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LFBGA Latches & Flip-Flops 18

Latches & Flip-Flops
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Count Direction Family JESD-30 Code JESD-609 Code Length Load Capacitance (CL) Logic IC Type Maximum Frequency At Nominal Supply Maximum I (ol) Moisture Sensitivity Level (MSL) No. of Bits No. of Functions No. of Inputs No. of Ports No. of Terminals Maximum Operating Temperature Minimum Operating Temperature Output Characteristics Output Polarity Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Packing Method Peak Reflow Temperature (C) Power Supplies (V) Maximum Power Supply Current (ICC) Propagation Delay (tpd) Qualification Schmitt Trigger Screening Level Maximum Seated Height Sub-Category Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Trigger Type Width Minimum fmax
SN74SSTUB32864ZKER by Texas Instruments

SN74SSTUB32864ZKER

Texas Instruments

SN74SSTUB32864ZKER by Texas Instruments is a 25-bit TTL latch with 0.8 ns propagation delay, suitable for industrial applications. It operates at a supply voltage of 1.7-1.9V and has a max frequency of 410 MHz. With positive edge trigger type, it is ideal for high-speed data storage and transfer in electronic systems.

SSTU

R-PBGA-B96

e1

13.5 mm

D FLIP-FLOP

410000000 Hz

3

25

1

96

85 Cel

-40 Cel

TRUE

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.8

.8 ns

Not Qualified

1.4 mm

Other Logic ICs

1.9 V

1.7 V

1.8

YES

TTL

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

POSITIVE EDGE

5.5 mm

410 MHz

SSTU32866EC/G,551 by NXP Semiconductors

SSTU32866EC/G,551

NXP Semiconductors

D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

SSTU

R-PBGA-B96

13.5 mm

D FLIP-FLOP

2

25

1

96

70 Cel

0 Cel

OPEN-DRAIN

TRUE

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8 ns

Not Qualified

1.5 mm

1.9 V

1.7 V

1.8

YES

COMMERCIAL

BALL

.8 mm

BOTTOM

POSITIVE EDGE

5.5 mm

450 MHz

SSTUA32866EC/G,518 by NXP Semiconductors

SSTUA32866EC/G,518

NXP Semiconductors

D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;

32866

R-PBGA-B96

13.5 mm

D FLIP-FLOP

2

14

1

96

70 Cel

0 Cel

OPEN-DRAIN

COMPLEMENTARY

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8 ns

Not Qualified

1.5 mm

2 V

1.7 V

1.8

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

POSITIVE EDGE

5.5 mm

450 MHz

SSTUG32866EC/G,518 by NXP Semiconductors

SSTUG32866EC/G,518

NXP Semiconductors

D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;

32866

R-PBGA-B96

13.5 mm

D FLIP-FLOP

2

25

1

96

70 Cel

0 Cel

OPEN-DRAIN

COMPLEMENTARY

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 ns

Not Qualified

1.5 mm

2 V

1.7 V

1.8

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

POSITIVE EDGE

5.5 mm

550 MHz

SSTUG32866EC/S,518 by NXP Semiconductors

SSTUG32866EC/S,518

NXP Semiconductors

D FLIP-FLOP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;

32866

R-PBGA-B96

13.5 mm

D FLIP-FLOP

2

25

1

96

85 Cel

0 Cel

OPEN-DRAIN

COMPLEMENTARY

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 ns

Not Qualified

1.5 mm

2 V

1.7 V

1.8

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

POSITIVE EDGE

5.5 mm

550 MHz

SSTUH32866EC/G,518 by NXP Semiconductors

SSTUH32866EC/G,518

NXP Semiconductors

D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;

SSTU

R-PBGA-B96

13.5 mm

D FLIP-FLOP

2

25

1

96

70 Cel

0 Cel

TRUE

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8 ns

Not Qualified

1.5 mm

1.9 V

1.7 V

1.8

YES

COMMERCIAL

BALL

.8 mm

BOTTOM

POSITIVE EDGE

5.5 mm

450 MHz

SSTUH32866EC/G,551 by NXP Semiconductors

SSTUH32866EC/G,551

NXP Semiconductors

D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;

