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SN74SSTUB32866NMJR

Texas Instruments

SN74SSTUB32866NMJR by Texas Instruments

SN74SSTUB32866NMJR by Texas Instruments is a 25-bit TTL latch with 0.8 ns propagation delay, suitable for industrial applications. It operates at a supply voltage range of 1.7V to 1.9V and has a max frequency of 410MHz. This surface-mount device features positive edge triggering and low profile packaging, making it ideal for high-speed data processing systems.

Median Price

$16.090

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 99 parts In-Stock

1+ parts

$16.090

100+ parts

$10.320

1k+ parts

$8.560

10k+ parts

-

99

$16.090

$10.320

$8.560

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,177 parts In-Stock

1+ parts

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8,177

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Digiode

USA . 4,390 parts In-Stock

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-

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4,390

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 1,183 parts In-Stock

1+ parts

$11.770

100+ parts

$11.770

1k+ parts

-

10k+ parts

-

1,183

$11.770

$11.770

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Parana Technologies

USA . 1,572 parts In-Stock

1+ parts

$25.628

100+ parts

-

1k+ parts

$26.236

10k+ parts

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1,572

$25.628

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$26.236

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DigiPath Technology Company

USA . 1,126 parts In-Stock

1+ parts

$28.220

100+ parts

-

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10k+ parts

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1,126

$28.220

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ChromeModa Solutions

Germany . 2,111 parts In-Stock

1+ parts

$28.796

100+ parts

$23.613

1k+ parts

-

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2,111

$28.796

$23.613

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IDEA Electronic Components Group

UK . 177 parts In-Stock

1+ parts

$28.796

100+ parts

$27.356

1k+ parts

$25.916

10k+ parts

-

177

$28.796

$27.356

$25.916

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

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6,000

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Corphita

USA . 496 parts In-Stock

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496

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Overview

Experience superior performance and reliability with the SN74SSTUB32866NMJR by Texas Instruments, a leading manufacturer in the industry. As part of the Latches & Flip-Flops category, this product offers lightning-fast 0.8ns propagation delay and a package body material of durable PLASTIC/EPOXY. Ideal for industrial applications, this component boasts 25 bits and operates at a nominal supply voltage of 1.8V. With a compact rectangular shape and surface mount capability, the SN74SSTUB32866NMJR provides exceptional value and efficiency to customers seeking top-tier electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the latch, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 0.8 ns

Fast propagation delay allows for quick signal processing and response times, making this latch suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and making it suitable for compact designs.

No. of Bits: 25

25 bits provide ample storage capacity for data processing and manipulation, making this latch versatile for various applications.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a nominal supply voltage of 1.8V ensures compatibility with standard power sources and helps in reducing power consumption.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this latch can handle high-temperature environments, suitable for industrial applications.

Technology: TTL

Utilizing TTL technology ensures reliable and efficient signal processing, making this latch a dependable choice for digital circuits.

Technical Specifications

Latches & Flip-Flops SN74SSTUB32866NMJR attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

SSTU

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13.5 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

410000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

25

No. of Functions:

1

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

40 mA

Propagation Delay At Nominal Supply:

.8 ns

Propagation Delay (tpd):

.8 ns

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.5 mm

Minimum fmax:

410 MHz

Trade Compliance

SN74SSTUB32866NMJR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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