory Density: 131072 bit

The high memory density of this EEPROM allows for storage of a large amount of data, making it versatile for different applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the EEPROM.

Parallel or Serial: SERIAL

Serial communication provides a simple and efficient way to access and transfer data in the EEPROM.

Technical Specifications

EEPROM XC17128EPDG8C attributes and parameters. Explore more EEPROM devices from Xilinx

Specs

Additional Features:

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

Maximum Clock Frequency (fCLK):

15 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.3599 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128KX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.5974 mm

Maximum Standby Current:

.00005 Amp

Sub-Category:

OTP ROMs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.62 mm

Trade Compliance

XC17128EPDG8C Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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