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XC17S50AVO8C

Xilinx

XC17S50AVO8C by Xilinx

The Xilinx XC17S50AVO8C is a 3.3V EEPROM with 559200-bit memory density, operating in synchronous mode. It features a small outline package and Gull Wing terminals, suitable for configuration memory applications. With a max temperature of 70°C, it offers 3-STATE output characteristics and consumes up to 15mA supply current.

Median Price

$3.080

Lifecycle Status

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VNN

France . 381 parts In-Stock

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Component Electronics Inc.

Canada . 2 parts In-Stock

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Vyrian

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Corohmni

South Africa . 215 parts In-Stock

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MARBEL Systems

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Kenton Components

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Modulus Dynamics

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Qasali Group International

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Microchip USA

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Overview

Unlock the power of innovation with the XC17S50AVO8C by Xilinx, a leading manufacturer known for delivering top-quality electronic components. As an EEPROM device, this product offers versatile applications in various industries, providing customers with reliable storage solutions. With its advanced technology and high-performance features, the XC17S50AVO8C ensures seamless operation and enhanced efficiency. Experience the value and benefits of this cutting-edge product, designed to meet your unique needs and exceed your expectations. Upgrade your projects with the XC17S50AVO8C and take your creativity to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the EEPROM, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on a PCB, saving time and effort during manufacturing.

Operating Mode: SYNCHRONOUS

Enables precise timing and synchronization of data transfers, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage for the EEPROM, ensuring reliable operation and data retention.

Memory Density: 559200 bit

High memory density allows for storing a large amount of data, making it suitable for a variety of applications.

Terminal Finish: Tin/Lead (Sn85Pb15)

Provides a reliable and durable terminal finish for secure connections in electronic circuits.

Maximum Operating Temperature: 70 °C

Can operate effectively within a wide temperature range, suitable for various environmental conditions.

Maximum Supply Current: 15 mA

Low supply current requirement helps in reducing power consumption and extending battery life.

Technical Specifications

EEPROM XC17S50AVO8C attributes and parameters. Explore more EEPROM devices from Xilinx

Specs

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Memory Density:

559200 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

559200 words

No. of Words Code:

559200

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

559200X1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

225

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.001 Amp

Sub-Category:

OTP ROMs

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

XC17S50AVO8C Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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