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MT8870DS1-1

Zarlink Semiconductor

MT8870DS1-1 by Zarlink Semiconductor

DTMF SIGNALING CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR;

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Technical Specifications

Telecom - Signaling ICs MT8870DS1-1 attributes and parameters. Explore more Telecom - Signaling ICs devices from Zarlink Semiconductor

Specs

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e3

Length:

11.55 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Telecom Signaling Circuits

Maximum Supply Current:

.009 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MT8870DS1-1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Zarlink Semiconductor

Zarlink Semiconductor - Microsemi Company Overview Zarlink Semiconductor was acquired by Microsemi as of October 2011. Microsemi Corporation offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Zarlink Semiconductor - Microsemi Products The types of products manufactured by Zarlink Semiconductor - Microsemi include Analog Switches, Medical Surge Protection ICs, Laser Diode Drivers (LDD), Analog Amplifiers, Telephony ICs, Packet Processing ICs, Packet Switching ICs, Timing and Synchronization (DS1/E1, SONET/SDH) ICs, TDM/TSI Switches, ATM (Asynchronous Transfer Mode) ICs, Voice Processing ICs, Optoelectronic Products, Frequency Synthesis Products, Wireless Data Products, Ultra-low Power Communication Products, Baseband Signal Processing Products, and Cellular Telephony Products.

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