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CSSTV32852GKFREP

Texas Instruments

CSSTV32852GKFREP by Texas Instruments

CSSTV32852GKFREP by Texas Instruments is a TTL technology latch with 114 terminals, 3.1 ns propagation delay, and 200 MHz min fmax. It operates b/w -40 to 85°C, suitable for industrial applications requiring fast signal processing in a compact grid array package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,881 parts In-Stock

1+ parts

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7,881

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Digiode

USA . 536 parts In-Stock

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536

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 673 parts In-Stock

1+ parts

$0.235

100+ parts

-

1k+ parts

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$0.226

673

$0.235

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$0.226

Northwest PG Solutions

USA . 1,561 parts In-Stock

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$0.258

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-

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$0.228

1,561

$0.258

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$0.228

AZTECH Wire

Italy . 637 parts In-Stock

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$9.069

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637

$9.069

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Parana Technologies

USA . 46 parts In-Stock

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$28.947

100+ parts

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$53.560

10k+ parts

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46

$28.947

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$53.560

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One Stop Electronics

USA . 893 parts In-Stock

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$31.000

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893

$31.000

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DigiPath Technology Company

USA . 736 parts In-Stock

1+ parts

$31.874

100+ parts

$29.325

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736

$31.874

$29.325

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ChromeModa Solutions

Germany . 1,187 parts In-Stock

1+ parts

$32.525

100+ parts

$26.670

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1,187

$32.525

$26.670

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IDEA Electronic Components Group

UK . 957 parts In-Stock

1+ parts

$32.525

100+ parts

$30.899

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$29.272

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957

$32.525

$30.899

$29.272

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Corphita

USA . 2,381 parts In-Stock

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Perfect Parts

USA . 1,949 parts In-Stock

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Microchip USA

USA . 223 parts In-Stock

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Overview

Unlock a world of possibilities with the CSSTV32852GKFREP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability in their latches & flip-flops category. Perfect for a wide range of applications, this product offers customers exceptional value with its fast propagation delay, low profile design, and industrial-grade temperature performance. Experience the benefits of true output polarity, positive edge triggering, and high-speed technology without compromising on quality. Trust Texas Instruments to provide you with the innovative solutions you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Being surface mountable makes installation and mounting easy, saving time and effort in the assembly process.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a standard voltage of 2.5V makes it compatible with a wide range of systems and power sources.

Propagation Delay (tpd): 3.1 ns

The low propagation delay enables fast and efficient operation, making it suitable for high-speed applications.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, ensuring performance in harsh environments.

Technology: TTL

Utilizing TTL technology means compatibility with TTL logic levels, making it versatile for various digital applications.

Technical Specifications

Latches & Flip-Flops CSSTV32852GKFREP attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

SSTV

JESD-30 Code:

R-PBGA-B114

JESD-609 Code:

e0

Length:

15.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

114

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Propagation Delay (tpd):

3.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Trigger Type:

POSITIVE EDGE

Width:

5.5 mm

Minimum fmax:

200 MHz

Trade Compliance

CSSTV32852GKFREP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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