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24AA02/SN

Microchip Technology

24AA02/SN by Microchip Technology

24AA02/SN by Microchip Technology is a 2048-bit EEPROM with 256x8 organization, operating at 5V. It features I2C serial bus, 1000000 write/erase cycles endurance, and synchronous operation. Ideal for applications requiring small outline packages and low power consumption in commercial temperature grades.

Median Price

$0.310

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 40,500 parts In-Stock

1+ parts

$0.300

100+ parts

$0.270

1k+ parts

$0.260

10k+ parts

$0.250

40,500

$0.300

$0.270

$0.260

$0.250

Mouser Electronics

USA . 213 parts In-Stock

1+ parts

$0.320

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213

$0.320

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$0.282

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15

$0.282

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NAC Semi

USA . 32,400 parts In-Stock

1+ parts

$0.340

100+ parts

$0.310

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$0.270

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32,400

$0.340

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$0.270

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Vyrian

USA . 5,087 parts In-Stock

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Chip Stock

USA . 4,400 parts In-Stock

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4,400

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VNN

France . 836 parts In-Stock

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836

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LIBRA Elektronik GmbH

Germany . 605 parts In-Stock

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605

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Florida Circuit

USA . 137 parts In-Stock

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Rebound Electronics

UK . 100 parts In-Stock

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100

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CirComp Electronics, Inc.

USA . 21 parts In-Stock

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Prism Electronics

USA . 4 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 20,641 parts In-Stock

1+ parts

$0.255

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20,641

$0.255

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Andel Nordic

Denmark . 3,340 parts In-Stock

1+ parts

$6.959

100+ parts

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$6.681

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$6.681

3,340

$6.959

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$6.681

$6.681

Lixinc

USA . 17,538 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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RGB Technical Solutions

Ukraine . 765 parts In-Stock

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765

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Overview

Unlock endless possibilities with the 24AA02/SN EEPROM by Microchip Technology. Designed with precision and reliability in mind, this small outline package offers a seamless integration for your applications. Whether you need to store configuration data or user settings, this EEPROM provides a secure and durable solution with its 1,000,000 write/erase cycles endurance. Trust in Microchip Technology to deliver top-notch quality and performance, so you can focus on what truly matters – achieving your goals effortlessly. Elevate your projects with the 24AA02/SN and experience efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material choice for packaging, ensuring longevity and reliability of the EEPROM.

Surface Mount: YES

Ease of installation onto circuit boards, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS

Efficient operation with synchronous communication, enhancing data transfer speeds.

Nominal Supply Voltage / Vsup (V): 5

Compatibility with standard 5V power supply, making it widely usable in various electronic systems.

Maximum Operating Temperature: 70 °C

Wide operating temperature range, suitable for diverse environmental conditions.

Memory Density: 2048 bit

High memory density allows for storing a significant amount of data in a compact EEPROM.

Endurance: 1000000 Write/Erase Cycles

High endurance ensures long-term usage without degradation of performance.

Technical Specifications

EEPROM 24AA02/SN attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010XXXR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.0001 Amp

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

HARDWARE

Trade Compliance

24AA02/SN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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