SSTU

R-PBGA-B96

13.5 mm

D FLIP-FLOP

2

25

1

96

70 Cel

0 Cel

TRUE

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8 ns

Not Qualified

1.5 mm

1.9 V

1.7 V

1.8

YES

COMMERCIAL

BALL

.8 mm

BOTTOM

POSITIVE EDGE

5.5 mm

450 MHz

SSTUM32866EC/S,518 by NXP Semiconductors

SSTUM32866EC/S,518

NXP Semiconductors

D FLIP-FLOP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;

32866

R-PBGA-B96

13.5 mm

D FLIP-FLOP

2

25

1

96

85 Cel

0 Cel

OPEN-DRAIN

COMPLEMENTARY

PLASTIC/EPOXY

LFBGA

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8

1.5 ns

Not Qualified

1.5 mm

Other Logic ICs

2 V

1.7 V

1.8

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

POSITIVE EDGE

5.5 mm

550 MHz

SSTUP32866EC/G,518 by NXP Semiconductors

SSTUP32866EC/G,518

NXP Semiconductors

D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;

32866

R-PBGA-B96

13.5 mm

D FLIP-FLOP

2

25

1

96

70 Cel

0 Cel

OPEN-DRAIN

COMPLEMENTARY

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8 ns

Not Qualified

1.5 mm

2 V

1.7 V

1.8

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

POSITIVE EDGE

5.5 mm

450 MHz

CSSTV32852GKFREP by Texas Instruments

CSSTV32852GKFREP

Texas Instruments

CSSTV32852GKFREP by Texas Instruments is a TTL technology latch with 114 terminals, 3.1 ns propagation delay, and 200 MHz min fmax. It operates b/w -40 to 85°C, suitable for industrial applications requiring fast signal processing in a compact grid array package.

SSTV

R-PBGA-B114

e0

15.5 mm

D FLIP-FLOP

3

1

1

114

85 Cel

-40 Cel

TRUE

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

220

3.1 ns

Not Qualified

1.4 mm

2.7 V

2.3 V

2.5

YES

TTL

INDUSTRIAL

TIN LEAD

BALL

.8 mm

BOTTOM

20

POSITIVE EDGE

5.5 mm

200 MHz

SSTU32866EC/G,557 by NXP Semiconductors

SSTU32866EC/G,557

NXP Semiconductors

D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

SSTU

R-PBGA-B96

13.5 mm

D FLIP-FLOP

2

25

1

96

70 Cel

0 Cel

OPEN-DRAIN

TRUE

PLASTIC/EPOXY

LFBGA

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8

1.8 ns

Not Qualified

1.5 mm

Other Logic ICs

1.9 V

1.7 V

1.8

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

POSITIVE EDGE

5.5 mm

450 MHz

SSTUH32866EC/G,557 by NXP Semiconductors

SSTUH32866EC/G,557

NXP Semiconductors

D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;

SSTU

R-PBGA-B96

13.5 mm

D FLIP-FLOP

2

25

1

96

70 Cel

0 Cel

TRUE

PLASTIC/EPOXY

LFBGA

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8

1.8 ns

Not Qualified

1.5 mm

Other Logic ICs

1.9 V

1.7 V

1.8

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

POSITIVE EDGE

5.5 mm

450 MHz

SN74SSTU32866AZKER by Texas Instruments

SN74SSTU32866AZKER

Texas Instruments

SN74SSTU32866AZKER by Texas Instruments is a 25-bit TTL latch with 2.5 ns propagation delay, operating b/w 0-70°C. It features a low profile grid array package and is suitable for applications requiring fast signal triggering at a supply voltage range of 1.7-1.9V.

SSTU

R-PBGA-B96

e1

13.5 mm

D FLIP-FLOP

3

25

1

96

70 Cel

0 Cel

TRUE

PLASTIC/EPOXY

LFBGA

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.8

2.5 ns

Not Qualified

1.4 mm

Other Logic ICs

1.9 V

1.7 V

1.8

YES

TTL

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

POSITIVE EDGE

5.5 mm

500 MHz

SN74SSTU32866GKER by Texas Instruments

SN74SSTU32866GKER

Texas Instruments

SN74SSTU32866GKER by Texas Instruments is a 25-bit TTL latch with 3ns propagation delay, suitable for commercial applications. Operating at 1.8V, it features positive edge trigger and true output polarity. With a compact grid array package style and low profile design, this flip-flop has a max frequency of 500MHz.

