Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;
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Field Programmable Gate Arrays (FPGA) XCV800-4BG432C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
Programmable IC Type:
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Peak Reflow Temperature:
Peak Reflow Time:
Moisture Sensitivity Level (MSL):
Package Body Material:
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JESD-30 Code:
JESD-609 Code:
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XCV800-4BG432C Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
1N4148
Gulf Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
EU2B-YS3203C
Idec
ROTARY SWITCH;
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
SS14
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR0530T1G
Onsemi
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
USB3320C-EZK-TR
Standard Microsystems
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
1N4148WT
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
EU2B-YS3203F
Dc Components
2N2222A
Semiconductor Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
Multicomp Pro
0462-201-16141
TE Connectivity
TE Connectivity's 0462-201-16141 is a CRIMP terminal with MACHINED contact design. It operates b/w -55 to 125 °C, suitable for wire gauges from 20 to 16 AWG. With a rated current of 13A, it is ideal for applications requiring FEMALE ROUND PIN-SOCKET contacts.
Hitachi
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
1N4148WS
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
EP3C5E144C8N
Altera
EP3C5E144C8N by Altera is a CMOS FPGA with 5136 logic cells and 94 inputs/outputs. It operates at a maximum clock frequency of 472.5 MHz and has a low profile package shape. Ideal for various applications.
10M40SAE144I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
10M04SAU169C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
EP3C55F484C8N
Intel
EP3C55F484C8N by Intel is a CMOS FPGA with 55856 logic cells and CLBs. It operates at a max frequency of 472.5 MHz, suitable for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. With a package style of grid array and moisture sensitivity level of 3, it offers reliable performance in various environments.
10M08SCE144A7G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
5CEBA7F23C8N
Intel's 5CEBA7F23C8N FPGA boasts 150000 logic cells, 240 inputs/outputs, and operates at a max voltage of 1.13V. Ideal for applications requiring high-speed data processing and complex algorithm implementation in various industries.
EP2C20Q240C8N
The Intel EP2C20Q240C8N FPGA features 18752 logic cells, 1172 CLBs, and a max clock frequency of 402.5 MHz. Ideal for applications requiring high-speed processing and programmable ICs in fields like telecommunications, aerospace, and industrial automation.
XC7K410T-2FFG900I
Xilinx
Xilinx XC7K410T-2FFG900I FPGA features 406720 logic cells, 31775 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring advanced programmable ICs with a grid array package style.
LCMXO2-256ZE-1MG132C
Lattice Semiconductor
LCMXO2-256ZE-1MG132C by Lattice Semiconductor is a 256 Logic Cell FPGA with 55 inputs/outputs, operating at 1.2V. It comes in a square grid array package and is suitable for applications requiring low power consumption and high flexibility in electronic designs.
LCMXO2-640UHC-4TG144I
LCMXO2-640UHC-4TG144I by Lattice Semiconductor is a 640 logic cell FPGA with 107 inputs/outputs. Operating at 2.5V, it has a max supply voltage of 3.465V and can withstand temperatures from -40 to 100°C. Ideal for applications requiring high-performance programmable ICs in compact form factors.
ICE40LP8K-CM81TR
ICE40LP8K-CM81TR by Lattice Semiconductor is a CMOS FPGA with 7680 logic cells, 960 CLBs, and 63 inputs/outputs. It operates at 1.2V with a max combinatorial delay of 9.36ns. Ideal for industrial applications requiring high-speed processing in compact designs due to its fine pitch grid array package style and low operating temperature range of -40 to 100°C.
LCMXO2-1200ZE-1TG144C
LCMXO2-1200ZE-1TG144C by Lattice Semiconductor is a 1280 logic cell FPGA with max clock freq of 133MHz. It operates at 1.2V, has 107 inputs/outputs, and can withstand temps from 0 to 85°C. Ideal for applications requiring high-speed processing in compact designs.
LCMXO2-2000HC-4TG100C
LCMXO2-2000HC-4TG100C by Lattice Semiconductor is a 2112 logic cell FPGA with 79 inputs/outputs, operating at max 133 MHz. Ideal for applications requiring high-speed processing in compact designs, it features a plastic/epoxy package body and operates b/w 0-85°C temperature range.
XC7A75T-2CSG324I
The Xilinx XC7A75T-2CSG324I is a FPGA with 75520 logic cells, 5900 CLBs, and a max clock frequency of 1286 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for complex designs. With a package style of grid array and low profile, it offers versatile solutions for various electronic systems.
M1AGL250V5-FGG144I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE;
A3PE1500-PQG208I
Microchip Technology
A3PE1500-PQG208I by Microchip Technology is a CMOS FPGA with 38400 logic cells and 1500000 equivalent gates. It operates at a supply voltage of 1.5V, suitable for industrial applications requiring high-speed processing and programmable logic capabilities in a compact 28mm square package.
EP3C25F324C8NES
EP3C25F324C8NES by Intel is a FPGA with 24624 CLBs, operating at max frequency of 472.5 MHz. It has a package style of GRID ARRAY and can handle temperatures from 0 to 85 °C. Ideal for applications requiring high-speed processing and programmable logic in compact form factor.
LCMXO2-1200HC-4TG100C
LCMXO2-1200HC-4TG100C by Lattice Semiconductor is a 1280 logic cell FPGA with max clock freq of 133MHz. Operating at 85°C, it has 79 inputs/outputs and uses PLASTIC/EPOXY package material. Ideal for applications requiring high-speed processing in compact designs.
M1A3P1000-FG144M
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE;
EP4CE6F17I7N
EP4CE6F17I7N by Intel is a FPGA with 6272 logic cells, 392 CLBs, and a max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable IC capabilities, making it ideal for telecommunications, industrial automation, and signal processing systems.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCV800-4HQ240C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;
XCV800-4FG676C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XCV800-4BGG432C
XCV800-4FGG680C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE;
XCV800-4FG680C
XCV800-4FG600C
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 600; Package Code: BGA; Power Supplies (V): 1.2/3.6,2.5; No. of Outputs: 404;
XCV800-4HQ240I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE; Organization: 4704 CLBS, 888439 GATES;
XCV800-4BG432I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
XCV800-4FG676I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
XCV800-4BGG432I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .8 ns;
XCV800-4FGG676I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B676;
XCV800-4FG680I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
XCV800-4BGG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .8 ns;
XCV800-4FGG680I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .8 ns;
XCV800-4BG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; No. of Equivalent Gates: 888439;
XCV800-4FG600I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 600; Package Code: BGA; Maximum Operating Temperature: 100 Cel; Maximum Supply Voltage: 2.625 V;
XCV800-4BG560C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;
XCV800-4BGG560C
XCV800-4FGG676C
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