Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;
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$137.340
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Field Programmable Gate Arrays (FPGA) XCV300-5FG456I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
Programmable IC Type:
No. of Logic Cells:
No. of Inputs:
No. of Outputs:
No. of CLBs:
No. of Equivalent Gates:
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Organization:
Nominal Supply Voltage:
Minimum Supply Voltage:
Maximum Supply Voltage:
Power Supplies:
Peak Reflow Temperature:
Peak Reflow Time:
Moisture Sensitivity Level (MSL):
Package Body Material:
Surface Mountable:
Package Style:
Package Code:
Package Shape:
Length:
Width:
Maximum Seated Height:
Package Equivalence Code:
Terminal Position:
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No. of Terminals:
JESD-30 Code:
JESD-609 Code:
Qualified:
XCV300-5FG456I Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Spartan,Virtex FPGA/SCD 18/Oct/2010
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
BAV99
Kingwell Technonlogy
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
ROHM
2N2222A
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
BSS138
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
LL4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
American Power Devices
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Uniohm
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Intertechnology
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
Meritek Electronics
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
EU2B-YS3303C
Idec
ROTARY SWITCH;
MMBT2907ALT1G
Onsemi
MMBT2907ALT1G by Onsemi is a PNP BJT transistor with 100 min hFE, 60V VCEO, and 200MHz fT. Ideal for switching applications, it has a small outline package with Gull Wing terminals and can handle up to 0.6A of collector current.
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
LM107H/883
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
LM358MX
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM555CM
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
XC6SLX45-2FGG484I
Xilinx
Xilinx XC6SLX45-2FGG484I FPGA features 43661 logic cells, 3411 CLBs, and 316 inputs/outputs. Operating at a max frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. With a wide temperature range from -40 to 100°C and low power consumption at 1.2V, this FPGA offers versatile programmability for various electronic systems.
EP3C10E144I7N
Intel
Intel's EP3C10E144I7N FPGA boasts 10320 logic cells, 94 inputs/outputs, and a clock frequency of 472.5 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a max operating temperature of 100°C.
EP3C10F256C8N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: RECTANGULAR;
10M08DAF256I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 8000;
10M08DCF256I7G
The Intel 10M08DCF256I7G is an FPGA with 8000 logic cells, 500 CLBs, and 250 inputs/outputs. It operates at a voltage range of 1.15V to 1.25V and can withstand temperatures from -40°C to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.
A40MX04-PLG68I
Microchip Technology
A40MX04-PLG68I by Microchip Tech is a 3.6V FPGA with 547 CLBs, 6000 gates, and max clock freq of 80MHz. Ideal for industrial applications requiring high-speed processing in temp range -40 to 85°C. Features CMOS tech, J bend terminals, and square package shape.
EP3C55F484C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
EP3C10E144C8N
EP3C10E144C8N by Intel is a CMOS FPGA with 10320 logic cells and CLBs. Operating at 1.2V, it has a clock frequency of 472.5MHz. Ideal for applications requiring high-speed processing in compact designs like IoT devices and telecommunications equipment.
10CX150YF672E5G
Intel's 10CX150YF672E5G FPGA boasts 150,000 logic cells and 54770 CLBs. Operating at 0.93V max voltage, it offers TSMC technology with 236 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor.
5CGXFC7D6F31I7N
Intel's 5CGXFC7D6F31I7N FPGA features 150,000 logic cells and 5648 CLBs. With a max supply voltage of 1.13V, it is ideal for applications requiring high-speed processing and programmable ICs in various industries. The package body material is plastic/epoxy with a square shape and grid array style, making it suitable for surface mount installations with a pitch of 1mm.
XC7A15T-1CPG236I
Xilinx XC7A15T-1CPG236I is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and low profile, it offers versatility in various electronic designs.
10M04SAU169I7G
Intel 10M04SAU169I7G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. Ideal for industrial applications requiring a programmable IC with a supply voltage range of 2.85V to 3.15V and operating temperatures from -40°C to 100°C.
EP3C16F256C8N
10M50DAF256I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
XC7S6-1FTGB196C
The Xilinx XC7S6-1FTGB196C is a FPGA with 6000 logic cells, 469 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
M2GL025TS-1FGG484I
M2GL025TS-1FGG484I by Microchip Technology is a 27696 logic cell FPGA with 267 inputs/outputs. Operating at 1.2V, it has a temperature range of -40 to 100°C and comes in a square grid array package suitable for industrial applications.
LCMXO2-256ZE-1TG100C
Lattice Semiconductor
LCMXO2-256ZE-1TG100C by Lattice Semiconductor is a 256 logic cell FPGA with 55 inputs/outputs, operating at 1.2V. It comes in a square package with gull wing terminals, suitable for applications requiring low-profile, fine-pitch ICs like consumer electronics and industrial automation.
EP2C8T144C8N
EP2C8T144C8N by Intel is a FPGA with 8256 logic cells, 516 CLBs, and max clock frequency of 402.5 MHz. It operates at temperatures from 0 to 85 °C and has a package style of flatpack, low profile, fine pitch. Ideal for applications requiring high-speed processing and programmable logic in compact form factors.
LCMXO2-7000HC-4TG144I
LCMXO2-7000HC-4TG144I by Lattice Semiconductor is a FPGA with 6864 logic cells, 114 inputs/outputs, and operates at 2.5V nominal voltage. Ideal for applications requiring high-density programmable ICs in compact spaces with operating temperatures ranging from -40 to 100°C.
10CX150YF780I5G
Intel's 10CX150YF780I5G FPGA boasts 150,000 logic cells and 54770 CLBs. Operating at -40 to 100 °C, it has 284 inputs/outputs for industrial applications. Utilizes TSMC tech with 0.87-0.93 V supply voltage range in a grid array package.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCV300-6FGG456C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;
XCV300-5FG456C
XCV300-4CSG144C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; No. of Equivalent Gates: 322970; Nominal Supply Voltage (V): 2.5; Maximum Operating Temperature: 85 Cel; JESD-609 Code: e1;
XCV300-4BG432C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE;
XCV300-4BGG352C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE;
XCV300-4CS144C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Qualification: Not Qualified; Minimum Supply Voltage: 2.375 V; JESD-609 Code: e0; Finishing Of Terminal Used: TIN LEAD;
XCV300-4BGG256C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XCV300-4CSG144I
FIELD PROGRAMMABLE GATE ARRAY; No. of CLBs: 1536; Technology Used: CMOS; Nominal Supply Voltage (V): 2.5; Minimum Supply Voltage: 2.375 V; Qualification: Not Qualified;
XCV300-4BG256I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .6 ns;
XCV300-4BGG352I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
XCV300-4BG432I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .8 ns;
XCV300-4BGG432C
XCV300-4BGG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Maximum Seated Height: 1.7 mm;
XCV300-4BG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCV300-4CS144I
FIELD PROGRAMMABLE GATE ARRAY; Technology Used: CMOS; Qualification: Not Qualified; Organization: 1536 CLBS, 322970 GATES; Minimum Supply Voltage: 2.375 V; Nominal Supply Voltage (V): 2.5;
XCV300-4BG352I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE;
XCV300-4BGG432I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE; Width: 40 mm;
XCV300-4BGG256I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCV300-4BG256C
XCV300-4BG352C
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