SSTU

R-PBGA-B96

13.5 mm

D FLIP-FLOP

25

1

96

70 Cel

0 Cel

TRUE

PLASTIC/EPOXY

LFBGA

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.8

3 ns

Not Qualified

1.4 mm

Other Logic ICs

1.9 V

1.7 V

1.8

YES

TTL

COMMERCIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

POSITIVE EDGE

5.5 mm

500 MHz

V62/08602-01XA by Texas Instruments

V62/08602-01XA

Texas Instruments

V62/08602-01XA by Texas Instruments is a TTL technology latch with 114 terminals in a low profile grid array package. It operates at 2.5V, has a propagation delay of 3.1ns, and supports a max frequency of 200MHz. Ideal for industrial applications requiring positive edge triggering and true output polarity.

SSTV

R-PBGA-B114

e0

15.5 mm

D FLIP-FLOP

3

1

1

114

85 Cel

-40 Cel

TRUE

PLASTIC/EPOXY

LFBGA

BGA114,6X19,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

220

2.5

3.1 ns

Not Qualified

1.4 mm

Other Logic ICs

2.7 V

2.3 V

2.5

YES

TTL

INDUSTRIAL

TIN LEAD

BALL

.8 mm

BOTTOM

20

POSITIVE EDGE

5.5 mm

200 MHz

CSSTV32867SGKEREP by Texas Instruments

CSSTV32867SGKEREP

Texas Instruments

Texas Instruments CSSTV32867SGKEREP is a 26-bit latch with 5.5ns propagation delay and 200MHz min fmax. Suitable for industrial applications, it operates b/w -40 to 85°C, has a low profile grid array package, and supports positive edge trigger type.

SSTV

R-PBGA-B96

e0

13.5 mm

D FLIP-FLOP

3

26

1

96

85 Cel

-40 Cel

TRUE

PLASTIC/EPOXY

LFBGA

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

220

2.5

5.5 ns

Not Qualified

1.4 mm

Other Logic ICs

2.7 V

2.3 V

2.5

YES

INDUSTRIAL

TIN LEAD

BALL

.8 mm

BOTTOM

20

POSITIVE EDGE

5.5 mm

200 MHz

SN74SSTUB32866NMJR by Texas Instruments

SN74SSTUB32866NMJR

Texas Instruments

SN74SSTUB32866NMJR by Texas Instruments is a 25-bit TTL latch with 0.8 ns propagation delay, suitable for industrial applications. It operates at a supply voltage range of 1.7V to 1.9V and has a max frequency of 410MHz. This surface-mount device features positive edge triggering and low profile packaging, making it ideal for high-speed data processing systems.

SSTU

R-PBGA-B96

e1

13.5 mm

D FLIP-FLOP

410000000 Hz

3

25

1

96

85 Cel

-40 Cel

TRUE

PLASTIC/EPOXY

LFBGA

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

TR

260

40 mA

.8 ns

1.4 mm

1.9 V

1.7 V

1.8

YES

TTL

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

POSITIVE EDGE

5.5 mm

410 MHz

SN74SSTUB32864NMJR by Texas Instruments

SN74SSTUB32864NMJR

Texas Instruments

SN74SSTUB32864NMJR by Texas Instruments is a 25-bit latch with 0.8 ns propagation delay, suitable for industrial applications. It operates at a supply voltage range of 1.7V to 1.9V and has a max frequency of 410 MHz. This CMOS technology flip-flop features positive edge trigger and low profile grid array packaging for high-speed data processing.

SSTU

R-PBGA-B96

e1

13.5 mm

D FLIP-FLOP

410000000 Hz

8 Amp

3

25

1

96

85 Cel

-40 Cel

TRUE

PLASTIC/EPOXY

LFBGA

BGA96,6X16,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

TR

260

40 mA

.8 ns

1.4 mm

1.9 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

POSITIVE EDGE

5.5 mm

410 MHz